Diodes Incorporated DMN31D5UFZQ-7B
- Part No.:
- DMN31D5UFZQ-7B
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 3-XFDFN
- Datasheet:
-
DMN31D5UFZQ-7B.pdf
- Description:
- MOSFET BVDSS: 25V~30V X2-DFN0606
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
DMN31D5UFZQ-7B from Diodes Incorporated is an AEC-Q101 qualified N-channel enhancement-mode MOSFET in a 0.62 mm × 0.62 mm X2-DFN0606-3 package, rated for 30 V VDSS, 1.5 Ω RDS(ON) at VGS = 4.5 V, 0.41 A continuous drain current, and 1.0 V max gate threshold voltage - optimized for low-voltage, space-constrained power switching in automotive body electronics and portable power management.
For engineers reviewing the DMN31D5UFZQ-7B datasheet, DMN31D5UFZQ-7B pinout, DMN31D5UFZQ-7B application, or DMN31D5UFZQ-7B equivalent, key selection criteria include ultra-low VGS(TH) for 1.8 V logic compatibility, sub-1.6 Ω on-resistance at 2.5 V drive, 0.4 mm max profile for thin PCBs, ESD-protected gate, and AEC-Q101 qualification for automotive-grade reliability.
Technical Context
This MOSFET employs a trench-gate silicon process to achieve low RDS(ON) while maintaining fast switching (tD(ON) = 3.2 ns, tF = 7.5 ns) and low gate charge (Qg = 0.38 nC), enabling efficient operation in high-frequency DC-DC load switches and battery protection circuits. Its 1.0 V max VGS(TH) ensures reliable turn-on with 1.8 V and 2.5 V microcontroller I/O.
The device integrates a body diode with VSD = 0.54 V (typ.) at IS = 10 mA and exhibits normalized RDS(ON) variation of ≤1.3× across −55°C to +150°C, supporting stable performance in automotive under-hood and infotainment environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - supports 24 V automotive systems with 20 % margin against transients |
| RDS(ON) @ VGS = 4.5 V | 1.5 Ω max - enables <100 mW conduction loss at 0.4 A, critical for thermally constrained modules |
| VGS(TH) | 1.0 V max - guarantees full enhancement with 1.8 V logic, eliminating level-shifter need |
| ID (TA = 25°C) | 0.41 A - sufficient for LED drivers, sensor biasing, and low-power load switching |
| Qg | 0.38 nC - reduces gate drive power and enables >1 MHz switching in compact regulators |
| RθJA | 315 °C/W - requires minimal copper area (FR-4, min pad layout) for thermal compliance |
| Package | X2-DFN0606-3 - 0.62 mm × 0.62 mm footprint, 0.4 mm max height, ideal for ultra-thin wearables and ADAS modules |
Pinout & Package
Package: X2-DFN0606-3, 3-terminal leadless plastic DFN with exposed drain pad (pin 3). Dimensions: 0.62 mm × 0.62 mm × 0.4 mm max. Terminals: NiPdAu over copper leadframe, solderable per MIL-STD-202.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Source) | Source terminal | Connected to system ground or low-side return path; electrically tied to exposed drain pad via internal substrate |
| 2 (Gate) | Control input | Accepts 1.5–12 V logic-level signals; ESD-protected (HBM >2 kV); low Ciss = 22.6 pF minimizes drive burden |
| 3 (Drain) | Power output | Exposed thermal pad - must be soldered to PCB copper for thermal and electrical connection; carries full load current |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low gate threshold | VGS(TH) ≤ 1.0 V ensures robust turn-on with 1.8 V I/O without external biasing |
| Low-profile packaging | 0.4 mm max height enables integration into <0.6 mm total board thickness designs (e.g., smart sensors) |
| Automotive qualification | AEC-Q101 qualified, PPAP-capable, manufactured in IATF 16949 facilities - meets Tier-1 supply chain requirements |
| ESD-hardened gate | Integrated ESD protection (e4 marking) eliminates need for external TVS in most low-energy interfaces |
| Green compound | Halogen- and antimony-free (<900 ppm Br/Cl, <1000 ppm Sb), RoHS 3 compliant - satisfies EU automotive ELV directive |
Applications
| Automotive Interior Lighting | Portable Medical Sensor Biasing |
|---|---|
|
Use Scenario: Driving white LEDs in door handle illumination and ambient lighting modules where space and thermal headroom are limited. IC Role / Device Role / Timing Role: Low-side load switch controlling LED current path; operates in DC or PWM mode up to 10 kHz. Use Value: 1.5 Ω RDS(ON) limits voltage drop to <0.6 V at 400 mA, preserving forward voltage margin for dimming control. |
Use Scenario: Enabling/disabling analog front-end bias rails in wearable ECG and SpO₂ sensors powered by coin cells. IC Role / Device Role / Timing Role: Precision power gating element with <100 nA IDSS leakage to extend battery life during sleep mode. Use Value: 1.0 V VGS(TH) allows direct control from 1.8 V MCU GPIO, eliminating quiescent current of level-shifters. |
| USB-C Port Power Switching | Industrial IoT Node Load Management |
|
Use Scenario: Controlling VBUS delivery in USB-C receptacles for host-side port power management in docking stations. IC Role / Device Role / Timing Role: High-side or low-side switch managing 5 V/3 A power path; coordinated with USB PD controller. Use Value: 0.38 nC Qg enables fast turn-on (<10 ns) for dynamic port enable/disable without bus glitching. |
Use Scenario: Isolating RF transceiver and MCU subsystems during deep-sleep cycles in battery-powered LPWAN gateways. IC Role / Device Role / Timing Role: Standby power switch with <100 nA off-state leakage, controlled by RTC wake signal. Use Value: 315 °C/W RθJA and 0.4 W PD rating allow safe operation on 2-layer PCBs without heatsinks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-voltage N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3026LFG-7 | RDS(ON) = 2.2 Ω @ VGS = 2.5 V; VGS(TH) = 1.2 V max; same X2-DFN0606-3 package | Higher threshold and on-resistance - less suitable for 1.8 V logic but offers higher VDSS (30 V) margin | Select when tighter VGS(TH) distribution or lower leakage is prioritized over absolute RDS(ON) minimum |
| AO3414 | RDS(ON) = 5.5 Ω @ VGS = 2.5 V; VGS(TH) = 1.5 V max; SOT-23 package (larger footprint, higher RθJA) | Higher thermal resistance (350 °C/W) and larger 2.9 mm × 1.3 mm footprint - unsuitable for ultra-compact layouts | Choose only if legacy SOT-23 board space exists and 1.8 V drive compatibility is not required |
Compared with DMN3026LFG-7 and AO3414, the DMN31D5UFZQ-7B delivers the lowest VGS(TH) and best RDS(ON) at 1.8–2.5 V drive, combined with the smallest footprint and automotive qualification - making it optimal for next-gen space- and voltage-constrained automotive and portable electronics.
Availability
DMN31D5UFZQ-7B is available at Aetrix Electronics and suitable for automotive interior lighting, portable medical sensor biasing, USB-C port power switching, and industrial IoT node load management requiring stable component supply, AEC-Q101 compliance, and consistent lead-free sourcing.
Supply support for DMN31D5UFZQ-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.
The DMN31D5UFZQ-7B belongs to Diodes' Automotive-Grade Small-Signal MOSFET product line, engineered specifically for low-voltage, high-reliability power switching in space-constrained automotive and portable electronic systems.
FAQ
Is DMN31D5UFZQ-7B suitable for high-frequency PWM switching above 500 kHz?
Yes - with Qg = 0.38 nC, Ciss = 22.6 pF, and tF = 7.5 ns, the DMN31D5UFZQ-7B supports clean switching up to 2 MHz in properly laid-out PCBs using 2 Ω gate resistors. Its low RDS(ON) minimizes conduction loss, while fast turn-off delay (tD(OFF) = 21 ns) prevents shoot-through in half-bridge configurations.
What is the recommended PCB pad layout for thermal performance?
Use the manufacturer-specified X2-DFN0606-3 pad layout: 0.35 mm × 0.28 mm solder mask opening, 0.35 mm × 0.76 mm copper pad, with ≥4 thermal vias (0.3 mm diameter, 0.8 mm pitch) connecting the exposed drain pad to inner-layer ground planes. This achieves near-datasheet RθJA = 315 °C/W on 2-layer FR-4.
Does the device require external gate pull-down resistors in automotive applications?
No - the device's guaranteed VGS(TH) ≤ 1.0 V and low IGSS (±10 μA) ensure stable off-state behavior without external pull-downs. However, a 100 kΩ resistor is recommended in noisy CAN/LIN environments to suppress EMI-induced false turn-on during EMC testing.
How does the RDS(ON) change over temperature in automotive operating range?
RDS(ON) increases by ≤30 % from −40°C to +125°C at VGS = 4.5 V (Figure 5), remaining below 2.0 Ω across the full AEC-Q101 temperature range. At VGS = 2.5 V, normalized RDS(ON) rises to 1.25× at 125°C (Figure 6), confirming stable operation in engine bay and cabin environments.
DMN31D5UFZQ-7B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 3-XFDFN
- Packaging:
- Bulk
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 410mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.5V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 1.5Ohm @ 100mA, 4.5V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 0.38 nC @ 4.5 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 22.6 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 400mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN0606-3
DMN31D5UFZQ-7B FAQ
1.How can I place an order for DMN31D5UFZQ-7B through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN31D5UFZQ-7B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN31D5UFZQ-7B reliable?
The price and inventory of DMN31D5UFZQ-7B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN31D5UFZQ-7B is usually 5 days.
3.What payment methods are accepted for DMN31D5UFZQ-7B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN31D5UFZQ-7B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN31D5UFZQ-7B?
DMN31D5UFZQ-7B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN31D5UFZQ-7B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN31D5UFZQ-7B?
For technical support, including DMN31D5UFZQ-7B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN31D5UFZQ-7B requirements.
6.How does Aetrix verify that DMN31D5UFZQ-7B is sourced from the original manufacturer or authorized distributors?
All DMN31D5UFZQ-7B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN31D5UFZQ-7B meets industry standards.
7.What is the process for return or replacement of DMN31D5UFZQ-7B?
All DMN31D5UFZQ-7B units undergo pre-shipment inspection (PSI). If there is an issue with DMN31D5UFZQ-7B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN31D5UFZQ-7B part is unused and in its original packaging.
Return procedure for DMN31D5UFZQ-7B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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