Diodes Incorporated DMN32D0LFB4-7B
- Part No.:
- DMN32D0LFB4-7B
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 3-XFDFN
- Datasheet:
-
DMN32D0LFB4-7B.pdf
- Description:
- MOSFET BVDSS: 25V-30V X2-DFN1006
- Quantity:
- Payment:

- Shipping:

Inventory:4,858
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Product details
Overview
DMN32D0LFB4-7B from Diodes Incorporated is an N-channel enhancement-mode MOSFET optimized for low-voltage load switching in space-constrained portable electronics. It delivers 1.2 Ω RDS(ON) at VGS = 4.5 V, 440 mA continuous drain current, and a low 0.6–1.2 V gate threshold voltage - enabling direct drive from 1.8 V and 2.5 V logic rails in battery-powered USB peripherals and sensor modules.
For engineers reviewing the DMN32D0LFB4-7B datasheet, DMN32D0LFB4-7B pinout, DMN32D0LFB4-7B application, or DMN32D0LFB4-7B equivalent, key selection criteria include its ultra-small X2-DFN1006-3 package (1.0 × 0.6 mm), sub-1 nC total gate charge, and guaranteed RDS(ON) performance down to VGS = 1.8 V - critical for low-power always-on circuitry and power-gating in wearables and IoT edge nodes.
Technical Context
This MOSFET operates as a single N-channel load switch with source-connected substrate, supporting unidirectional current flow from drain to source. Its low 0.6 V typical VGS(TH) and 44.8 pF Ciss enable fast turn-on (<3.4 ns delay) and minimal drive power, while the integrated gate protection diode guards against ESD events up to ±2 kV HBM.
The device is rated for 30 V VDSS, 350 mW power dissipation at TA = +25°C, and operates across –55°C to +150°C. Thermal resistance RθJA is 357°C/W on FR-4 with minimum pad layout - confirming suitability for thermally isolated, low-duty-cycle switching rather than continuous high-current conduction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - Maximum blocking voltage before avalanche; supports 24 V rail derating and USB PD 3.0 auxiliary power paths. |
| RDS(ON) | 1.2 Ω @ VGS = 4.5 V - Ensures <530 mW conduction loss at 440 mA, suitable for intermittent load control without heatsinking. |
| VGS(TH) | 0.6–1.2 V - Enables reliable turn-on from 1.8 V I/O domains, eliminating need for level shifters in microcontroller-based power sequencing. |
| Ciss | 44.8 pF - Low input capacitance reduces gate drive energy and speeds switching in battery-sensitive applications. |
| Qg | 0.6 nC - Minimizes gate driver current demand and transition time, critical for low-noise, low-EMI power gating. |
| TJ Range | –55°C to +150°C - Validated operation across automotive cabin, industrial sensor, and outdoor IoT temperature extremes. |
Pinout & Package
Package: X2-DFN1006-3 - ultra-compact 1.0 mm × 0.6 mm, 0.4 mm pitch, 3-terminal leadless plastic package with NiPdAu-plated copper leadframe and UL 94V-0 molding compound.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (D) | High-side current path terminal | Connected to input supply rail; handles full load current and must be routed with adequate copper area for thermal relief. |
| Source (S) | Return path and substrate reference | Internally tied to body; forms common reference for gate drive and must be connected directly to ground plane for stable threshold behavior. |
| Gate (G) | Control electrode | Receives logic-level voltage; requires no external pull-down due to low leakage (<10 µA), but benefits from local RC filter for noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low gate threshold | VGS(TH) as low as 0.6 V enables direct interface with 1.8 V microcontrollers without level translation. |
| Low RDS(ON) at low VGS | 1.5 Ω @ VGS = 2.5 V ensures efficient operation in 2.5–3.3 V systems like BLE modules and PMIC sequencers. |
| Minimal gate charge | 0.6 nC Qg reduces switching losses and allows use of weak GPIOs for low-frequency power gating. |
| ESD-protected structure | Integrated gate protection diode rated to ±2 kV HBM prevents latch-up during board handling and system integration. |
| Green, halogen-free packaging | Meets RoHS 3, JEDEC MSL Level 1, and Diodes' "Green" standard (<900 ppm Br+Cl, <1000 ppm Sb). |
Applications
| USB Type-C Port Power Switching | IoT Sensor Node Power Gating |
|---|---|
Use Scenario: Enabling/disabling VBUS power to downstream USB peripherals during sleep mode or fault isolation. IC Role / Device Role / Timing Role: Low-side load switch controlling 5 V/3.3 V bus power with <10 µs response time and zero static current draw in OFF state. Use Value: Eliminates need for discrete level shifters and reduces standby power by >95% versus linear regulators in always-on USB host controllers. |
Use Scenario: Isolating MEMS sensors and RF transceivers from main battery during deep-sleep cycles in LPWAN endpoints. IC Role / Device Role / Timing Role: High-efficiency power gate activated by MCU GPIO to cut off 200–400 mA sensor subsystems with <1 µA leakage. Use Value: Extends coin-cell battery life from 6 to >24 months by reducing quiescent current in multi-sensor edge devices. |
| Wearable Display Backlight Control | Industrial PLC Digital Input Protection |
Use Scenario: PWM-driven current limiting for OLED or microLED display segments in smartwatches and AR glasses. IC Role / Device Role / Timing Role: Fast-switching N-channel switch operating at 1–5 kHz PWM frequency with <10 ns rise/fall times. Use Value: Delivers precise brightness control without audible coil whine or thermal throttling in sub-10 mm² wearable form factors. |
Use Scenario: Protecting 24 V digital input channels from reverse polarity, overvoltage transients, and hot-plug surges in modular I/O modules. IC Role / Device Role / Timing Role: Reverse-polarity protection switch placed upstream of optocoupler inputs with 30 V clamping capability. Use Value: Replaces discrete diode+resistor networks, reducing BOM count by 3 parts per channel and improving surge immunity per IEC 61000-4-4. |
Availability
DMN32D0LFB4-7B is available at Aetrix Electronics and suitable for USB power delivery, wearable sensor management, and industrial digital input protection requiring stable component supply and long-term production continuity.
Supply support for DMN32D0LFB4-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, low-power, and space-efficient components for consumer, industrial, and automotive markets.
The DMN32D0LFB4-7B belongs to Diodes' X2-DFN ultra-miniature MOSFET product line, engineered specifically for load switching in footprint-constrained, battery-operated electronics where gate drive simplicity and thermal efficiency are prioritized over high-current capability.
FAQ
Is DMN32D0LFB4-7B suitable for bidirectional current flow?
No. The DMN32D0LFB4-7B is an N-channel enhancement-mode MOSFET with a parasitic body diode oriented from source to drain. It conducts current unidirectionally when used as a low-side switch (source grounded). Bidirectional operation would require external circuitry or a back-to-back configuration, which is not supported by this single-device topology.
What is the maximum recommended PCB pad size for thermal performance?
Per Diodes' recommended layout for X2-DFN1006-3, the drain pad should extend beyond the package outline by ≥0.2 mm on all sides, using 2 oz copper with thermal vias (≥4×0.3 mm diameter) spaced ≤1 mm apart under the drain pad. This achieves the specified 357°C/W RθJA on FR-4; smaller pads increase junction temperature by up to 40°C at full rated current.
Can DMN32D0LFB4-7B replace a P-channel MOSFET in high-side switching?
No. As an N-channel device, DMN32D0LFB4-7B cannot function as a standalone high-side switch without a gate voltage higher than the source (i.e., a charge pump or bootstrap circuit). Its design intent is low-side or floating-ground configurations - attempting high-side use without gate boosting results in incomplete turn-on and excessive conduction loss.
Does this part have AEC-Q200 qualification for automotive use?
No. DMN32D0LFB4-7B is not AEC-Q200 qualified. While it operates across –55°C to +150°C and meets JEDEC moisture sensitivity Level 1, Diodes Incorporated does not list it in their AEC-Q200 automotive-grade portfolio. For automotive infotainment or body electronics, consider the AEC-Q200 qualified DMN32D0LH-7 as a functionally similar alternative with identical package and RDS(ON) specs.
DMN32D0LFB4-7B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 3-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 440mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 2.5V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 1.2Ohm @ 100mA, 4V
- Vgs(th) (Max) @ Id:
- 1.2V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 0.6 nC @ 4.5 V
- Vgs (Max):
- ±10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 44.8 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 350mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN1006-3
DMN32D0LFB4-7B FAQ
1.How can I place an order for DMN32D0LFB4-7B through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN32D0LFB4-7B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN32D0LFB4-7B reliable?
The price and inventory of DMN32D0LFB4-7B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN32D0LFB4-7B is usually 5 days.
3.What payment methods are accepted for DMN32D0LFB4-7B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN32D0LFB4-7B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN32D0LFB4-7B?
DMN32D0LFB4-7B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN32D0LFB4-7B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN32D0LFB4-7B?
For technical support, including DMN32D0LFB4-7B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN32D0LFB4-7B requirements.
6.How does Aetrix verify that DMN32D0LFB4-7B is sourced from the original manufacturer or authorized distributors?
All DMN32D0LFB4-7B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN32D0LFB4-7B meets industry standards.
7.What is the process for return or replacement of DMN32D0LFB4-7B?
All DMN32D0LFB4-7B units undergo pre-shipment inspection (PSI). If there is an issue with DMN32D0LFB4-7B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN32D0LFB4-7B part is unused and in its original packaging.
Return procedure for DMN32D0LFB4-7B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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