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Diodes Incorporated DMN32D0LFB4-7B

Part No.:
DMN32D0LFB4-7B
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
3-XFDFN
Datasheet:
AetrixDMN32D0LFB4-7B.pdf
Description:
MOSFET BVDSS: 25V-30V X2-DFN1006
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,858

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Product details

Overview

DMN32D0LFB4-7B from Diodes Incorporated is an N-channel enhancement-mode MOSFET optimized for low-voltage load switching in space-constrained portable electronics. It delivers 1.2 Ω RDS(ON) at VGS = 4.5 V, 440 mA continuous drain current, and a low 0.6–1.2 V gate threshold voltage - enabling direct drive from 1.8 V and 2.5 V logic rails in battery-powered USB peripherals and sensor modules.

For engineers reviewing the DMN32D0LFB4-7B datasheet, DMN32D0LFB4-7B pinout, DMN32D0LFB4-7B application, or DMN32D0LFB4-7B equivalent, key selection criteria include its ultra-small X2-DFN1006-3 package (1.0 × 0.6 mm), sub-1 nC total gate charge, and guaranteed RDS(ON) performance down to VGS = 1.8 V - critical for low-power always-on circuitry and power-gating in wearables and IoT edge nodes.

Technical Context

This MOSFET operates as a single N-channel load switch with source-connected substrate, supporting unidirectional current flow from drain to source. Its low 0.6 V typical VGS(TH) and 44.8 pF Ciss enable fast turn-on (<3.4 ns delay) and minimal drive power, while the integrated gate protection diode guards against ESD events up to ±2 kV HBM.

The device is rated for 30 V VDSS, 350 mW power dissipation at TA = +25°C, and operates across –55°C to +150°C. Thermal resistance RθJA is 357°C/W on FR-4 with minimum pad layout - confirming suitability for thermally isolated, low-duty-cycle switching rather than continuous high-current conduction.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 30 V - Maximum blocking voltage before avalanche; supports 24 V rail derating and USB PD 3.0 auxiliary power paths.
RDS(ON) 1.2 Ω @ VGS = 4.5 V - Ensures <530 mW conduction loss at 440 mA, suitable for intermittent load control without heatsinking.
VGS(TH) 0.6–1.2 V - Enables reliable turn-on from 1.8 V I/O domains, eliminating need for level shifters in microcontroller-based power sequencing.
Ciss 44.8 pF - Low input capacitance reduces gate drive energy and speeds switching in battery-sensitive applications.
Qg 0.6 nC - Minimizes gate driver current demand and transition time, critical for low-noise, low-EMI power gating.
TJ Range –55°C to +150°C - Validated operation across automotive cabin, industrial sensor, and outdoor IoT temperature extremes.

Pinout & Package

Package: X2-DFN1006-3 - ultra-compact 1.0 mm × 0.6 mm, 0.4 mm pitch, 3-terminal leadless plastic package with NiPdAu-plated copper leadframe and UL 94V-0 molding compound.

Pin/Terminal Circuit Role Design Meaning
Drain (D) High-side current path terminal Connected to input supply rail; handles full load current and must be routed with adequate copper area for thermal relief.
Source (S) Return path and substrate reference Internally tied to body; forms common reference for gate drive and must be connected directly to ground plane for stable threshold behavior.
Gate (G) Control electrode Receives logic-level voltage; requires no external pull-down due to low leakage (<10 µA), but benefits from local RC filter for noise immunity.

Key Features

Feature Design Value
Ultra-low gate threshold VGS(TH) as low as 0.6 V enables direct interface with 1.8 V microcontrollers without level translation.
Low RDS(ON) at low VGS 1.5 Ω @ VGS = 2.5 V ensures efficient operation in 2.5–3.3 V systems like BLE modules and PMIC sequencers.
Minimal gate charge 0.6 nC Qg reduces switching losses and allows use of weak GPIOs for low-frequency power gating.
ESD-protected structure Integrated gate protection diode rated to ±2 kV HBM prevents latch-up during board handling and system integration.
Green, halogen-free packaging Meets RoHS 3, JEDEC MSL Level 1, and Diodes' "Green" standard (<900 ppm Br+Cl, <1000 ppm Sb).

Applications

USB Type-C Port Power Switching IoT Sensor Node Power Gating

Use Scenario: Enabling/disabling VBUS power to downstream USB peripherals during sleep mode or fault isolation.

IC Role / Device Role / Timing Role: Low-side load switch controlling 5 V/3.3 V bus power with <10 µs response time and zero static current draw in OFF state.

Use Value: Eliminates need for discrete level shifters and reduces standby power by >95% versus linear regulators in always-on USB host controllers.

Use Scenario: Isolating MEMS sensors and RF transceivers from main battery during deep-sleep cycles in LPWAN endpoints.

IC Role / Device Role / Timing Role: High-efficiency power gate activated by MCU GPIO to cut off 200–400 mA sensor subsystems with <1 µA leakage.

Use Value: Extends coin-cell battery life from 6 to >24 months by reducing quiescent current in multi-sensor edge devices.

Wearable Display Backlight Control Industrial PLC Digital Input Protection

Use Scenario: PWM-driven current limiting for OLED or microLED display segments in smartwatches and AR glasses.

IC Role / Device Role / Timing Role: Fast-switching N-channel switch operating at 1–5 kHz PWM frequency with <10 ns rise/fall times.

Use Value: Delivers precise brightness control without audible coil whine or thermal throttling in sub-10 mm² wearable form factors.

Use Scenario: Protecting 24 V digital input channels from reverse polarity, overvoltage transients, and hot-plug surges in modular I/O modules.

IC Role / Device Role / Timing Role: Reverse-polarity protection switch placed upstream of optocoupler inputs with 30 V clamping capability.

Use Value: Replaces discrete diode+resistor networks, reducing BOM count by 3 parts per channel and improving surge immunity per IEC 61000-4-4.

Availability

DMN32D0LFB4-7B is available at Aetrix Electronics and suitable for USB power delivery, wearable sensor management, and industrial digital input protection requiring stable component supply and long-term production continuity.

Supply support for DMN32D0LFB4-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, low-power, and space-efficient components for consumer, industrial, and automotive markets.

The DMN32D0LFB4-7B belongs to Diodes' X2-DFN ultra-miniature MOSFET product line, engineered specifically for load switching in footprint-constrained, battery-operated electronics where gate drive simplicity and thermal efficiency are prioritized over high-current capability.

FAQ

Is DMN32D0LFB4-7B suitable for bidirectional current flow?

No. The DMN32D0LFB4-7B is an N-channel enhancement-mode MOSFET with a parasitic body diode oriented from source to drain. It conducts current unidirectionally when used as a low-side switch (source grounded). Bidirectional operation would require external circuitry or a back-to-back configuration, which is not supported by this single-device topology.

What is the maximum recommended PCB pad size for thermal performance?

Per Diodes' recommended layout for X2-DFN1006-3, the drain pad should extend beyond the package outline by ≥0.2 mm on all sides, using 2 oz copper with thermal vias (≥4×0.3 mm diameter) spaced ≤1 mm apart under the drain pad. This achieves the specified 357°C/W RθJA on FR-4; smaller pads increase junction temperature by up to 40°C at full rated current.

Can DMN32D0LFB4-7B replace a P-channel MOSFET in high-side switching?

No. As an N-channel device, DMN32D0LFB4-7B cannot function as a standalone high-side switch without a gate voltage higher than the source (i.e., a charge pump or bootstrap circuit). Its design intent is low-side or floating-ground configurations - attempting high-side use without gate boosting results in incomplete turn-on and excessive conduction loss.

Does this part have AEC-Q200 qualification for automotive use?

No. DMN32D0LFB4-7B is not AEC-Q200 qualified. While it operates across –55°C to +150°C and meets JEDEC moisture sensitivity Level 1, Diodes Incorporated does not list it in their AEC-Q200 automotive-grade portfolio. For automotive infotainment or body electronics, consider the AEC-Q200 qualified DMN32D0LH-7 as a functionally similar alternative with identical package and RDS(ON) specs.

DMN32D0LFB4-7B Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
3-XFDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
440mA (Ta)
Drive Voltage (Max Rds On, Min Rds On):
1.8V, 2.5V, 4.5V
Rds On (Max) @ Id, Vgs:
1.2Ohm @ 100mA, 4V
Vgs(th) (Max) @ Id:
1.2V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
0.6 nC @ 4.5 V
Vgs (Max):
±10V
Input Capacitance (Ciss) (Max) @ Vds:
44.8 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
350mW (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
X2-DFN1006-3

DMN32D0LFB4-7B FAQ

1.How can I place an order for DMN32D0LFB4-7B through Aetrix?

Please submit a Request for Quotation (RFQ) for DMN32D0LFB4-7B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMN32D0LFB4-7B reliable?

The price and inventory of DMN32D0LFB4-7B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN32D0LFB4-7B is usually 5 days.

3.What payment methods are accepted for DMN32D0LFB4-7B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN32D0LFB4-7B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMN32D0LFB4-7B?

DMN32D0LFB4-7B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMN32D0LFB4-7B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMN32D0LFB4-7B?

For technical support, including DMN32D0LFB4-7B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN32D0LFB4-7B requirements.

6.How does Aetrix verify that DMN32D0LFB4-7B is sourced from the original manufacturer or authorized distributors?

All DMN32D0LFB4-7B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN32D0LFB4-7B meets industry standards.

7.What is the process for return or replacement of DMN32D0LFB4-7B?

All DMN32D0LFB4-7B units undergo pre-shipment inspection (PSI). If there is an issue with DMN32D0LFB4-7B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMN32D0LFB4-7B part is unused and in its original packaging.

Return procedure for DMN32D0LFB4-7B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMN32D0LFB4-7B Tags

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