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Diodes Incorporated DMN33D9LV-7

Part No.:
DMN33D9LV-7
Manufacturer:
Diodes Incorporated
Category:
FET, MOSFET Arrays
Package:
SOT-563, SOT-666
Datasheet:
AetrixDMN33D9LV-7.pdf
Description:
MOSFET 2N-CH 30V 0.35A SOT563
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,960

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Product details

Overview

DMN33D9LV-7 from Diodes Incorporated is a dual N-channel enhancement-mode MOSFET in SOT563 package, rated for 30V VDSS, 3Ω RDS(ON) @ 4.5V VGS, and 350mA continuous drain current at +25°C - optimized for low-voltage DC-DC converters and backlighting circuits where space-constrained dual-switch operation is required.

For engineers reviewing the DMN33D9LV-7 datasheet, DMN33D9LV-7 pinout, DMN33D9LV-7 application, or DMN33D9LV-7 equivalent, key selection criteria include verified dual-channel RDS(ON) matching at low gate drive (2.5–4.5V), ESD-protected gate terminals, and thermal performance under FR-4 PCB mounting with 2oz copper.

Technical Context

This device integrates two independent N-channel MOSFETs sharing no internal connection - each channel exhibits identical threshold voltage (0.8–1.4V) and on-resistance behavior across temperature (-55°C to +150°C). Gate charge is tightly controlled (Qg = 0.55nC @ 4.5V), enabling fast switching (tr = 2.6ns, tf = 13.6ns) with minimal drive power.

The SOT563 package provides six terminals with isolated source-drain-gate routing per channel, supporting high-density layout in portable power rails. Input capacitance (Ciss = 48pF) and reverse transfer capacitance (Crss = 8pF) are specified at VDS = 5V, ensuring predictable Miller effect in synchronous buck topologies.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS30V - supports input rails up to 24V nominal systems with margin for transients
RDS(ON) @ 4.5V3Ω max - enables ≥85% efficiency in 3.3V-output buck converters at 200mA load
RDS(ON) @ 2.5V7Ω max - ensures functional turn-on with logic-level microcontroller GPIO drive
ID (continuous)350mA @ +25°C - suitable for LED string current control or small motor gate drivers
Ciss48pF - limits gate drive current requirement to <1mA peak for 1MHz switching
RθJA288°C/W - requires minimum 2oz copper pad for sustained 200mW dissipation
ESD ratingHBM ±2kV - protects against handling damage during SMT assembly and board test

Pinout & Package

SOT563 is a 6-pin, surface-mount plastic package measuring 1.60 × 1.60 × 0.60 mm with gull-wing leads and matte tin finish over copper leadframe. Moisture sensitivity level is J-STD-020 Level 3.

Pin/TerminalCircuit RoleDesign Meaning
1 (S1)Source of Channel 1Low-side return path for first MOSFET; tied to local ground plane in half-bridge configuration
2 (G1)Gate of Channel 1Control terminal requiring 0.55nC total charge for full enhancement; ESD-protected
3 (D1)Drain of Channel 1Switched output node; rated for 30V blocking and 0.5A body diode conduction
4 (D2)Drain of Channel 2Independent high-side or low-side switch node; electrically isolated from D1
5 (G2)Gate of Channel 2Second independent control input; matched threshold and timing to G1
6 (S2)Source of Channel 2Separate return path enabling dual low-side switching or level-shifted high-side drive

Key Features

FeatureDesign Value
Dual independent N-channel topologyEnables compact dual-switch functions (e.g., dual LED drivers or H-bridge legs) without external isolation components
Low RDS(ON) at 2.5V VGS7Ω max allows direct interface with 2.5V/3.3V logic outputs without level-shifting circuitry
Fast switching (tON = 2.9ns)Reduces transition losses in >1MHz DC-DC controllers, improving light-load efficiency
ESD-protected gate±2kV HBM rating eliminates need for external gate protection in automated assembly lines
Green, halogen-free constructionMeets IEC 61249-2-21 and JEDEC JS709B standards for bromine/chlorine/antimony content

Applications

LED Backlight ControlUSB-C Power Path Switching

Use Scenario: Driving parallel white LED strings in portable displays using PWM dimming at 1–5kHz.

IC Role / Device Role / Timing Role: Dual low-side switch controlling cathode current paths; one channel per LED bank.

Use Value: 3Ω RDS(ON) minimizes forward-voltage drop and thermal rise at 200mA per string, extending battery life.

Use Scenario: Enabling/disabling 5V power delivery from USB-C port to system rail with reverse-current blocking.

IC Role / Device Role / Timing Role: Dual N-MOSFET used in back-to-back configuration for bidirectional blocking and low-loss conduction.

Use Value: Matched channel parameters ensure symmetrical on-resistance and prevent shoot-through during hot-plug events.

Small Motor Gate DriverLoad Switch for IoT Sensor Rails

Use Scenario: Driving gate of external P-channel high-side MOSFET in brushed DC motor H-bridge.

IC Role / Device Role / Timing Role: Low-side driver providing fast turn-on/turn-off of P-MOSFET gate with controlled slew rate.

Use Value: 0.55nC Qg reduces gate drive power by 40% vs. comparable 6-pin alternatives, easing MCU GPIO loading.

Use Scenario: Sequencing power to BLE/Wi-Fi sensor subsystems during sleep/wake transitions.

IC Role / Device Role / Timing Role: Dual independent load switches isolating 1.8V and 3.3V sensor domains from main SoC rail.

Use Value: Independent enable control per channel allows staggered power-up, reducing inrush current peaks by >60%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMN3026LSD-13Single-channel, 30V, 2.8Ω @ 4.5V, SOT23-6 packageRequires two devices for dual function; larger footprint (2.9 × 1.6 mm vs. 1.6 × 1.6 mm)Select when board layout permits discrete placement and higher RDS(ON) tolerance is acceptable
AO6401Dual N-channel, 30V, 4.5Ω @ 4.5V, SOT23-6 packageHigher RDS(ON) increases conduction loss by ~50% at 200mA; same pinout but different markingChoose only if cost sensitivity outweighs efficiency requirements in non-battery applications

Compared with DMN33D9LV-7, DMN3026LSD-13 offers lower on-resistance per channel but doubles PCB area and component count, while AO6401 sacrifices 50% conduction efficiency for marginal cost reduction - making DMN33D9LV-7 optimal for space- and efficiency-critical dual-switch designs.

Availability

DMN33D9LV-7 is available at Aetrix Electronics and suitable for LED backlighting, USB-C power path management, and low-power motor control applications requiring stable component supply and consistent parametric matching across production lots.

Supply support for DMN33D9LV-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

The DMN33D9LV-7 belongs to Diodes' low-voltage power MOSFET product line, engineered specifically for space-constrained, battery-powered systems demanding low gate-threshold operation and high thermal reliability in ultra-small packages.

FAQ

What is the maximum junction temperature and how does it affect continuous current rating?

The DMN33D9LV-7 has a rated operating junction temperature range of –55°C to +150°C. At +70°C ambient, its continuous drain current drops to 200mA due to thermal derating - confirmed by the 0.20W power dissipation limit and 288°C/W RθJA. This reflects real-world PCB thermal performance, not idealized heatsink conditions.

Can both channels be paralleled to increase current capacity?

No - the DMN33D9LV-7 channels are electrically isolated but not matched for current sharing. Parallel operation is not recommended due to parametric variation in VGS(TH) (0.8–1.4V) and RDS(ON), which causes unequal current division and potential thermal runaway above 250mA total load.

Is the SOT563 package compatible with standard reflow profiles for lead-free soldering?

Yes - the SOT563 package is qualified for IPC/JEDEC J-STD-020 Level 3 moisture sensitivity and supports peak reflow temperatures up to 260°C. Its matte tin annealed finish meets MIL-STD-202 Method 208 solderability requirements, ensuring reliable wetting on OSP- or ENIG-finished PCBs.

Does the device include integrated body diodes, and what are their forward characteristics?

Yes - each channel includes an intrinsic body diode with typical forward voltage of 0.8V at 115mA (VSD). The diode supports continuous forward current up to 0.5A and pulsed current up to 0.8A, enabling use in asynchronous DC-DC topologies and freewheeling paths without external diodes.

DMN33D9LV-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
SOT-563, SOT-666
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
2 N-Channel (Dual)
FET Feature:
-
Drain to Source Voltage (Vdss):
30V
Current - Continuous Drain (Id) @ 25°C:
350mA (Ta)
Rds On (Max) @ Id, Vgs:
2.4Ohm @ 250mA, 10V
Vgs(th) (Max) @ Id:
1.4V @ 100µA
Gate Charge (Qg) (Max) @ Vgs:
1.23nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds:
48pF @ 5V
Power - Max:
430mW (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SOT-563

DMN33D9LV-7 FAQ

1.How can I place an order for DMN33D9LV-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMN33D9LV-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMN33D9LV-7 reliable?

The price and inventory of DMN33D9LV-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN33D9LV-7 is usually 5 days.

3.What payment methods are accepted for DMN33D9LV-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN33D9LV-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMN33D9LV-7?

DMN33D9LV-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMN33D9LV-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMN33D9LV-7?

For technical support, including DMN33D9LV-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN33D9LV-7 requirements.

6.How does Aetrix verify that DMN33D9LV-7 is sourced from the original manufacturer or authorized distributors?

All DMN33D9LV-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN33D9LV-7 meets industry standards.

7.What is the process for return or replacement of DMN33D9LV-7?

All DMN33D9LV-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMN33D9LV-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMN33D9LV-7 part is unused and in its original packaging.

Return procedure for DMN33D9LV-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMN33D9LV-7 Tags

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