Diodes Incorporated DMN3732UFB4-7
- Part No.:
- DMN3732UFB4-7
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 3-XFDFN
- Datasheet:
-
DMN3732UFB4-7.pdf
- Description:
- MOSFET BVDSS: 25V~30V X2-DFN1006
- Quantity:
- Payment:

- Shipping:

Inventory:4,376
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Product details
Overview
DMN3732UFB4-7 from Diodes Incorporated is a 30V N-channel enhancement-mode MOSFET in X2-DFN1006-3 package, optimized for ultra-thin load switching with RDS(ON) = 460 mΩ @ VGS = 4.5V, ID = 1.3 A, and VGS(TH) as low as 0.45 V - enabling direct battery-level gate drive in portable power management circuits.
For engineers reviewing the DMN3732UFB4-7 datasheet, DMN3732UFB4-7 pinout, DMN3732UFB4-7 application, or DMN3732UFB4-7 equivalent, this device is selected for space-constrained, low-voltage DC load control where sub-1V threshold operation, 0.6 mm² footprint, and ESD-protected gate integrity are critical design requirements.
Technical Context
This MOSFET employs a trench-gate silicon process to achieve low RDS(ON) at VGS ≥ 1.8 V while maintaining fast switching (tr = 15.9 ns, tf = 20.0 ns) and low gate charge (Qg = 0.9 nC). Its body diode exhibits VSD = 0.7–1.2 V at IS = 300 mA and tRR = 59 ns under dI/dt = 100 A/μs.
The device operates across –55°C to +150°C junction temperature, with normalized RDS(ON) variation ≤ 1.8× over that range at VGS = 2.5 V. Thermal resistance is RθJA = 112 °C/W on minimum pad layout and 253 °C/W on standard FR-4 (2 oz Cu, 1″² copper).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - Maximum drain-source blocking voltage for 12 V/24 V rail protection and USB PD auxiliary switches. |
| RDS(ON) | 460 mΩ @ VGS = 4.5 V - Enables <1.3 A continuous conduction with <2.7 mW I²R loss at 1 A, critical for thermal budget in thin PCBs. |
| VGS(TH) | 0.45–0.95 V - Allows reliable turn-on from single-cell Li-ion (2.5–4.2 V) or coin-cell (3 V) without level-shifting circuitry. |
| Qg | 0.9 nC - Reduces gate drive power and enables use with low-current GPIOs (e.g., microcontroller pins driving ≤ 5 mA). |
| PD | 1.12 W (min pad layout) - Supports 1.1 A steady-state current at +70°C ambient when mounted per recommended footprint. |
| Ciss | 40.8 pF - Limits high-frequency gate oscillation risk and eases EMI filtering in compact DC-DC enable paths. |
| ESD Rating | HBM ±2 kV - Integrated gate protection eliminates need for external TVS in handheld device battery disconnect circuits. |
Pinout & Package
Package: X2-DFN1006-3 - 0.4 mm height, 1.0 × 0.6 mm outline, 0.35 mm pitch, NiPdAu-plated terminals, moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Source terminal (S) | Connected to system ground or low-side return path; exposed thermal pad tied to PCB ground plane for heat dissipation. |
| Pin 2 (Gate) | Control input (G) | Receives logic-level gate drive; low VGS(TH) allows direct MCU I/O connection without buffer stage. |
| Pin 3 (Drain) | Power output (D) | Switches load to supply rail; internal body diode anode connects to source, cathode to drain for reverse polarity protection. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low profile | 0.4 mm max height - fits under 0.5 mm connectors and within slim consumer wearables (e.g., TWS earbuds, smart bands). |
| Minimal footprint | 0.6 mm² area - 10× smaller than SOT-23, freeing PCB real estate for RF or sensor placement in space-limited modules. |
| Battery-direct drive | VGS(TH) ≤ 0.95 V - eliminates gate driver IC in single-cell Li-ion systems, reducing BOM count and standby current. |
| ESD-protected gate | HBM ±2 kV rating - withstands handling and board assembly without additional gate protection components. |
| Green compliance | Halogen-free, antimony-free, RoHS 3 compliant - meets IPC-1752A material declaration and automotive PPAP requirements. |
Applications
| Smartphone Power Sequencing | USB-C Port Protection |
|---|---|
|
Use Scenario: Controlled power-up of camera module, display backlight, or audio codec after system reset. IC Role / Device Role / Timing Role: Low-side load switch enabling precise sequencing via GPIO-controlled gate drive. Use Value: 0.45 V VGS(TH) ensures turn-on at battery voltages down to 2.8 V, preventing brown-out failures during cold start. |
Use Scenario: Reverse-current blocking and overcurrent isolation between USB-C receptacle and host SoC. IC Role / Device Role / Timing Role: High-speed load switch placed in VBUS path to prevent backfeed during hot-plug events. Use Value: 59 ns body diode reverse recovery time minimizes shoot-through risk during dynamic cable insertion/removal. |
| Wireless Earbud Battery Management | IoT Sensor Node Load Control |
|
Use Scenario: Enabling/disabling charging circuitry or Bluetooth radio based on battery state and user activity. IC Role / Device Role / Timing Role: Ultra-low-height power switch integrated into 4.5 mm tall earbud housing. Use Value: 0.4 mm package height avoids interference with speaker driver magnets and maintains mechanical clearance. |
Use Scenario: Cycling power to environmental sensors (e.g., humidity, CO₂) to extend 10-year battery life in LPWAN nodes. IC Role / Device Role / Timing Role: Low-leakage (IDSS ≤ 1 µA) switch isolating sensor supply during sleep mode. Use Value: 1 µA max IDSS reduces quiescent current by >90% versus discrete FET+resistor solutions, extending shelf life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN2004LK3-7 | RDS(ON) = 320 mΩ @ VGS = 4.5 V, but VGS(TH) = 0.6–1.2 V; larger X1-DFN1006-3 (0.5 mm height). | Higher threshold limits use below 2.8 V; taller profile restricts use in <0.45 mm assemblies. | Select when lower RDS(ON) outweighs height constraint and battery voltage remains ≥3.0 V. |
| AO3400A | RDS(ON) = 44 mΩ @ VGS = 10 V, but VGS(TH) = 0.8–1.8 V; SOT-23 package (1.45 mm height, 2.9 mm² area). | Requires gate boosting above 2.5 V; incompatible with ultra-thin form factors. | Choose only if higher current (>2 A) and legacy SMT compatibility are prioritized over size and low-VGS drive. |
Compared with DMN2004LK3-7 and AO3400A, DMN3732UFB4-7 uniquely balances sub-1V threshold, 0.4 mm height, and 0.6 mm² footprint - making it the sole option for battery-powered devices requiring both deep discharge operation and mechanical thickness <0.45 mm.
Availability
DMN3732UFB4-7 is available at Aetrix Electronics and suitable for smartphone power sequencing, USB-C port protection, and wireless earbud battery management requiring stable component supply across high-mix, low-volume production runs.
Supply support for DMN3732UFB4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in Taiwan and China.
This MOSFET belongs to Diodes' X2-DFN ultra-miniature power switch product line, engineered specifically for space- and power-constrained portable electronics where traditional SOT packages cannot meet mechanical or thermal targets.
FAQ
What is the maximum continuous drain current at +85°C ambient?
At TA = +85°C with the recommended minimum pad layout, DMN3732UFB4-7 supports 0.96 A continuous drain current. This value derives from its 1.12 W power dissipation rating and RθJA = 112 °C/W, ensuring safe operation without derating in thermally optimized wearable PCBs.
Can this MOSFET be used in reverse polarity protection circuits?
Yes - its intrinsic body diode conducts from source to drain when VDS < 0, allowing implementation of low-loss reverse polarity protection by placing the device in series with the positive rail. The 0.7–1.2 V forward drop at 300 mA and 59 ns reverse recovery time ensure minimal voltage loss and fast fault response.
Is the X2-DFN1006-3 package compatible with standard reflow profiles?
Yes - the package is qualified for IPC/JEDEC J-STD-020 Level 1 moisture sensitivity and supports standard lead-free reflow profiles (peak 260°C, 60 s above 217°C). Its NiPdAu finish ensures robust solderability per MIL-STD-202 Method 208, even after extended storage.
Does the device require external gate resistor for stability?
No external gate resistor is required for basic switching. With Qg = 0.9 nC and Ciss = 40.8 pF, the MOSFET turns on/off cleanly using typical MCU GPIO drivers (≤10 mA sink/source). A 10–47 Ω series resistor may be added only if ringing is observed on gate waveform during high-dV/dt noise environments.
DMN3732UFB4-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 3-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 1.3A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 460mOhm @ 200mA, 4.5V
- Vgs(th) (Max) @ Id:
- 950mV @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 0.9 nC @ 4.5 V
- Vgs (Max):
- ±8V
- Input Capacitance (Ciss) (Max) @ Vds:
- 40.8 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 490mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN1006-3
DMN3732UFB4-7 FAQ
1.How can I place an order for DMN3732UFB4-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN3732UFB4-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN3732UFB4-7 reliable?
The price and inventory of DMN3732UFB4-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN3732UFB4-7 is usually 5 days.
3.What payment methods are accepted for DMN3732UFB4-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN3732UFB4-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN3732UFB4-7?
DMN3732UFB4-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN3732UFB4-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN3732UFB4-7?
For technical support, including DMN3732UFB4-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN3732UFB4-7 requirements.
6.How does Aetrix verify that DMN3732UFB4-7 is sourced from the original manufacturer or authorized distributors?
All DMN3732UFB4-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN3732UFB4-7 meets industry standards.
7.What is the process for return or replacement of DMN3732UFB4-7?
All DMN3732UFB4-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMN3732UFB4-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN3732UFB4-7 part is unused and in its original packaging.
Return procedure for DMN3732UFB4-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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