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Diodes Incorporated DMN3732UFB4-7

Part No.:
DMN3732UFB4-7
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
3-XFDFN
Datasheet:
AetrixDMN3732UFB4-7.pdf
Description:
MOSFET BVDSS: 25V~30V X2-DFN1006
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,376

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Product details

Overview

DMN3732UFB4-7 from Diodes Incorporated is a 30V N-channel enhancement-mode MOSFET in X2-DFN1006-3 package, optimized for ultra-thin load switching with RDS(ON) = 460 mΩ @ VGS = 4.5V, ID = 1.3 A, and VGS(TH) as low as 0.45 V - enabling direct battery-level gate drive in portable power management circuits.

For engineers reviewing the DMN3732UFB4-7 datasheet, DMN3732UFB4-7 pinout, DMN3732UFB4-7 application, or DMN3732UFB4-7 equivalent, this device is selected for space-constrained, low-voltage DC load control where sub-1V threshold operation, 0.6 mm² footprint, and ESD-protected gate integrity are critical design requirements.

Technical Context

This MOSFET employs a trench-gate silicon process to achieve low RDS(ON) at VGS ≥ 1.8 V while maintaining fast switching (tr = 15.9 ns, tf = 20.0 ns) and low gate charge (Qg = 0.9 nC). Its body diode exhibits VSD = 0.7–1.2 V at IS = 300 mA and tRR = 59 ns under dI/dt = 100 A/μs.

The device operates across –55°C to +150°C junction temperature, with normalized RDS(ON) variation ≤ 1.8× over that range at VGS = 2.5 V. Thermal resistance is RθJA = 112 °C/W on minimum pad layout and 253 °C/W on standard FR-4 (2 oz Cu, 1″² copper).

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 30 V - Maximum drain-source blocking voltage for 12 V/24 V rail protection and USB PD auxiliary switches.
RDS(ON) 460 mΩ @ VGS = 4.5 V - Enables <1.3 A continuous conduction with <2.7 mW I²R loss at 1 A, critical for thermal budget in thin PCBs.
VGS(TH) 0.45–0.95 V - Allows reliable turn-on from single-cell Li-ion (2.5–4.2 V) or coin-cell (3 V) without level-shifting circuitry.
Qg 0.9 nC - Reduces gate drive power and enables use with low-current GPIOs (e.g., microcontroller pins driving ≤ 5 mA).
PD 1.12 W (min pad layout) - Supports 1.1 A steady-state current at +70°C ambient when mounted per recommended footprint.
Ciss 40.8 pF - Limits high-frequency gate oscillation risk and eases EMI filtering in compact DC-DC enable paths.
ESD Rating HBM ±2 kV - Integrated gate protection eliminates need for external TVS in handheld device battery disconnect circuits.

Pinout & Package

Package: X2-DFN1006-3 - 0.4 mm height, 1.0 × 0.6 mm outline, 0.35 mm pitch, NiPdAu-plated terminals, moisture sensitivity level 1.

Pin/Terminal Circuit Role Design Meaning
Pin 1 (Source) Source terminal (S) Connected to system ground or low-side return path; exposed thermal pad tied to PCB ground plane for heat dissipation.
Pin 2 (Gate) Control input (G) Receives logic-level gate drive; low VGS(TH) allows direct MCU I/O connection without buffer stage.
Pin 3 (Drain) Power output (D) Switches load to supply rail; internal body diode anode connects to source, cathode to drain for reverse polarity protection.

Key Features

Feature Design Value
Ultra-low profile 0.4 mm max height - fits under 0.5 mm connectors and within slim consumer wearables (e.g., TWS earbuds, smart bands).
Minimal footprint 0.6 mm² area - 10× smaller than SOT-23, freeing PCB real estate for RF or sensor placement in space-limited modules.
Battery-direct drive VGS(TH) ≤ 0.95 V - eliminates gate driver IC in single-cell Li-ion systems, reducing BOM count and standby current.
ESD-protected gate HBM ±2 kV rating - withstands handling and board assembly without additional gate protection components.
Green compliance Halogen-free, antimony-free, RoHS 3 compliant - meets IPC-1752A material declaration and automotive PPAP requirements.

Applications

Smartphone Power Sequencing USB-C Port Protection

Use Scenario: Controlled power-up of camera module, display backlight, or audio codec after system reset.

IC Role / Device Role / Timing Role: Low-side load switch enabling precise sequencing via GPIO-controlled gate drive.

Use Value: 0.45 V VGS(TH) ensures turn-on at battery voltages down to 2.8 V, preventing brown-out failures during cold start.

Use Scenario: Reverse-current blocking and overcurrent isolation between USB-C receptacle and host SoC.

IC Role / Device Role / Timing Role: High-speed load switch placed in VBUS path to prevent backfeed during hot-plug events.

Use Value: 59 ns body diode reverse recovery time minimizes shoot-through risk during dynamic cable insertion/removal.

Wireless Earbud Battery Management IoT Sensor Node Load Control

Use Scenario: Enabling/disabling charging circuitry or Bluetooth radio based on battery state and user activity.

IC Role / Device Role / Timing Role: Ultra-low-height power switch integrated into 4.5 mm tall earbud housing.

Use Value: 0.4 mm package height avoids interference with speaker driver magnets and maintains mechanical clearance.

Use Scenario: Cycling power to environmental sensors (e.g., humidity, CO₂) to extend 10-year battery life in LPWAN nodes.

IC Role / Device Role / Timing Role: Low-leakage (IDSS ≤ 1 µA) switch isolating sensor supply during sleep mode.

Use Value: 1 µA max IDSS reduces quiescent current by >90% versus discrete FET+resistor solutions, extending shelf life.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel load switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMN2004LK3-7 RDS(ON) = 320 mΩ @ VGS = 4.5 V, but VGS(TH) = 0.6–1.2 V; larger X1-DFN1006-3 (0.5 mm height). Higher threshold limits use below 2.8 V; taller profile restricts use in <0.45 mm assemblies. Select when lower RDS(ON) outweighs height constraint and battery voltage remains ≥3.0 V.
AO3400A RDS(ON) = 44 mΩ @ VGS = 10 V, but VGS(TH) = 0.8–1.8 V; SOT-23 package (1.45 mm height, 2.9 mm² area). Requires gate boosting above 2.5 V; incompatible with ultra-thin form factors. Choose only if higher current (>2 A) and legacy SMT compatibility are prioritized over size and low-VGS drive.

Compared with DMN2004LK3-7 and AO3400A, DMN3732UFB4-7 uniquely balances sub-1V threshold, 0.4 mm height, and 0.6 mm² footprint - making it the sole option for battery-powered devices requiring both deep discharge operation and mechanical thickness <0.45 mm.

Availability

DMN3732UFB4-7 is available at Aetrix Electronics and suitable for smartphone power sequencing, USB-C port protection, and wireless earbud battery management requiring stable component supply across high-mix, low-volume production runs.

Supply support for DMN3732UFB4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in Taiwan and China.

This MOSFET belongs to Diodes' X2-DFN ultra-miniature power switch product line, engineered specifically for space- and power-constrained portable electronics where traditional SOT packages cannot meet mechanical or thermal targets.

FAQ

What is the maximum continuous drain current at +85°C ambient?

At TA = +85°C with the recommended minimum pad layout, DMN3732UFB4-7 supports 0.96 A continuous drain current. This value derives from its 1.12 W power dissipation rating and RθJA = 112 °C/W, ensuring safe operation without derating in thermally optimized wearable PCBs.

Can this MOSFET be used in reverse polarity protection circuits?

Yes - its intrinsic body diode conducts from source to drain when VDS < 0, allowing implementation of low-loss reverse polarity protection by placing the device in series with the positive rail. The 0.7–1.2 V forward drop at 300 mA and 59 ns reverse recovery time ensure minimal voltage loss and fast fault response.

Is the X2-DFN1006-3 package compatible with standard reflow profiles?

Yes - the package is qualified for IPC/JEDEC J-STD-020 Level 1 moisture sensitivity and supports standard lead-free reflow profiles (peak 260°C, 60 s above 217°C). Its NiPdAu finish ensures robust solderability per MIL-STD-202 Method 208, even after extended storage.

Does the device require external gate resistor for stability?

No external gate resistor is required for basic switching. With Qg = 0.9 nC and Ciss = 40.8 pF, the MOSFET turns on/off cleanly using typical MCU GPIO drivers (≤10 mA sink/source). A 10–47 Ω series resistor may be added only if ringing is observed on gate waveform during high-dV/dt noise environments.

DMN3732UFB4-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
3-XFDFN
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
1.3A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
1.8V, 4.5V
Rds On (Max) @ Id, Vgs:
460mOhm @ 200mA, 4.5V
Vgs(th) (Max) @ Id:
950mV @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
0.9 nC @ 4.5 V
Vgs (Max):
±8V
Input Capacitance (Ciss) (Max) @ Vds:
40.8 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
490mW (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
X2-DFN1006-3

DMN3732UFB4-7 FAQ

1.How can I place an order for DMN3732UFB4-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMN3732UFB4-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMN3732UFB4-7 reliable?

The price and inventory of DMN3732UFB4-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN3732UFB4-7 is usually 5 days.

3.What payment methods are accepted for DMN3732UFB4-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN3732UFB4-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMN3732UFB4-7?

DMN3732UFB4-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMN3732UFB4-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMN3732UFB4-7?

For technical support, including DMN3732UFB4-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN3732UFB4-7 requirements.

6.How does Aetrix verify that DMN3732UFB4-7 is sourced from the original manufacturer or authorized distributors?

All DMN3732UFB4-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN3732UFB4-7 meets industry standards.

7.What is the process for return or replacement of DMN3732UFB4-7?

All DMN3732UFB4-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMN3732UFB4-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMN3732UFB4-7 part is unused and in its original packaging.

Return procedure for DMN3732UFB4-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMN3732UFB4-7 Tags

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