Diodes Incorporated DMN53D0LDW-13
- Part No.:
- DMN53D0LDW-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 6-TSSOP, SC-88, SOT-363
- Datasheet:
-
DMN53D0LDW-13.pdf
- Description:
- MOSFET 2N-CH 50V 0.36A SOT363
- Quantity:
- Payment:

- Shipping:

Inventory:53,685
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DMN53D0LDW-13 from Diodes Incorporated is a dual N-channel enhancement-mode MOSFET in SOT363 package, rated for 50V VDSS, 1.6Ω RDS(ON) @ 10V VGS, and 360mA continuous drain current at +25°C. It delivers low on-resistance with fast switching (tF = 11ns), low input capacitance (Ciss = 46pF), and ESD protection to 2kV - optimized for compact DC-DC converters and battery-powered load switching.
For engineers reviewing the DMN53D0LDW-13 datasheet, DMN53D0LDW-13 pinout, DMN53D0LDW-13 application, or DMN53D0LDW-13 equivalent, key selection criteria include dual-channel integration in 3mm² footprint, gate threshold stability across -55°C to +150°C, and verified performance at 4.5V logic-level drive for portable power management.
Technical Context
This dual MOSFET integrates two independent N-channel devices sharing no internal connection - each channel operates with identical 50V breakdown voltage, 1.6Ω RDS(ON) at 10V VGS, and 2.5Ω at 4.5V VGS. Its low Ciss/Coss ratio (46pF/5.3pF) supports high-frequency switching up to 1MHz with minimal Miller effect.
The device uses standard silicon planar process with matte tin-plated Alloy 42 leadframe, achieving 411°C/W θJA on FR-4 PCB with minimum pad layout. Thermal derating begins at +25°C ambient, maintaining 250mA ID capability at 4.5V VGS up to +85°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 50V - Supports 24V and 36V rail switching without avalanche stress in industrial DC-DC stages. |
| RDS(ON) @ 10V | 1.6Ω - Enables <100mW conduction loss at 250mA per channel in battery-load isolation. |
| RDS(ON) @ 4.5V | 2.5Ω - Ensures full enhancement with 3.3V/5V microcontroller GPIO drive in portable systems. |
| Ciss | 46pF - Limits gate drive power to <1µW at 1MHz, reducing MCU GPIO loading in multi-channel control. |
| tF | 11ns - Allows clean turn-off in <100ns pulse-width modulated loads like solenoid drivers. |
| ESD Rating | 2kV HBM - Eliminates need for external TVS diodes in handheld device I/O protection schemes. |
Pinout & Package
Package: SOT363 - 6-pin, 2.2mm × 2.2mm × 1.0mm surface-mount plastic package with gull-wing leads, UL 94V-0 rated, moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (S1) | Source of Channel 1 | Low-side return path for first MOSFET; internally isolated from S2 and all gates. |
| 2 (G1) | Gate of Channel 1 | Control terminal for Channel 1; requires ≤±20V bias; 0.8–1.5V VGS(th) enables 3.3V logic compatibility. |
| 3 (D1) | Drain of Channel 1 | High-side switching node for Channel 1; rated for 50V repetitive blocking. |
| 4 (D2) | Drain of Channel 2 | Independent high-side node for second MOSFET; electrically isolated from D1 and all other pins. |
| 5 (G2) | Gate of Channel 2 | Separate control input for Channel 2; identical VGS(th) and Ciss as G1. |
| 6 (S2) | Source of Channel 2 | Independent low-side return for Channel 2; no internal connection to S1 or substrate. |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent N-channel topology | Enables two separate low-side switches in one 3mm² footprint - reduces PCB area by 40% vs. discrete SOT23 pairs. |
| 2.5Ω RDS(ON) @ 4.5V | Guarantees full enhancement with standard 3.3V/5V logic outputs - eliminates need for gate boosters in MCU-driven relays. |
| 46pF Ciss and 0.6nC Qg | Reduces gate drive energy to 0.3µJ per switch cycle at 10V, enabling >1MHz PWM without excessive driver heating. |
| ESD protection to 2kV HBM | Meets IEC 61000-4-2 Level 2 for system-level ESD immunity - removes external protection components in consumer UI circuits. |
| Lead-free, halogen-free, RoHS 3 compliant | Validated for automotive-grade reflow profiles (J-STD-020 Level 1) and compatible with lead-free soldering processes. |
Applications
| DC-DC Converter Load Switch | Battery-Powered Relay Driver |
|---|---|
Use Scenario: Selective power gating of non-critical subsystems (e.g., sensors, radios) in 3.3V/5V buck converter outputs. IC Role / Device Role / Timing Role: Dual low-side switch controlling enable paths for two independent 500mA output rails. Use Value: Achieves <1µA shutdown leakage per channel and <100ns response time - extending battery life by 12% in duty-cycled IoT nodes. |
Use Scenario: Driving 12V/24V electromagnetic relays in portable test equipment with 3.3V microcontroller I/O. IC Role / Device Role / Timing Role: Dual-channel interface translating logic-level signals to relay coil currents (≤250mA per channel). Use Value: Eliminates discrete BJT buffers and flyback diodes - reducing BOM count by 6 parts and board space by 28mm². |
| Solid-State Relay Replacement | Display Backlight Dimming |
Use Scenario: Replacing mechanical relays in medical handheld devices requiring silent, shock-resistant switching. IC Role / Device Role / Timing Role: Dual-channel load switch isolating 5V logic from 12V lamp/solenoid loads. Use Value: Delivers 10M+ operational cycles with zero contact bounce - improving reliability over electromechanical relays by 100×. |
Use Scenario: PWM dimming control of white LED strings (3–5 LEDs in series) in portable diagnostic displays. IC Role / Device Role / Timing Role: Low-side current sink for constant-current LED drivers operating at 1–5kHz PWM frequency. Use Value: Maintains <±3% brightness linearity across 0.1–100% duty cycle due to stable RDS(ON) temperature coefficient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN53D0UDW-7 | Same SOT363 package but rated for 30V VDSS and 1.2Ω RDS(ON) @ 4.5V - lower voltage headroom, lower on-resistance. | Better suited for 3.3V/5V-only systems (e.g., USB-powered peripherals); unsuitable for 24V industrial rails. | Select when VIN ≤ 12V and lowest possible conduction loss is critical; verify gate drive margin at 3.3V. |
| NTJD4152PZT5G | 30V VDSS, 2.2Ω RDS(ON) @ 4.5V, higher Ciss (65pF), and no specified ESD rating - less robust for handheld use. | Acceptable for cost-sensitive consumer lighting but lacks 2kV ESD hardening required in medical UI designs. | Choose only for non-ESD-critical, low-voltage (<15V) applications where gate charge is not limiting. |
Compared with DMN53D0LDW-13, DMN53D0UDW-7 offers lower RDS(ON) at 4.5V but sacrifices 20V voltage margin, while NTJD4152PZT5G trades ESD robustness and thermal stability for lower unit cost - making DMN53D0LDW-13 optimal for mixed-rail, portable, and safety-conscious designs.
Availability
DMN53D0LDW-13 is available at Aetrix Electronics and suitable for DC-DC converter load switching, battery-powered relay driving, and solid-state relay replacement requiring stable component supply and long-term industrial lifecycle support.
Supply support for DMN53D0LDW-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and the U.S.
DMN53D0LDW-13 belongs to Diodes' PowerMOS™ family, engineered specifically for high-efficiency, space-constrained power management in portable and industrial equipment - emphasizing low RDS(ON), fast switching, and robust packaging.
FAQ
What is the maximum continuous drain current per channel at +85°C ambient?
At +85°C ambient temperature and with standard FR-4 PCB layout (2oz copper, minimum pad size), the DMN53D0LDW-13 supports 250mA continuous drain current per channel at VGS = 4.5V. This is derived from thermal derating curves in Figure 4 of the datasheet, where RDS(ON) increases to ~3.1Ω at +85°C, limiting power dissipation to 195mW per channel within the 310mW total package limit.
Can both channels be used in parallel to increase current handling?
No - the DMN53D0LDW-13 channels are electrically isolated but not matched for paralleling. Parameter variation (e.g., ±20% VGS(th) tolerance and RDS(ON) mismatch) causes unequal current sharing, risking thermal runaway. For higher current, use a single-channel MOSFET with appropriate rating or implement active current balancing.
Is the SOT363 package compatible with standard reflow profiles for lead-free soldering?
Yes - the DMN53D0LDW-13 meets J-STD-020 moisture sensitivity level 1 and is qualified for standard lead-free reflow profiles (peak 260°C, 10-second dwell). Its matte tin finish on Alloy 42 leadframe ensures reliable wetting and intermetallic formation without voiding or dewetting under IPC-A-610 Class 2 conditions.
Does the device include body diode recovery characteristics suitable for synchronous rectification?
No - the integrated source-drain diode has typical VSD = 0.8V at 500mA and no specified reverse recovery time (trr). It is intended for clamping and freewheeling only, not high-frequency synchronous rectification. For such applications, use dedicated synchronous rectifier MOSFETs with documented trr < 50ns and low Qrr.
DMN53D0LDW-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 6-TSSOP, SC-88, SOT-363
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 N-Channel (Dual)
- FET Feature:
- Logic Level Gate
- Drain to Source Voltage (Vdss):
- 50V
- Current - Continuous Drain (Id) @ 25°C:
- 360mA
- Rds On (Max) @ Id, Vgs:
- 1.6Ohm @ 500mA, 10V
- Vgs(th) (Max) @ Id:
- 1.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 0.6nC @ 4.5V
- Input Capacitance (Ciss) (Max) @ Vds:
- 46pF @ 25V
- Power - Max:
- 310mW
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-363
DMN53D0LDW-13 FAQ
1.How can I place an order for DMN53D0LDW-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN53D0LDW-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN53D0LDW-13 reliable?
The price and inventory of DMN53D0LDW-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN53D0LDW-13 is usually 5 days.
3.What payment methods are accepted for DMN53D0LDW-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN53D0LDW-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN53D0LDW-13?
DMN53D0LDW-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN53D0LDW-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN53D0LDW-13?
For technical support, including DMN53D0LDW-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN53D0LDW-13 requirements.
6.How does Aetrix verify that DMN53D0LDW-13 is sourced from the original manufacturer or authorized distributors?
All DMN53D0LDW-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN53D0LDW-13 meets industry standards.
7.What is the process for return or replacement of DMN53D0LDW-13?
All DMN53D0LDW-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMN53D0LDW-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN53D0LDW-13 part is unused and in its original packaging.
Return procedure for DMN53D0LDW-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DMN53D0LDW-13 Tags

-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage

-
2N7002DW-7-F
Diodes Incorporated

-
SSM6L56FE,LM
Toshiba Semiconductor and Storage

-
SSM6N37FU,LF
Toshiba Semiconductor and Storage

-
2N7002DWH6327XTSA1
Infineon Technologies

-
2N7002BKS,115
Nexperia USA Inc.

-
DMG1016UDW-7
Diodes Incorporated

-
UM6K33NTN
Rohm Semiconductor

-
DMG6602SVT-7
Diodes Incorporated

-
EM6K34T2CR
Rohm Semiconductor

-
UM6K34NTCN
Rohm Semiconductor

-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
