Diodes Incorporated DMN62D2UT-13
- Part No.:
- DMN62D2UT-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- SOT-523
- Datasheet:
-
DMN62D2UT-13.pdf
- Description:
- 2N7002 FAMILY SOT523 T&R 10K
- Quantity:
- Payment:

- Shipping:

Inventory:4,262
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Product details
Overview
DMN62D2UT-13 from Diodes Incorporated is a 60V N-channel enhancement-mode MOSFET in SOT523 package, featuring RDS(ON) = 2.0 Ω @ VGS = 5.0 V, 334 mA continuous drain current at +25°C, and gate threshold voltage of 0.5–1.0 V - optimized for low-voltage power management in space-constrained portable electronics.
For engineers reviewing the DMN62D2UT-13 datasheet, DMN62D2UT-13 pinout, DMN62D2UT-13 application, or DMN62D2UT-13 equivalent, key selection criteria include low VGS(TH) for 1.8 V logic compatibility, ESD protection up to 2 kV, and thermal resistance of 350 °C/W on FR-4 with 2 oz copper.
Technical Context
This MOSFET employs planar trench-enhanced silicon process to achieve low RDS(ON) while maintaining fast switching (tD(ON) = 1.5 ns, tF = 19.5 ns) and low input capacitance (Ciss = 41 pF). Its gate threshold range (0.5–1.0 V) ensures reliable turn-on with 1.8 V and 2.5 V microcontroller I/Os.
The integrated body diode supports bidirectional current flow in H-bridge motor control, with VSD = 0.7–1.4 V at 115 mA. Thermal design is constrained by RθJA = 350 °C/W (min pad) and 273 °C/W (1-inch² copper), limiting steady-state power dissipation to 0.4 W and 0.5 W respectively.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 60 V - supports input rails up to 48 V DC without avalanche stress |
| RDS(ON) | 2.0 Ω @ VGS = 5.0 V - enables <100 mW conduction loss at 225 mA load |
| ID (max) | 334 mA @ TA = +25°C - suitable for low-power load switching in wearables and sensors |
| VGS(TH) | 0.5–1.0 V - guarantees turn-on with 1.8 V logic-level drivers without level-shifting |
| Ciss | 41 pF - reduces gate drive power and enables >1 MHz PWM operation |
| ESD Rating | ±2 kV HBM - protects against handling damage in manual assembly and test environments |
| PD | 0.4 W (min pad layout) - defines maximum continuous power under standard PCB conditions |
Pinout & Package
Package: SOT523 - ultra-small surface-mount plastic package (1.60 × 1.60 × 0.65 mm), rated for moisture sensitivity level 1 (J-STD-020), with matte tin annealed terminals solderable per MIL-STD-202.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Gate (G) | Control electrode | Accepts logic-level voltage (1.8–5.0 V); low Ciss minimizes drive current demand |
| Source (S) | Reference node for gate drive and current return path | Internally connected to substrate; must be tied to system ground or low-side reference |
| Drain (D) | Power output terminal | Carries switched load current; exposed pad not present - thermal path relies on trace copper |
Key Features
| Feature | Design Value |
|---|---|
| Low gate threshold voltage | 0.5–1.0 V enables direct interface with 1.8 V and 2.5 V MCUs without external level shifters |
| Low RDS(ON) at low VGS | 2.5 Ω @ VGS = 2.5 V supports efficient operation in battery-powered systems with weak gate drive |
| Fast switching speed | tF = 19.5 ns and tD(OFF) = 22.6 ns reduce switching losses in high-frequency DC-DC converters |
| Integrated ESD protection | 2 kV HBM rating eliminates need for external TVS diodes in handheld device I/O stages |
| Green RoHS-compliant construction | Halogen- and antimony-free molding compound (<900 ppm Br/Cl, <1000 ppm Sb) meets automotive and medical environmental mandates |
Applications
| Portable Power Switching | Motor Control (Small DC) |
|---|---|
Use Scenario: Load switching for Bluetooth earbud charging circuits and sensor bias rails. IC Role / Device Role / Timing Role: Low-side power switch enabling/disabling 3.3 V or 5 V subsystems under MCU control. Use Value: 2.0 Ω RDS(ON) limits voltage drop to <0.7 V at 300 mA, preserving battery runtime and regulation margin. |
Use Scenario: Half-bridge driver stage in miniature vibration motors for smartwatches and haptic feedback modules. IC Role / Device Role / Timing Role: High-side or low-side switch in discrete H-bridge configuration with complementary P-channel counterpart. Use Value: Fast 19.5 ns fall time ensures clean commutation at 20–50 kHz PWM frequencies, minimizing audible noise and torque ripple. |
| USB-C Power Path | IoT Sensor Node Power Gating |
Use Scenario: Reverse-current blocking and load disconnect in USB-C PD sink applications with 5–20 V input. IC Role / Device Role / Timing Role: Back-to-back configured N-channel MOSFET for ideal diode functionality with gate driven by dedicated controller. Use Value: 60 V VDSS withstands USB-C transient surges; low Qg = 0.8 nC reduces controller gate-drive burden. |
Use Scenario: Power gating of BLE SoC peripherals (accelerometer, temperature sensor) during deep-sleep mode. IC Role / Device Role / Timing Role: Standby-mode isolation switch controlled by GPIO to cut leakage paths below 1 µA. Use Value: Gate leakage <10 µA and sub-1 µA IDSS ensure <10 nA total off-state current when paired with high-impedance loads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel low-voltage MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN62D0UT-13 | RDS(ON) = 1.0 Ω @ VGS = 5.0 V; higher ID rating (500 mA) | Better suited for 500 mA loads but requires larger gate drive current due to higher Ciss (52 pF) | Select when lower conduction loss is critical and board space allows for slightly higher drive power. |
| AO3400 | RDS(ON) = 2.7 Ω @ VGS = 4.5 V; SOT23 package (larger footprint, better thermal performance) | Higher RθJA = 190 °C/W enables 0.8 W dissipation but occupies 3× more PCB area | Choose when thermal headroom is constrained and 2.7 Ω RDS(ON) is acceptable for the load. |
Compared with DMN62D0UT-13, DMN62D2UT-13 trades 2× lower RDS(ON) for reduced current capability and tighter gate drive compatibility; versus AO3400, it offers 30% smaller footprint and 1.8 V logic support at the cost of 25% higher on-resistance and 80% higher thermal resistance.
Availability
DMN62D2UT-13 is available at Aetrix Electronics and suitable for portable power switching, small DC motor control, USB-C power path management, and IoT sensor node power gating requiring stable component supply across high-mix, low-volume production runs.
Supply support for DMN62D2UT-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, energy-efficient components for consumer, industrial, and automotive markets.
The DMN62D2UT belongs to Diodes' low-voltage logic-level MOSFET product line, engineered specifically for space-constrained battery-powered devices where 1.8 V–2.5 V gate drive compatibility and minimal PCB footprint are primary design constraints.
FAQ
What is the maximum continuous drain current at 70°C ambient?
The DMN62D2UT-13 supports 267 mA continuous drain current at TA = +70°C, derated from 334 mA at +25°C per the datasheet's thermal curve. This reflects junction-to-ambient thermal resistance of 350 °C/W on standard FR-4 with minimum recommended pad layout.
Is this MOSFET qualified for automotive use?
No - the DMN62D2UT-13 is not AEC-Q101 qualified. Diodes offers automotive-grade equivalents (e.g., DMN62D2UTQ-13) with PPAP documentation, IATF 16949 manufacturing, and extended temperature validation. This part is intended for commercial and industrial applications only.
Can it be used in a back-to-back configuration for reverse-polarity protection?
Yes - its 60 V VDSS and body diode forward voltage of 0.7–1.4 V make it suitable for back-to-back N-channel configurations in 5–20 V systems. Gate drive must exceed VGS(TH) (0.5–1.0 V) on both devices; typical implementation uses a dedicated charge-pump or dual-gate driver.
What is the safe operating area (SOA) limitation at 100 µs pulse width?
At 100 µs pulse width and TA = +25°C, the SOA limit is approximately 1.0 A at VDS = 10 V (per Figure 12). This is governed by peak current capability (IDM = 1.2 A) and transient thermal impedance - sustained operation above 334 mA requires careful thermal design.
DMN62D2UT-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- SOT-523
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 334mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 5V
- Rds On (Max) @ Id, Vgs:
- 2Ohm @ 50mA, 5V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 0.8 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 41 pF @ 30 V
- FET Feature:
- -
- Power Dissipation (Max):
- 400mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-523
DMN62D2UT-13 FAQ
1.How can I place an order for DMN62D2UT-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMN62D2UT-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMN62D2UT-13 reliable?
The price and inventory of DMN62D2UT-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN62D2UT-13 is usually 5 days.
3.What payment methods are accepted for DMN62D2UT-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN62D2UT-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMN62D2UT-13?
DMN62D2UT-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMN62D2UT-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMN62D2UT-13?
For technical support, including DMN62D2UT-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN62D2UT-13 requirements.
6.How does Aetrix verify that DMN62D2UT-13 is sourced from the original manufacturer or authorized distributors?
All DMN62D2UT-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN62D2UT-13 meets industry standards.
7.What is the process for return or replacement of DMN62D2UT-13?
All DMN62D2UT-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMN62D2UT-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMN62D2UT-13 part is unused and in its original packaging.
Return procedure for DMN62D2UT-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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