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Diodes Incorporated DMN62D2UT-13

Part No.:
DMN62D2UT-13
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
SOT-523
Datasheet:
AetrixDMN62D2UT-13.pdf
Description:
2N7002 FAMILY SOT523 T&R 10K
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,262

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Product details

Overview

DMN62D2UT-13 from Diodes Incorporated is a 60V N-channel enhancement-mode MOSFET in SOT523 package, featuring RDS(ON) = 2.0 Ω @ VGS = 5.0 V, 334 mA continuous drain current at +25°C, and gate threshold voltage of 0.5–1.0 V - optimized for low-voltage power management in space-constrained portable electronics.

For engineers reviewing the DMN62D2UT-13 datasheet, DMN62D2UT-13 pinout, DMN62D2UT-13 application, or DMN62D2UT-13 equivalent, key selection criteria include low VGS(TH) for 1.8 V logic compatibility, ESD protection up to 2 kV, and thermal resistance of 350 °C/W on FR-4 with 2 oz copper.

Technical Context

This MOSFET employs planar trench-enhanced silicon process to achieve low RDS(ON) while maintaining fast switching (tD(ON) = 1.5 ns, tF = 19.5 ns) and low input capacitance (Ciss = 41 pF). Its gate threshold range (0.5–1.0 V) ensures reliable turn-on with 1.8 V and 2.5 V microcontroller I/Os.

The integrated body diode supports bidirectional current flow in H-bridge motor control, with VSD = 0.7–1.4 V at 115 mA. Thermal design is constrained by RθJA = 350 °C/W (min pad) and 273 °C/W (1-inch² copper), limiting steady-state power dissipation to 0.4 W and 0.5 W respectively.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS60 V - supports input rails up to 48 V DC without avalanche stress
RDS(ON)2.0 Ω @ VGS = 5.0 V - enables <100 mW conduction loss at 225 mA load
ID (max)334 mA @ TA = +25°C - suitable for low-power load switching in wearables and sensors
VGS(TH)0.5–1.0 V - guarantees turn-on with 1.8 V logic-level drivers without level-shifting
Ciss41 pF - reduces gate drive power and enables >1 MHz PWM operation
ESD Rating±2 kV HBM - protects against handling damage in manual assembly and test environments
PD0.4 W (min pad layout) - defines maximum continuous power under standard PCB conditions

Pinout & Package

Package: SOT523 - ultra-small surface-mount plastic package (1.60 × 1.60 × 0.65 mm), rated for moisture sensitivity level 1 (J-STD-020), with matte tin annealed terminals solderable per MIL-STD-202.

Pin/Terminal Circuit Role Design Meaning
Gate (G)Control electrodeAccepts logic-level voltage (1.8–5.0 V); low Ciss minimizes drive current demand
Source (S)Reference node for gate drive and current return pathInternally connected to substrate; must be tied to system ground or low-side reference
Drain (D)Power output terminalCarries switched load current; exposed pad not present - thermal path relies on trace copper

Key Features

Feature Design Value
Low gate threshold voltage0.5–1.0 V enables direct interface with 1.8 V and 2.5 V MCUs without external level shifters
Low RDS(ON) at low VGS2.5 Ω @ VGS = 2.5 V supports efficient operation in battery-powered systems with weak gate drive
Fast switching speedtF = 19.5 ns and tD(OFF) = 22.6 ns reduce switching losses in high-frequency DC-DC converters
Integrated ESD protection2 kV HBM rating eliminates need for external TVS diodes in handheld device I/O stages
Green RoHS-compliant constructionHalogen- and antimony-free molding compound (<900 ppm Br/Cl, <1000 ppm Sb) meets automotive and medical environmental mandates

Applications

Portable Power Switching Motor Control (Small DC)

Use Scenario: Load switching for Bluetooth earbud charging circuits and sensor bias rails.

IC Role / Device Role / Timing Role: Low-side power switch enabling/disabling 3.3 V or 5 V subsystems under MCU control.

Use Value: 2.0 Ω RDS(ON) limits voltage drop to <0.7 V at 300 mA, preserving battery runtime and regulation margin.

Use Scenario: Half-bridge driver stage in miniature vibration motors for smartwatches and haptic feedback modules.

IC Role / Device Role / Timing Role: High-side or low-side switch in discrete H-bridge configuration with complementary P-channel counterpart.

Use Value: Fast 19.5 ns fall time ensures clean commutation at 20–50 kHz PWM frequencies, minimizing audible noise and torque ripple.

USB-C Power Path IoT Sensor Node Power Gating

Use Scenario: Reverse-current blocking and load disconnect in USB-C PD sink applications with 5–20 V input.

IC Role / Device Role / Timing Role: Back-to-back configured N-channel MOSFET for ideal diode functionality with gate driven by dedicated controller.

Use Value: 60 V VDSS withstands USB-C transient surges; low Qg = 0.8 nC reduces controller gate-drive burden.

Use Scenario: Power gating of BLE SoC peripherals (accelerometer, temperature sensor) during deep-sleep mode.

IC Role / Device Role / Timing Role: Standby-mode isolation switch controlled by GPIO to cut leakage paths below 1 µA.

Use Value: Gate leakage <10 µA and sub-1 µA IDSS ensure <10 nA total off-state current when paired with high-impedance loads.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel low-voltage MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMN62D0UT-13RDS(ON) = 1.0 Ω @ VGS = 5.0 V; higher ID rating (500 mA)Better suited for 500 mA loads but requires larger gate drive current due to higher Ciss (52 pF)Select when lower conduction loss is critical and board space allows for slightly higher drive power.
AO3400RDS(ON) = 2.7 Ω @ VGS = 4.5 V; SOT23 package (larger footprint, better thermal performance)Higher RθJA = 190 °C/W enables 0.8 W dissipation but occupies 3× more PCB areaChoose when thermal headroom is constrained and 2.7 Ω RDS(ON) is acceptable for the load.

Compared with DMN62D0UT-13, DMN62D2UT-13 trades 2× lower RDS(ON) for reduced current capability and tighter gate drive compatibility; versus AO3400, it offers 30% smaller footprint and 1.8 V logic support at the cost of 25% higher on-resistance and 80% higher thermal resistance.

Availability

DMN62D2UT-13 is available at Aetrix Electronics and suitable for portable power switching, small DC motor control, USB-C power path management, and IoT sensor node power gating requiring stable component supply across high-mix, low-volume production runs.

Supply support for DMN62D2UT-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, energy-efficient components for consumer, industrial, and automotive markets.

The DMN62D2UT belongs to Diodes' low-voltage logic-level MOSFET product line, engineered specifically for space-constrained battery-powered devices where 1.8 V–2.5 V gate drive compatibility and minimal PCB footprint are primary design constraints.

FAQ

What is the maximum continuous drain current at 70°C ambient?

The DMN62D2UT-13 supports 267 mA continuous drain current at TA = +70°C, derated from 334 mA at +25°C per the datasheet's thermal curve. This reflects junction-to-ambient thermal resistance of 350 °C/W on standard FR-4 with minimum recommended pad layout.

Is this MOSFET qualified for automotive use?

No - the DMN62D2UT-13 is not AEC-Q101 qualified. Diodes offers automotive-grade equivalents (e.g., DMN62D2UTQ-13) with PPAP documentation, IATF 16949 manufacturing, and extended temperature validation. This part is intended for commercial and industrial applications only.

Can it be used in a back-to-back configuration for reverse-polarity protection?

Yes - its 60 V VDSS and body diode forward voltage of 0.7–1.4 V make it suitable for back-to-back N-channel configurations in 5–20 V systems. Gate drive must exceed VGS(TH) (0.5–1.0 V) on both devices; typical implementation uses a dedicated charge-pump or dual-gate driver.

What is the safe operating area (SOA) limitation at 100 µs pulse width?

At 100 µs pulse width and TA = +25°C, the SOA limit is approximately 1.0 A at VDS = 10 V (per Figure 12). This is governed by peak current capability (IDM = 1.2 A) and transient thermal impedance - sustained operation above 334 mA requires careful thermal design.

DMN62D2UT-13 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
SOT-523
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
60 V
Current - Continuous Drain (Id) @ 25°C:
334mA (Ta)
Drive Voltage (Max Rds On, Min Rds On):
1.8V, 5V
Rds On (Max) @ Id, Vgs:
2Ohm @ 50mA, 5V
Vgs(th) (Max) @ Id:
1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
0.8 nC @ 4.5 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
41 pF @ 30 V
FET Feature:
-
Power Dissipation (Max):
400mW (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SOT-523

DMN62D2UT-13 FAQ

1.How can I place an order for DMN62D2UT-13 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMN62D2UT-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMN62D2UT-13 reliable?

The price and inventory of DMN62D2UT-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMN62D2UT-13 is usually 5 days.

3.What payment methods are accepted for DMN62D2UT-13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMN62D2UT-13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMN62D2UT-13?

DMN62D2UT-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMN62D2UT-13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMN62D2UT-13?

For technical support, including DMN62D2UT-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMN62D2UT-13 requirements.

6.How does Aetrix verify that DMN62D2UT-13 is sourced from the original manufacturer or authorized distributors?

All DMN62D2UT-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMN62D2UT-13 meets industry standards.

7.What is the process for return or replacement of DMN62D2UT-13?

All DMN62D2UT-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMN62D2UT-13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMN62D2UT-13 part is unused and in its original packaging.

Return procedure for DMN62D2UT-13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMN62D2UT-13 Tags

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