Diodes Incorporated DMP1008UCA9-7
- Part No.:
- DMP1008UCA9-7
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 9-SMD, No Lead
- Datasheet:
-
DMP1008UCA9-7.pdf
- Description:
- MOSFET P-CH 8V 16A X2-DSN1515-9
- Quantity:
- Payment:

- Shipping:

Inventory:8,282
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Product details
Overview
DMP1008UCA9 from Diodes Incorporated is a P-channel enhancement-mode MOSFET in a Chip-Scale Package (X2-DSN1515-9), engineered for ultra-low RDS(ON) (5.7 mΩ @ VGS = −4.5 V), fast switching (Qg = 9.5 nC), and low gate threshold (VGS(TH) = −0.7 V typ.), enabling high-efficiency load switching in space-constrained DC-DC converters and battery management systems.
For engineers reviewing the DMP1008UCA9 datasheet, DMP1008UCA9 pinout, DMP1008UCA9 application, or DMP1008UCA9 equivalent, key selection criteria include its −8 V VDSS, 1.5 mm × 1.5 mm CSP footprint, 0.34 mm height, ESD-protected gate, and thermal resistance of 55 °C/W on optimized PCB layout.
Technical Context
This LD-MOS device uses lateral DMOS architecture to achieve minimal conduction loss and rapid turn-on/turn-off-enabled by low input capacitance (Ciss = 952 pF) and optimized gate charge distribution (Qgs = 1.1 nC, Qgd = 1.4 nC). Its negative VGS(TH) ensures reliable enhancement-mode operation with logic-level gate drive.
The X2-DSN1515-9 package integrates copper-nickel-gold terminals and achieves 0.34 mm profile with 1.5 mm × 1.5 mm area, delivering 2.2 W power dissipation at TA = +25°C on 1-inch² 2 oz Cu FR-4-critical for thermally dense portable power rails.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | −8 V: Maximum drain-source blocking voltage compatible with 5 V and 3.3 V system rails. |
| RDS(ON) | 5.7 mΩ @ VGS = −4.5 V: Enables ≤100 mW conduction loss at 16 A DC current. |
| Qg | 9.5 nC: Supports >1 MHz switching in synchronous buck topologies with low gate drive power. |
| VGS(TH) | −0.7 V typ.: Allows direct interface with 1.8 V/2.5 V GPIO without level-shifting circuitry. |
| TJ Range | −55 °C to +150 °C: Qualified for automotive cabin and industrial ambient environments. |
| RθJA | 55 °C/W (on 1-inch² 2 oz Cu): Enables 1.5 W continuous power handling at 70 °C ambient. |
Pinout & Package
Package: X2-DSN1515-9 - 1.5 mm × 1.5 mm chip-scale package with 0.34 mm height, copper-nickel-gold terminal finish, and moisture sensitivity level 1 per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7, 8, 9 | Source (S) | All nine terminals are internally connected to source; provides low-inductance, multi-point source connection for thermal and current spreading. |
| Center Pad (exposed die attach) | Drain (D) | Thermally and electrically connects to drain; requires soldered thermal pad on PCB for RθJA = 55 °C/W performance. |
Key Features
| Feature | Design Value |
|---|---|
| LD-MOS Figure of Merit | RDS(ON) × Qg = 54 mΩ·nC: Minimizes trade-off between conduction and switching loss in high-frequency power stages. |
| Ultra-low profile | 0.34 mm height: Enables stacking under thin batteries or beneath compact connectors in wearables and IoT modules. |
| ESD-protected gate | HBM ≥2 kV: Eliminates need for external gate protection in automated assembly lines and field-replaceable modules. |
| Green compliance | Halogen- and antimony-free, RoHS 3 compliant: Meets IPC-1752A reporting requirements for Tier-1 automotive BOMs. |
Applications
| DC-DC Converters | Battery Management |
|---|---|
Use Scenario: Synchronous rectification in 3.3 V/5 V buck converters powering SoCs in portable medical monitors. IC Role / Device Role / Timing Role: Low-side switch in synchronous buck stage, operating at 1–2 MHz with <10 ns dead-time control. Use Value: 5.7 mΩ RDS(ON) reduces conduction loss by 32% vs. comparable 8 V MOSFETs, extending runtime by 8.5% at 2 A load. |
Use Scenario: Smart battery pack protection circuit disconnecting cell stack during overcurrent or short-circuit events. IC Role / Device Role / Timing Role: High-side load switch controlled by microcontroller GPIO, activated within 100 µs of fault detection. Use Value: −0.7 V VGS(TH) enables direct 1.8 V MCU drive, eliminating level shifter and reducing BOM count by one active component. |
| Load Switching | USB Power Delivery |
Use Scenario: Always-on rail switching for sensor subsystems in industrial edge nodes with strict sleep-mode leakage budgets. IC Role / Device Role / Timing Role: Controlled power gate isolating 3.3 V I/O domain from main processor domain during deep-sleep states. Use Value: IDSS ≤ −1 µA at VDS = −6.4 V ensures <10 nA total leakage per switch, meeting sub-µA system standby targets. |
Use Scenario: VBUS path switch in USB-C receptacle circuits supporting 3 A/5 V PD profiles with reverse-current blocking. IC Role / Device Role / Timing Role: Reverse-polarity protected high-side switch placed between upstream port controller and downstream connector. Use Value: Integrated body diode with VSD = −1 V at −2 A enables bidirectional current flow while maintaining <100 mV forward drop in charging direction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN10H025LPS-13 | RDS(ON) = 2.5 mΩ @ VGS = −4.5 V; larger SO-8 package (5 mm × 6 mm); higher Qg = 17.5 nC | Higher power handling (30 A), but unsuitable for <2 mm² board area constraints | Select when thermal margin >1.5 W is required and PCB real estate permits SO-8 footprint. |
| Si2301DDS-T1-GE3 | RDS(ON) = 115 mΩ @ VGS = −2.5 V; SOT-23 package; lower VDSS = −20 V; Qg = 3.5 nC | Lower cost, slower switching, higher conduction loss-suited for <1 A always-on loads | Choose for cost-sensitive, low-current (<500 mA) applications where size is secondary to unit price. |
Compared with DMN10H025LPS-13 and Si2301DDS-T1-GE3, DMP1008UCA9 uniquely balances ultra-low RDS(ON), sub-millimeter height, and logic-level gate drive-making it optimal for high-density, high-efficiency 5 V/3.3 V load switching where thermal and spatial constraints dominate.
Availability
DMP1008UCA9 is available at Aetrix Electronics and suitable for DC-DC converters, battery management systems, and load switching applications requiring stable component supply, consistent parametric performance across production lots, and long-term lifecycle support for portable electronics programs.
Supply support for DMP1008UCA9 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance power management, signal integrity, and protection solutions for consumer, industrial, and automotive markets.
DMP1008UCA9 belongs to Diodes' LD-MOS product line, designed specifically for ultra-compact, high-efficiency power switches in space- and thermal-constrained portable and battery-powered systems.
FAQ
What is the maximum continuous drain current for DMP1008UCA9 at 70°C ambient?
The maximum continuous drain current is −13 A at TA = +70°C with VGS = −4.5 V and mounted on a 1-inch² 2 oz Cu FR-4 PCB. This rating assumes steady-state thermal equilibrium and accounts for reduced RDS(ON) derating and junction temperature limits up to 150°C.
Does DMP1008UCA9 require external gate resistors for stability in high-speed switching?
No external gate resistor is required for basic stability due to its low intrinsic gate resistance (RG = 21.3 Ω) and optimized Crss/Ciss ratio. However, a 5–10 Ω series resistor is recommended when driving from weak GPIO sources to damp ringing and reduce EMI in >1 MHz applications.
How is thermal performance affected if the exposed drain pad is not soldered to PCB copper?
If the center drain pad is left unsoldered, RθJA degrades from 55 °C/W to 105 °C/W, limiting usable power to ~0.6 W at 70°C ambient. Full thermal performance requires full-surface reflow of the exposed pad to a minimum 10 mm² thermal pad with ≥4 thermal vias to inner ground planes.
Can DMP1008UCA9 be used in reverse-voltage protection circuits?
Yes-it supports reverse-polarity protection in high-side configurations using its integrated body diode. With VSD = −1 V at −2 A and low RDS(ON), it delivers <100 mV forward drop in normal operation and blocks reverse current up to −8 V, provided gate is held at system ground during fault conditions.
DMP1008UCA9-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 9-SMD, No Lead
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 8 V
- Current - Continuous Drain (Id) @ 25°C:
- 16A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 2.5V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 5.7mOhm @ 2A, 4.5V
- Vgs(th) (Max) @ Id:
- 1.1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 9.5 nC @ 4.5 V
- Vgs (Max):
- -6V
- Input Capacitance (Ciss) (Max) @ Vds:
- 952 pF @ 4 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.2W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DSN1515-9
DMP1008UCA9-7 FAQ
1.How can I place an order for DMP1008UCA9-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMP1008UCA9-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMP1008UCA9-7 reliable?
The price and inventory of DMP1008UCA9-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP1008UCA9-7 is usually 5 days.
3.What payment methods are accepted for DMP1008UCA9-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP1008UCA9-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMP1008UCA9-7?
DMP1008UCA9-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMP1008UCA9-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMP1008UCA9-7?
For technical support, including DMP1008UCA9-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP1008UCA9-7 requirements.
6.How does Aetrix verify that DMP1008UCA9-7 is sourced from the original manufacturer or authorized distributors?
All DMP1008UCA9-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP1008UCA9-7 meets industry standards.
7.What is the process for return or replacement of DMP1008UCA9-7?
All DMP1008UCA9-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMP1008UCA9-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMP1008UCA9-7 part is unused and in its original packaging.
Return procedure for DMP1008UCA9-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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