Diodes Incorporated DMP1008UCB9-7
- Part No.:
- DMP1008UCB9-7
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 9-UFBGA, WLBGA
- Datasheet:
-
DMP1008UCB9-7.pdf
- Description:
- MOSFET BVDSS: 8V~24V U-WLB1515-9
- Quantity:
- Payment:

- Shipping:

Inventory:7,146
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DMP1008UCB9 from Diodes Incorporated is a P-channel enhancement-mode MOSFET in a Chip-Scale Package (U-WLB1515-9), rated for -8V VDSS, 5.7mΩ RDS(ON) at VGS = -4.5V, and -13.2A continuous drain current at TA = +25°C. It serves as a high-efficiency load switch or synchronous rectifier in compact DC-DC converters and battery management systems.
For engineers reviewing the DMP1008UCB9 datasheet, DMP1008UCB9 pinout, DMP1008UCB9 application, or DMP1008UCB9 equivalent, key selection criteria include its ultra-low RDS(ON) per mm² footprint, 8.2nC total gate charge for fast switching, -0.6V typical gate threshold voltage, and CSP thermal performance with RθJA = 82°C/W on optimized PCB.
Technical Context
This MOSFET employs third-generation Lateral DMOS (LD-MOS) technology to achieve low figure-of-merit (RDS(ON) × Qg = 46.7 mΩ·nC), enabling high power density in space-constrained applications. Its -0.6V VGS(TH) supports direct logic-level drive from 1.8V/2.5V/3.3V controllers without level shifting.
The U-WLB1515-9 package features nine solderable terminals with SnAgCu finish, 0.60mm height, and 1.5mm × 1.5mm footprint. Thermal resistance is optimized via copper pillar interconnects and direct die-to-PCB heat transfer-confirmed by RθJA = 82°C/W on 1-inch² 2oz Cu FR-4.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | -8V - Maximum blocking voltage for low-voltage battery-side switching |
| RDS(ON) | 5.7mΩ @ VGS = -4.5V - Enables <100mW conduction loss at 4.5A in load-switch mode |
| ID (max) | -13.2A @ TA = +25°C - Supports high-current USB PD or PMIC output stages |
| Qg | 8.2nC - Allows <50ns turn-on delay with 10Ω gate resistor, minimizing switching loss |
| VGS(TH) | -0.6V (typ) - Ensures reliable turn-on with standard I²C/SPI GPIOs or low-voltage PMIC outputs |
| RθJA | 82°C/W - Achieved on 1-inch² 2oz Cu PCB, enabling >1W dissipation in thermally constrained layouts |
| Ciss | 900pF - Low input capacitance reduces driver loading and improves EMI behavior |
Pinout & Package
Package: U-WLB1515-9 (Type F), Chip-Scale Package, 1.5mm × 1.5mm × 0.60mm, nine-terminal array with SnAgCu finish and 245µm UBM size.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7, 8 | Source (S) | Eight parallel source connections reduce bond-wire inductance and improve current sharing |
| 9 | Drain (D) | Single large-area drain terminal optimized for thermal conduction to PCB ground plane |
Key Features
| Feature | Design Value |
|---|---|
| LD-MOS architecture | Minimizes RDS(ON) × Qg product to 46.7 mΩ·nC-critical for high-frequency DC-DC efficiency |
| Chip-scale packaging | 1.5mm × 1.5mm footprint delivers highest power density among -8V P-ch MOSFETs in this class |
| Low-profile construction | 0.60mm height enables use under thin shields or in stacked-module designs |
| ESD-protected gate | HBM rating ≥2kV ensures robustness during board assembly and handling |
| Lead-free & green compliance | Fully RoHS 3 compliant with <900ppm Br+Cl and <1000ppm Sb-meets automotive and medical supply chain requirements |
Applications
| Battery Protection Circuit | USB-C Power Delivery Switch |
|---|---|
Use Scenario: Reverse-current blocking and overcurrent protection in single-cell Li-ion battery packs. IC Role / Device Role / Timing Role: P-channel load switch controlling battery discharge path with fast fault response. Use Value: 5.7mΩ RDS(ON) limits voltage drop to <25mV at 4.5A, preserving battery runtime and state-of-charge accuracy. | Use Scenario: VBUS path control in USB-C receptacles supporting 3A/5A current profiles. IC Role / Device Role / Timing Role: High-side power switch enabling hot-plug insertion and dynamic port power allocation. Use Value: 8.2nC Qg allows <100ns switching transitions, meeting USB PD 3.1 timing requirements for fast role swap. |
| PMIC Output Stage | Industrial Sensor Node Power Rail |
Use Scenario: Secondary-side synchronous rectification in buck converters integrated into power management ICs. IC Role / Device Role / Timing Role: Low-side or high-side synchronous rectifier driven by internal PMIC gate controller. Use Value: -0.6V VGS(TH) ensures full enhancement with 1.8V logic outputs, eliminating external level shifters. | Use Scenario: Always-on power rail switching for ultra-low-power industrial IoT sensors with wake-on-event capability. IC Role / Device Role / Timing Role: Load switch enabling microamp-level quiescent current in sleep mode. Use Value: Gate leakage <100nA at -6V VGS prevents measurable standby current degradation over 10-year field life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN10H015LPS-13 | RDS(ON) = 1.5mΩ @ -4.5V but in larger TSOP-6 (3.05mm × 1.65mm); Qg = 12.5nC | Higher current capacity (-30A) but 2.7× larger footprint and higher gate drive demand | Select when board area permits and higher current headroom is required |
| AO3401 | RDS(ON) = 52mΩ @ -4.5V in SOT-23; Qg = 3.5nC; VDSS = -30V | Lower cost but 9× higher conduction loss; suitable only for ≤1A loads | Select only for cost-sensitive, low-current applications where thermal budget allows |
Compared with DMN10H015LPS-13 and AO3401, DMP1008UCB9 uniquely balances ultra-low RDS(ON), minimal footprint, and logic-level drive-making it optimal for space-constrained, high-efficiency 3–5A power rails where thermal resistance and gate charge directly impact system efficiency.
Availability
DMP1008UCB9 is available at Aetrix Electronics and suitable for DC-DC converters, battery management systems, and load switch applications requiring stable component supply, consistent parametric performance across production lots, and long-term lifecycle support.
Supply support for DMP1008UCB9 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance, high-reliability components for power management, signal integrity, and protection.
DMP1008UCB9 belongs to Diodes' LD-MOS portfolio-engineered specifically for high-density, high-efficiency power conversion in portable and battery-powered systems where thermal and spatial constraints dominate design decisions.
FAQ
What is the maximum safe operating junction temperature for DMP1008UCB9?
The absolute maximum junction temperature is +150°C, and the device is characterized across -55°C to +150°C. Derating begins at +70°C ambient for continuous operation on standard FR-4; thermal design must ensure TJ remains below 150°C under worst-case load and airflow conditions.
Does DMP1008UCB9 require a gate resistor for stability?
A gate resistor is recommended to dampen ringing caused by parasitic inductance in high-speed switching. Typical values range from 5Ω to 22Ω depending on driver strength and layout; 10Ω is validated in the datasheet for tD(ON) and tD(OFF) measurements with minimal overshoot.
Can DMP1008UCB9 be used in automotive applications?
DMP1008UCB9 is not AEC-Q101 qualified. For automotive use, Diodes offers pin-compatible AEC-Q101 variants such as DMP1008UCB9Q-7 (qualified per AEC-Q101 Rev G); contact Diodes or Aetrix for PPAP-ready automotive-grade sourcing.
How does the U-WLB1515-9 package affect PCB layout and reflow?
The U-WLB1515-9 requires precise stencil aperture design (0.12mm thickness, 0.25mm × 0.25mm openings) and reflow profile targeting peak temperature of 245°C for 30–60 seconds. Diodes provides recommended pad layout (1.0mm × 1.0mm solder mask defined) to prevent tombstoning and ensure void-free solder joints.
DMP1008UCB9-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 9-UFBGA, WLBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 8 V
- Current - Continuous Drain (Id) @ 25°C:
- 9.8A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 2.5V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 5.7mOhm @ 2A, 4.5V
- Vgs(th) (Max) @ Id:
- 1.1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 8.2 nC @ 4.5 V
- Vgs (Max):
- -6V
- Input Capacitance (Ciss) (Max) @ Vds:
- 900 pF @ 4 V
- FET Feature:
- -
- Power Dissipation (Max):
- 840mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-WLB1515-9
DMP1008UCB9-7 FAQ
1.How can I place an order for DMP1008UCB9-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMP1008UCB9-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMP1008UCB9-7 reliable?
The price and inventory of DMP1008UCB9-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP1008UCB9-7 is usually 5 days.
3.What payment methods are accepted for DMP1008UCB9-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP1008UCB9-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMP1008UCB9-7?
DMP1008UCB9-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMP1008UCB9-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMP1008UCB9-7?
For technical support, including DMP1008UCB9-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP1008UCB9-7 requirements.
6.How does Aetrix verify that DMP1008UCB9-7 is sourced from the original manufacturer or authorized distributors?
All DMP1008UCB9-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP1008UCB9-7 meets industry standards.
7.What is the process for return or replacement of DMP1008UCB9-7?
All DMP1008UCB9-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMP1008UCB9-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMP1008UCB9-7 part is unused and in its original packaging.
Return procedure for DMP1008UCB9-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DMP1008UCB9-7 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

