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Diodes Incorporated DMP1009UFDF-13
- Part No.:
- DMP1009UFDF-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 6-UDFN Exposed Pad
- Datasheet:
-
DMP1009UFDF-13.pdf
- Description:
- MOSFET P-CH 12V 15A 6UDFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,011
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Product details
Overview
DMP1009UFDF-13 from Diodes Incorporated is a 12V P-channel enhancement-mode MOSFET in U-DFN2020-6 (Type F) package, rated for -11A continuous drain current at VGS = -4.5V, with RDS(ON) as low as 8.3 mΩ (typ), optimized for high-efficiency power management in space-constrained battery-powered systems.
For engineers reviewing the DMP1009UFDF-13 datasheet, DMP1009UFDF-13 pinout, DMP1009UFDF-13 application, or DMP1009UFDF-13 equivalent, this device is selected for low-voltage load switching where ultra-low profile (0.6 mm), minimal PCB footprint (4 mm²), and fast switching with low gate charge (Qg = 26 nC @ VGS = -4.5V) are critical design requirements.
Technical Context
This MOSFET employs a trench-gate process to achieve low RDS(ON) while maintaining robust switching performance: tD(ON) = 7.0 ns and tF = 61 ns under standard test conditions (VDS = -6V, ID = -8A, RG = 1 Ω). Its gate threshold voltage (VGS(TH) = -0.3 to -1.0 V) ensures reliable turn-on with logic-level gate drive down to -2.5 V.
The device integrates a body diode with VSD = -0.8 to -1.2 V at IS = -10 A and exhibits low dynamic parameters: Ciss = 1860 pF, Coss = 498 pF, and Crss = 416 pF at VDS = -10 V - enabling efficient operation in synchronous buck and load-switch topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | -12 V - Maximum blocking voltage for 12 V rail protection and reverse-polarity circuits |
| RDS(ON) max | 11 mΩ @ VGS = -4.5 V - Enables <100 mW conduction loss at 10 A, critical for thermal budget in compact DC-DC stages |
| ID max | -11 A @ TA = +25°C - Supports high-current load switching in portable power banks and USB PD sink applications |
| Qg | 26 nC @ VGS = -4.5 V - Reduces gate drive power and enables >1 MHz switching in high-frequency PMICs |
| RθJA | 63 °C/W (with 1-inch² copper pad) - Allows 2.0 W steady-state dissipation without active cooling in handheld devices |
| tF | 61 ns - Limits switching transition losses during turn-off in synchronous rectification |
Pinout & Package
Package: U-DFN2020-6 (Type F), 2.0 × 2.0 × 0.6 mm, thermally enhanced leadframe with exposed drain pad. RoHS-compliant NiPdAu-plated terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Top View) | Gate (G) | Control input; requires ≤±8 V rating; low Ciss enables fast edge response with minimal gate driver loading |
| Pins 2, 3, 4, 5 | Drain (D) | Power output node; internally connected to exposed thermal pad - must be soldered to PCB copper for thermal and electrical continuity |
| Pin 6 | Source (S) | Reference node for gate drive; connects to system ground or battery negative in high-side switch configurations |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low profile (0.6 mm height) | Enables integration into <1.0 mm Z-height modules such as wearables and ultra-thin IoT sensors |
| 4 mm² PCB footprint | Reduces board area by >50% vs. SO-8 or TSOP-6 equivalents, supporting miniaturized battery management IC layouts |
| Low RDS(ON) at VGS = -2.5 V (19 mΩ) | Ensures full enhancement with single-cell Li-ion (3.0–3.6 V) or regulated 3.3 V supply without level-shifting |
| Fast switching (tD(OFF) = 62.2 ns) | Minimizes dead-time losses in synchronous buck converters operating above 500 kHz |
| Halogen- and antimony-free "Green" construction | Meets IPC-1752A Class 3 material declarations and automotive OEM sustainability mandates |
Applications
| Battery Protection Circuit | USB-C Power Delivery Sink |
|---|---|
|
Use Scenario: Reverse-polarity and overcurrent protection in single-cell Li-ion battery packs for medical pens and Bluetooth earbuds. IC Role / Device Role / Timing Role: High-side load switch controlling battery-to-system power path; activated only when valid voltage and temperature conditions are met. Use Value: 11 mΩ RDS(ON) limits voltage drop to <110 mV at 10 A, preserving battery runtime and enabling accurate fuel gauging. |
Use Scenario: Input power path control in portable USB-C PD adapters accepting up to 20 V input and delivering 5/9/15 V outputs. IC Role / Device Role / Timing Role: Low-side OR-ing switch managing dual-input (wall adapter + power bank) selection with automatic priority handover. Use Value: Fast 61 ns fall time prevents shoot-through during input switchover, ensuring clean 500 ns transition between sources. |
| Industrial Sensor Node Power Gating | Smartphone Camera Module Supply |
|
Use Scenario: Power gating of MEMS accelerometers and BLE radios in battery-operated condition monitoring nodes deployed in remote locations. IC Role / Device Role / Timing Role: Load switch isolating subsystems during deep-sleep mode; controlled via GPIO from microcontroller. Use Value: 100 nA IDSS leakage ensures <1 μA total quiescent current per switched rail, extending 10-year battery life targets. |
Use Scenario: Independent power sequencing and fault isolation for multi-lens camera modules requiring separate 1.2 V, 1.8 V, and 2.8 V supplies. IC Role / Device Role / Timing Role: Individual rail enable switch placed downstream of DC-DC converters to meet strict camera startup timing and reset coordination. Use Value: 0.6 mm height avoids interference with stacked camera lens assemblies and allows placement directly beneath flex connectors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMG1012UVT-7 | RDS(ON) = 14 mΩ @ -4.5 V; 2.5 × 2.0 mm U-DFN2025-6 package; higher RθJA (75 °C/W) | Lower current rating (-7.5 A); less suitable for >8 A continuous loads | Select when board layout allows slightly larger footprint and thermal margin exceeds 1.5 W |
| SI2301DDS-T1-BE3 | RDS(ON) = 115 mΩ @ -2.5 V; SOT-23 package; 1.45 mm height; Qg = 5.5 nC | Higher on-resistance increases conduction loss 10×; better for <1 A loads only | Choose for cost-sensitive, low-current applications where 0.6 mm height is not required |
Compared with DMG1012UVT-7 and SI2301DDS-T1-BE3, DMP1009UFDF-13 delivers superior current density (5.5 A/mm²), lowest thermal resistance among U-DFN2020 options, and optimal balance of low-voltage drive capability and high-frequency switching for next-gen portable power architectures.
Availability
DMP1009UFDF-13 is available at Aetrix Electronics and suitable for battery management systems, USB-C power delivery sinks, and industrial sensor node power gating requiring stable component supply across long-life production programs.
Supply support for DMP1009UFDF-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.
This MOSFET belongs to Diodes' U-DFN Logic-Level Power MOSFET product line, engineered specifically for high-efficiency, space-constrained power management in portable and battery-powered electronics.
FAQ
What is the maximum safe operating junction temperature for DMP1009UFDF-13?
The absolute maximum junction temperature is +150°C, and the device is characterized for operation across -55°C to +150°C. Thermal design must ensure TJ remains below this limit under worst-case ambient and power dissipation conditions - verified using RθJA = 63°C/W with 1-inch² copper and RθJC = 15°C/W for board-level heatsinking.
Can DMP1009UFDF-13 be used in automotive applications?
The standard DMP1009UFDF-13 is not AEC-Q101 qualified. However, the automotive-grade variant DMP1009UFDFQ is available separately, manufactured in IATF 16949-certified facilities and qualified to AEC-Q101 for stress testing including HTGB, HTRB, and temperature cycling.
What is the recommended PCB pad layout for thermal performance?
Diodes specifies a minimum 1-inch² copper pad (2 oz) connected to the exposed drain terminal via ≥4 thermal vias (0.3 mm diameter, 0.8 mm pitch) to internal ground planes. The suggested pad dimensions are provided in the datasheet: X = 0.400 mm, Y = 0.425 mm, X3 = 1.700 mm, Y4 = 2.300 mm.
Does DMP1009UFDF-13 have integrated ESD protection?
No integrated ESD protection circuitry is specified. The device meets HBM ESD rating of ±2 kV (per JEDEC JS-001), but external TVS diodes or RC filters are recommended for systems exposed to human handling or connector hot-plug events, especially in USB-C or battery interface applications.
DMP1009UFDF-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 6-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 12 V
- Current - Continuous Drain (Id) @ 25°C:
- 15A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 11mOhm @ 5A, 4.5V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 44 nC @ 8 V
- Vgs (Max):
- ±8V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1860 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-DFN2020-6 (Type F)
DMP1009UFDF-13 FAQ
1.How can I place an order for DMP1009UFDF-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMP1009UFDF-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMP1009UFDF-13 reliable?
The price and inventory of DMP1009UFDF-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP1009UFDF-13 is usually 5 days.
3.What payment methods are accepted for DMP1009UFDF-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP1009UFDF-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMP1009UFDF-13?
DMP1009UFDF-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMP1009UFDF-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMP1009UFDF-13?
For technical support, including DMP1009UFDF-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP1009UFDF-13 requirements.
6.How does Aetrix verify that DMP1009UFDF-13 is sourced from the original manufacturer or authorized distributors?
All DMP1009UFDF-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP1009UFDF-13 meets industry standards.
7.What is the process for return or replacement of DMP1009UFDF-13?
All DMP1009UFDF-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMP1009UFDF-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMP1009UFDF-13 part is unused and in its original packaging.
Return procedure for DMP1009UFDF-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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