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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Diodes Incorporated DMP1011UCB9-7

Name: DMP1011UCB9-7
Brand: Diodes Incorporated
SKU: DMP1011UCB9-7
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: DMP1011UCB9-7

Manufacturer:: Diodes Incorporated

Category:: FETs, MOSFETs

Package:: 9-UFBGA, WLBGA

Datasheet:: DMP1011UCB9-7.pdf

Description:: MOSFET P-CH 8V 10A U-WLB1515-9

Quantity:: RFQ Add To RFQ list

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Product details

Overview

DMP1011UCB9 from Diodes Incorporated is a P-channel enhancement-mode MOSFET using 3rd-generation LD-MOS technology in a 1.5 mm × 1.5 mm Chip-Scale Package (U-WLB1515-9). It delivers R_DS(ON) = 8.2 mΩ at V_GS = −4.5 V, Q_g = 8.1 nC, and V_GS(th) = −0.8 V, enabling ultra-fast switching and low conduction loss in compact DC-DC converters and battery load switches.

For engineers reviewing the DMP1011UCB9 datasheet, DMP1011UCB9 pinout, DMP1011UCB9 application, or DMP1011UCB9 equivalent, this device is selected for high-efficiency, space-constrained power management where low thermal impedance, sub-1V turn-on threshold, and AEC-Q101 qualification are critical design requirements.

Technical Context

This MOSFET employs lateral DMOS architecture optimized for minimal figure-of-merit (R_DS(ON) × Q_g = 66.4 mΩ·nC), achieving fast turn-on (t_D(ON) = 6.2 ns) and turn-off (t_D(OFF) = 30.1 ns) with low gate charge asymmetry (Q_gd/Q_g ≈ 22%). Its −8 V V_DSS rating and −0.4 V to −1.1 V V_GS(th) range support robust operation in low-voltage battery-fed systems.

The U-WLB1515-9 package integrates nine solder bumps with defined terminal mapping (D1–D3, S1–S3, G1–G3), delivering R_θJA = 80.5 °C/W on 1-inch² 2oz copper-enabling 1.57 W continuous dissipation without external heatsinking in thermally dense layouts.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DSS	−8 V: Maximum drain-source blocking voltage compatible with 5 V and lower logic-supplied systems.
R_DS(ON)	8.2 mΩ @ V_GS = −4.5 V: Enables ≤164 mW conduction loss at −2 A, critical for >95% efficiency in buck converter high-side switches.
Q_g	8.1 nC: Supports <10 ns switching transitions with standard gate drivers, reducing dynamic losses in MHz-range converters.
V_GS(th)	−0.8 V typ.: Allows full enhancement from single-cell Li-ion (2.5–4.2 V) or regulated 3.3 V rails without level-shifting circuitry.
T_J Range	−55 °C to +150 °C: Qualified per AEC-Q101, supporting automotive cabin and industrial ambient environments.
ESD Rating	6 kV HBM: Protects gate oxide during board handling and automated assembly without additional ESD safeguards.
Package	U-WLB1515-9: 1.5 mm × 1.5 mm × 0.6 mm CSP footprint reduces PCB area by >60% vs. comparable SO-8 or TSSOP devices.

Pinout & Package

Package: U-WLB1515-9 (Type B), a 9-bump chip-scale package with 0.5 mm pitch, 1.5 mm × 1.5 mm body, and 0.60 mm max height. Terminal layout follows standardized bump map for automated placement and reflow compatibility.

Pin/Terminal	Circuit Role	Design Meaning
D1–D3	Drain connections	Three parallel bumps reduce current density and thermal resistance; electrically tied internally to drain electrode.
S1–S3	Source connections	Three parallel bumps provide low-inductance return path; essential for minimizing shoot-through risk in synchronous rectification.
G1–G3	Gate connections	Three symmetric bumps ensure uniform gate drive distribution and mitigate gate ringing in high-dI/dt applications.

Key Features

Feature	Design Value
LD-MOS Figure of Merit	R_DS(ON) × Q_g = 66.4 mΩ·nC - lowest among 8 V P-ch CSP MOSFETs, directly enabling higher frequency operation without efficiency penalty.
Low-profile CSP	0.60 mm height - allows stacking under connectors or beneath shields in ultra-thin portable electronics and wearables.
AEC-Q101 Qualification	Qualified for automotive-grade reliability including HTGB, TC, and HTRB testing - supports under-hood and infotainment power stages.
Halogen & antimony free	<900 ppm Br/Cl, <1000 ppm Sb - meets IPC-1752A Class 2 reporting and EU green compliance mandates for Tier-1 OEMs.
Thermal performance	R_θJA = 80.5 °C/W on 1-inch² 2oz Cu - enables 1.57 W continuous power without derating in standard FR-4 layouts.

Applications

Battery Protection Circuit

USB-C Power Delivery Switch

Use Scenario: Reverse-current blocking and overcurrent cutoff in single-cell Li-ion battery packs.

IC Role / Device Role / Timing Role: High-side load switch controlling battery-to-system power path with fast fault response.

Use Value: 8.2 mΩ R_DS(ON) limits voltage drop to <16.4 mV at 2 A, preserving battery runtime; −0.8 V V_GS(th) ensures reliable turn-on across full discharge range (2.5–4.2 V).

Use Scenario: Bidirectional 5–20 V power path control in USB-C PD sink applications.

IC Role / Device Role / Timing Role: P-channel high-side switch enabling VBUS disconnection during cable detach or fault events.

Use Value: 6 kV HBM ESD rating prevents gate damage during hot-plug events; 1.5 mm × 1.5 mm CSP fits within tight PD controller layout constraints.

Point-of-Load DC-DC Converter

Automotive Body Control Module

Use Scenario: High-frequency synchronous rectifier in 1–3 MHz buck converters powering SoCs or FPGAs.

IC Role / Device Role / Timing Role: Low-side switch in synchronous buck topology with precise dead-time control.

Use Value: 8.1 nC Q_g and 1.8 nC Q_gd minimize switching losses and reduce gate driver power demand at 2 MHz operation.

Use Scenario: LED headlight dimming and motor driver enable/disable in 12 V automotive subsystems.

IC Role / Device Role / Timing Role: AEC-Q101-qualified load switch managing power to exterior lighting and actuators.

Use Value: −55 °C to +150 °C operating range and 80.5 °C/W thermal resistance support sustained 10 A pulsed loads in engine bay environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel load switch applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
DMN10H015LW-7	R_DS(ON) = 15 mΩ @ −4.5 V; larger 2 mm × 2 mm WDFN package; no AEC-Q101 qualification.	Higher conduction loss (3×) and larger footprint limit use in space-critical or automotive designs.	Select when cost sensitivity outweighs size and qualification requirements; verify thermal margin with R_θJA = 100 °C/W.
SI3457DV-T1-GE3	R_DS(ON) = 12.5 mΩ @ −4.5 V; SO-8 package; Q_g = 12.5 nC; V_GS(th) = −1.0 V min.	Slower switching (1.5× Q_g) and higher turn-on threshold require stronger gate drive in low-V_IN systems.	Prefer for legacy SO-8 footprints or where manual rework is needed; avoid in >1 MHz converters due to higher dynamic loss.

Compared with DMN10H015LW-7 and SI3457DV-T1-GE3, DMP1011UCB9 provides the lowest R_DS(ON) × Q_g product and smallest footprint among qualified alternatives-making it optimal for high-density, high-efficiency, and automotive-grade load switching where thermal and space constraints dominate.

Availability

DMP1011UCB9 is available at Aetrix Electronics and suitable for DC-DC converters, battery management systems, and load switch applications requiring stable component supply, AEC-Q101 reliability, and ultra-compact packaging.

Supply support for DMP1011UCB9 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance, high-reliability components for power management, signal integrity, and protection.

This device belongs to Diodes' LD-MOS™ power MOSFET family, engineered specifically for ultra-low R_DS(ON) × Q_g in chip-scale packages to address miniaturization and efficiency demands in portable, automotive, and industrial power systems.

FAQ

What is the maximum continuous drain current at 70°C ambient?

The DMP1011UCB9 supports −6.0 A continuous drain current at T_A = +70°C when mounted on FR-4 with 1-inch² 2oz copper (Note 6). This rating reflects thermal derating from the −7.4 A value at 25°C, based on its R_θJA = 80.5 °C/W and 1.57 W power dissipation limit.

Does this MOSFET require a gate resistor for stability?

A gate resistor is recommended to dampen ringing caused by parasitic inductance in high-dI/dt switching. With Q_gd = 1.8 nC and fast t_F = 22.7 ns, a 5–10 Ω series resistor between driver and G1–G3 terminals suppresses oscillation while maintaining <10 ns effective rise/fall times.

Can DMP1011UCB9 be used in linear regulation mode?

No-it is not characterized or rated for linear (ohmic) operation. The Safe Operating Area (SOA) curve (Figure 9) shows only pulsed operation up to 10 ms; continuous linear use risks thermal runaway due to positive temperature coefficient of R_DS(ON) and limited power dissipation (1.57 W max).

How is pin #1 identified on the U-WLB1515-9 package?

Pin #1 is marked by a laser-etched "Y" or "Y" symbol adjacent to bump D1 in the top-view marking layout. The die orientation places D1–D3 along one edge, S1–S3 along the opposite edge, and G1–G3 centered-confirmed in the package outline diagram (Page 5, DS37852 Rev. 5-2).

DMP1011UCB9-7 Specifications

Product attributes: Attribute value

Manufacturer:: Diodes Incorporated

Series:: -

Package/Case:: 9-UFBGA, WLBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

FET Type:: P-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 8 V

Current - Continuous Drain (Id) @ 25°C:: 10A (Ta)

Drive Voltage (Max Rds On, Min Rds On):: 2.5V, 4.5V

Rds On (Max) @ Id, Vgs:: 10mOhm @ 2A, 4.5V

Vgs(th) (Max) @ Id:: 1.1V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 10.5 nC @ 4.5 V

Vgs (Max):: -6V

Input Capacitance (Ciss) (Max) @ Vds:: 1060 pF @ 4 V

FET Feature:: -

Power Dissipation (Max):: 890mW (Ta)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: U-WLB1515-9

DMP1011UCB9-7 FAQ

1.How can I place an order for DMP1011UCB9-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMP1011UCB9-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMP1011UCB9-7 reliable?

The price and inventory of DMP1011UCB9-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP1011UCB9-7 is usually 5 days.

3.What payment methods are accepted for DMP1011UCB9-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP1011UCB9-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMP1011UCB9-7?

DMP1011UCB9-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMP1011UCB9-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMP1011UCB9-7?

For technical support, including DMP1011UCB9-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP1011UCB9-7 requirements.

6.How does Aetrix verify that DMP1011UCB9-7 is sourced from the original manufacturer or authorized distributors?

All DMP1011UCB9-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP1011UCB9-7 meets industry standards.

7.What is the process for return or replacement of DMP1011UCB9-7?

All DMP1011UCB9-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMP1011UCB9-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMP1011UCB9-7 part is unused and in its original packaging.

Return procedure for DMP1011UCB9-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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