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Diodes Incorporated DMP1012UFDF-13
- Part No.:
- DMP1012UFDF-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 6-UDFN Exposed Pad
- Datasheet:
-
DMP1012UFDF-13.pdf
- Description:
- MOSFET P-CH 12V 12.6A/20A 6UDFN
- Quantity:
- Payment:
- Shipping:
Inventory:9,851
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Product details
Overview
DMP1012UFDF-13 from Diodes Incorporated is a 12V P-channel enhancement-mode MOSFET in U-DFN2020-6 (Type F) package, rated for -20A continuous drain current at VGS = -4.5V, with RDS(ON) as low as 11 mΩ (typ), optimized for high-efficiency battery management and DC-DC converter power switches.
For engineers reviewing the DMP1012UFDF-13 datasheet, DMP1012UFDF-13 pinout, DMP1012UFDF-13 application, or DMP1012UFDF-13 equivalent, key selection criteria include gate threshold voltage (-0.5 V typ), thermal resistance (59 °C/W under enhanced layout), body diode forward voltage (-0.8 V typ), and compact 2.0 × 2.0 mm footprint for space-constrained portable power systems.
Technical Context
This MOSFET employs trench-gate technology to achieve low RDS(ON) while maintaining fast switching (tF = 85 ns, tD(OFF) = 71 ns) and low gate charge (Qg = 19.5 nC at VGS = -4.5V). Its -12V VDSS rating and ±8V VGSS support robust operation in 3.3V/5V logic-driven load-switching topologies.
The device integrates a low-VSD body diode (typ -0.8 V at -10A) and exhibits normalized RDS(ON) variation of ≤1.2× across -55°C to +150°C junction temperature, enabling stable performance in thermally aggressive battery pack and PMIC environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | -12 V - Maximum blocking voltage for 1-cell Li-ion and USB PD input stage protection |
| RDS(ON) | 11 mΩ (typ) @ VGS = -4.5V - Enables <100 mW conduction loss at 10A, critical for thermal budget in thin-profile devices |
| ID (cont) | -20 A @ TC = +25°C - Sustains full-rated load in PCB-mounted 1-inch² copper thermal pad configuration |
| Qg | 19.5 nC @ VGS = -4.5V - Reduces gate drive power and enables efficient 1–2 MHz synchronous buck operation |
| RθJA | 59 °C/W (enhanced layout) - Allows 1.36 W power dissipation at TA = +70°C without active cooling |
| VGS(TH) | -0.5 V (typ) - Ensures reliable turn-on with standard 3.3V GPIO or dedicated low-voltage PMIC drivers |
| VSD | -0.8 V (typ) @ IS = -10A - Minimizes reverse conduction loss during synchronous rectification or back-to-back switch operation |
Pinout & Package
U-DFN2020-6 (Type F) package: 2.0 mm × 2.0 mm × 0.6 mm profile, exposed thermal pad (Pin 6), NiPdAu-plated terminals, JEDEC-compliant moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (D) | Drain | Main high-side current path; connected to PCB thermal pad for heat sinking |
| 2 (S) | Source | Reference node for gate control; tied to system ground or battery negative in high-side switch |
| 3 (G) | Gate | CMOS-compatible control input; requires <19.5 nC charge for full enhancement |
| 4 (S) | Source (redundant) | Parallel source connection to reduce bond wire inductance and improve current sharing |
| 5 (D) | Drain (redundant) | Parallel drain connection to lower RDS(ON) and enhance thermal spreading |
| 6 (EP) | Exposed Pad | Thermal and electrical connection to PCB ground plane; mandatory for rated power dissipation |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low profile (0.6 mm height) | Enables integration into <1.0 mm Z-height modules such as smart battery packs and wearables |
| 4 mm² PCB footprint | Reduces board area by >50% vs. SO-8 equivalents while maintaining comparable RDS(ON) |
| Low RDS(ON) at low VGS | 30 mΩ @ VGS = -2.5V supports direct drive from 2.5V/3.3V microcontrollers without level-shifting |
| Fast switching with low Qgd/Qgs | Qgd = 7.9 nC / Qgs = 2.1 nC ratio < 4:1 minimizes Miller-induced shoot-through risk in synchronous converters |
| Halogen- and antimony-free "Green" construction | Meets IPC-1752A Class 3 reporting requirements and supports RoHS 2 (2011/65/EU) compliance |
Applications
| Battery Protection Circuit | USB-C Power Delivery Input Switch |
|---|---|
|
Use Scenario: Reverse-current blocking and overcurrent cutoff in single-cell Li-ion battery packs. IC Role / Device Role / Timing Role: High-side load switch controlling battery discharge path; activated/deactivated within 100 ns of fault detection. Use Value: 11 mΩ RDS(ON) limits voltage drop to <110 mV at 10A, preserving battery runtime and reducing thermal stress on adjacent fuel gauges. |
Use Scenario: Input power path management for USB-C PD 3.0 compliant portable chargers accepting up to 20V input. IC Role / Device Role / Timing Role: P-channel high-side switch enabling/disabling upstream power rail; driven by PD controller's 3.3V GPIO. Use Value: -0.5 V VGS(TH) ensures full enhancement with 3.3V logic, eliminating need for external level shifter and saving BOM cost. |
| DC-DC Synchronous Buck High-Side Switch | Hot-Swap Controller Back-to-Back Pair |
|
Use Scenario: High-side switch in 1–3 MHz buck converters powering FPGA core rails in edge AI modules. IC Role / Device Role / Timing Role: Main power transistor conducting during high-side phase; switched with 71 ns tD(OFF) and 85 ns tF. Use Value: 19.5 nC Qg reduces gate driver losses to <150 µW at 2 MHz, improving overall converter efficiency by ≥0.4% at 5A load. |
Use Scenario: Dual-MOSFET back-to-back configuration in industrial IoT sensor nodes requiring inrush current limiting and bidirectional blocking. IC Role / Device Role / Timing Role: One device configured as source-connected high-side switch; second as drain-connected low-side switch. Use Value: Matched -0.8 V VSD ensures symmetrical forward voltage drop in both directions, simplifying current-sense calibration and fault response. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMG1012T-7 | RDS(ON) = 13 mΩ @ -4.5V (typ), same U-DFN2020-6 package, but higher Qg = 22 nC | Marginally higher gate drive loss; less suitable for >1.5 MHz switching | Select when prioritizing proven field reliability over minimal Qg; identical footprint allows drop-in replacement |
| Si2301DDS-T1-GE3 | RDS(ON) = 105 mΩ @ -2.5V (typ), larger SOT-23 package, lower ID = -2.7A | Not viable for >3A continuous loads; unsuitable for thermal-limited 2 mm² layouts | Consider only for ultra-low-cost, low-current (<2A) applications where board space is unconstrained |
Compared with DMG1012T-7 and Si2301DDS-T1-GE3, DMP1012UFDF-13 delivers superior power density (20A in 4 mm²) and lowest gate charge among U-DFN2020-6 P-ch devices, making it optimal for high-frequency, high-current portable power switches where thermal and layout constraints dominate.
Availability
DMP1012UFDF-13 is available at Aetrix Electronics and suitable for battery management systems, USB-C PD input stages, and high-density DC-DC converters requiring stable component supply, long-term lifecycle assurance, and traceable green-material compliance.
Supply support for DMP1012UFDF-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and protection solutions for consumer, industrial, and automotive markets.
DMP1012UFDF belongs to Diodes' U-DFN ultra-thin MOSFET product line, engineered specifically for space-constrained portable electronics demanding sub-1mm Z-height, low-RDS(ON), and full RoHS/Green compliance.
FAQ
What is the maximum continuous drain current for DMP1012UFDF-13 at 70°C ambient?
The maximum continuous drain current is -16 A at TA = +70°C with standard FR-4 PCB (2 oz copper, minimum pad layout), and -16 A at TC = +70°C under enhanced thermal conditions (1-inch² copper plate). Derating curves in Figure 12 confirm safe operation up to 10A at 70°C ambient with typical layout.
Does DMP1012UFDF-13 require a gate resistor for ESD protection?
No external gate resistor is required for ESD protection-the device features integrated gate protection diodes and meets HBM 2 kV and CDM 1 kV specifications per JEDEC JESD22-A114. A small series resistor (≤10 Ω) may be added to dampen ringing in high-dV/dt applications, but it is not for ESD mitigation.
Can DMP1012UFDF-13 be used in a back-to-back configuration for AC blocking?
Yes-its matched -0.8 V body diode forward voltage and symmetric RDS(ON) characteristics enable reliable bidirectional blocking in back-to-back configurations. The device has been validated in hot-swap controllers for IoT sensors where reverse polarity and inrush protection are required.
Is the exposed thermal pad (Pin 6) electrically isolated or must it be grounded?
The exposed pad (Pin 6) is internally connected to the source terminal and must be soldered to a PCB ground plane or source net. It is not electrically isolated; grounding it provides both thermal relief (reducing RθJA from 172 to 59 °C/W) and low-inductance source return path essential for switching stability.
DMP1012UFDF-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 6-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 12 V
- Current - Continuous Drain (Id) @ 25°C:
- 12.6A (Ta), 20A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 15mOhm @ 5A, 4.5V
- Vgs(th) (Max) @ Id:
- 900mV @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 31 nC @ 8 V
- Vgs (Max):
- ±8V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1344 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 720mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-DFN2020-6 (Type F)
DMP1012UFDF-13 FAQ
1.How can I place an order for DMP1012UFDF-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMP1012UFDF-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMP1012UFDF-13 reliable?
The price and inventory of DMP1012UFDF-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP1012UFDF-13 is usually 5 days.
3.What payment methods are accepted for DMP1012UFDF-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP1012UFDF-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMP1012UFDF-13?
DMP1012UFDF-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMP1012UFDF-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMP1012UFDF-13?
For technical support, including DMP1012UFDF-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP1012UFDF-13 requirements.
6.How does Aetrix verify that DMP1012UFDF-13 is sourced from the original manufacturer or authorized distributors?
All DMP1012UFDF-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP1012UFDF-13 meets industry standards.
7.What is the process for return or replacement of DMP1012UFDF-13?
All DMP1012UFDF-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMP1012UFDF-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMP1012UFDF-13 part is unused and in its original packaging.
Return procedure for DMP1012UFDF-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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