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Diodes Incorporated DMP1022UFDF-13
- Part No.:
- DMP1022UFDF-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 6-UDFN Exposed Pad
- Datasheet:
-
DMP1022UFDF-13.pdf
- Description:
- MOSFET P-CH 12V 9.5A 6UDFN
- Quantity:
- Payment:
- Shipping:
Inventory:6,836
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Product details
Overview
DMP1022UFDF-13 from Diodes Incorporated is a -12V P-channel enhancement-mode MOSFET optimized for battery management systems, featuring 14.8mΩ RDS(ON) at VGS = -4.5V, -9.5A continuous drain current at 25°C, and U-DFN2020-6 (Type F) package with 0.6mm profile. It serves as a high-efficiency load switch or reverse-polarity protection device in portable power rails.
For engineers reviewing the DMP1022UFDF-13 datasheet, DMP1022UFDF-13 pinout, DMP1022UFDF-13 application, or DMP1022UFDF-13 equivalent, key selection criteria include low gate threshold voltage (-0.35V to -0.8V), ESD-protected gate, fast switching (tD(ON) = 25.1ns), thermal resistance (RθJA = 59°C/W with thermal vias), and compliance with RoHS, halogen-free, and antimony-free requirements.
Technical Context
This MOSFET employs a trench-gate silicon process to achieve low on-resistance and stable threshold voltage across temperature. Its negative VGS(TH) enables direct control from common microcontroller GPIOs without level-shifting in high-side switch configurations.
The integrated source-drain diode (VSD = -0.8V at -8A) supports bidirectional current handling in battery charge/discharge paths, while the 2.712nF input capacitance and 48.3nC total gate charge (at VGS = -8V) define drive strength and switching loss trade-offs in DC-DC and power-path applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | -12V - Maximum blocking voltage for battery-side overvoltage protection up to 12V systems |
| RDS(ON) | 14.8mΩ @ VGS = -4.5V - Enables <100mW conduction loss at 9.5A, critical for thermally constrained PCBs |
| ID (cont) | -9.5A @ TA = +25°C - Supports high-current load switching in compact 4mm² footprint |
| VGS(TH) | -0.35V to -0.8V - Ensures reliable turn-on with 3.3V or 5V logic-level gate drive |
| RθJA | 59°C/W (with thermal vias) - Allows 2.1W power dissipation in standard FR-4 layout with copper pour |
| Ciss | 2712pF - Determines required gate driver current for sub-100ns switching transitions |
| Qg | 28.6nC @ VGS = -4.5V - Sets minimum gate drive energy for efficient PWM operation at >100kHz |
Pinout & Package
Package: U-DFN2020-6 (Type F), 2.0mm × 2.0mm × 0.6mm, 6-terminal leadless plastic package with NiPdAu-plated terminals and moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Control terminal; ESD-protected; requires ≤±8V drive; low threshold enables direct MCU interface |
| 2 (S) | Source | Reference node for gate drive; tied to system ground or battery negative in high-side configuration |
| 3 (D) | Drain | Power output terminal; connects to battery positive or load; handles -9.5A continuous current |
| 4 (S) | Source (exposed pad) | Thermal and electrical connection to PCB copper; must be soldered to thermal pad for RθJA = 59°C/W |
| 5 (D) | Drain (exposed pad) | Secondary drain connection; electrically tied to Pin 3; enhances current sharing and thermal conduction |
| 6 (G) | Gate (redundant) | Second gate terminal for improved gate loop inductance control; connected internally to Pin 1 |
Key Features
| Feature | Design Value |
|---|---|
| 0.6mm profile | Enables integration into ultra-thin portable electronics where Z-height is constrained to <1mm |
| 4mm² PCB footprint | Reduces board area by >50% vs. SO-8 equivalents, supporting dense battery management IC layouts |
| ESD-protected gate | HBM rating ≥2kV ensures robustness during assembly and field operation without external protection |
| Low RDS(ON) at low VGS | 19mΩ @ -2.5V allows use with weak-drive controllers (e.g., PMIC LDO outputs) in always-on circuits |
| Halogen & antimony free | Meets IPC-1752A Class 3 reporting; Br+Cl <1500ppm, Sb <1000ppm - required for EU automotive Tier 1 supply chains |
Applications
| Battery Reverse-Polarity Protection | USB-C Power Path Management |
|---|---|
Use Scenario: Preventing damage when Li-ion battery packs are inserted backward into handheld medical devices. IC Role / Device Role / Timing Role: High-side P-channel MOSFET acting as an active rectifier, placed between battery connector and system input rail. Use Value: Eliminates 0.3–0.7V diode drop, preserving >98% of battery voltage under 8A load while enabling fast fault response via gate control. | Use Scenario: Enabling dual-role power delivery (DRP) in portable test equipment that alternates as USB-C host/peripheral. IC Role / Device Role / Timing Role: Load switch controlling VBUS path direction; coordinated with USB PD controller to isolate upstream/downstream power domains. Use Value: 25.1ns turn-on delay and 147ns fall time support dynamic reconfiguration within USB PD 3.0 timing budgets (<500ms). |
| Smart Battery Fuel Gauge Interface | Wireless Charging Receiver Power Switch |
Use Scenario: Isolating fuel gauge IC (e.g., MAX17055) from main system during deep sleep to reduce quiescent current. IC Role / Device Role / Timing Role: Low-leakage (IDSS ≤ -200nA at 25°C) high-side switch placed between battery and fuel gauge VDD rail. Use Value: Cuts system sleep current by >1µA versus Schottky solutions, extending shelf life of sealed IoT sensors. | Use Scenario: Enabling/disabling power delivery from Qi-compliant wireless receiver IC (e.g., BQ51222) to system PMIC during charging cycles. IC Role / Device Role / Timing Role: Fast-switching P-MOSFET controlled by wireless charging controller's enable signal to manage power-path sequencing. Use Value: 48.3nC Qg at -8V allows clean 200kHz PWM gating without shoot-through risk in synchronous rectifier auxiliary supplies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMG1022UFD-7 | RDS(ON) = 15.5mΩ @ -4.5V; same U-DFN2020-6 package; no ESD protection on gate | Lacks integrated ESD diode - requires external TVS in high-noise industrial environments | Select when cost sensitivity outweighs ESD robustness needs and board space permits external protection |
| Si2301DDS-T1-GE3 | RDS(ON) = 115mΩ @ -4.5V; SOT-23 package; higher RθJA = 220°C/W | Higher conduction loss and thermal resistance limit to ≤2A continuous loads | Choose only for legacy SOT-23 footprints where board redesign is prohibited and current demand is <2.5A |
Compared with DMG1022UFD-7 and Si2301DDS-T1-GE3, DMP1022UFDF-13 delivers superior thermal performance (59°C/W vs. ≥220°C/W), lower on-resistance (14.8mΩ vs. 115mΩ), and built-in ESD protection - making it the optimal choice for space-constrained, high-reliability battery management designs requiring >6A continuous current.
Availability
DMP1022UFDF-13 is available at Aetrix Electronics and suitable for battery-powered medical wearables, USB-C portable analyzers, and smart battery packs requiring stable component supply, long-term lifecycle assurance, and RoHS/halogen-free compliance.
Supply support for DMP1022UFDF-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in IATF 16949-certified facilities.
The DMP1022UFDF belongs to Diodes' Ultra-Small Signal and Power MOSFET product line, engineered specifically for space- and efficiency-critical battery protection and power-path control in portable and wearable electronics.
FAQ
What is the maximum safe operating junction temperature for DMP1022UFDF-13?
The absolute maximum junction temperature is +150°C per the datasheet. Continuous operation above +125°C requires derating of ID and PD; thermal design must maintain TJ ≤ 125°C under worst-case ambient and power dissipation to ensure 10-year reliability in consumer applications.
Can DMP1022UFDF-13 be used in automotive applications?
No - DMP1022UFDF-13 is not AEC-Q101 qualified. While its construction uses automotive-grade materials, it lacks PPAP documentation, extended temperature validation (-40°C to +125°C), and failure analysis reports required for automotive use. Diodes offers AEC-Q101 variants like DMP1022UFDFQ-13 for such applications.
How does the dual-source/drain pad configuration affect PCB layout?
Pins 3 (D) and 5 (D), plus Pins 2 (S) and 4 (S), are internally shorted but assigned separate thermal pads. Layout must connect both drain pads to the same high-current copper pour and both source pads to the gate-driver reference plane to minimize loop inductance and maximize heat spreading across the 2.0×2.0mm footprint.
Is the gate threshold voltage shift over temperature significant for precision control?
Yes - VGS(TH) shifts from -0.8V at -55°C to -0.35V at +150°C (Figure 7). For closed-loop gate drive, this ±0.225V variation requires either temperature-compensated biasing or margining in gate resistor selection to avoid unintended turn-off at high temperature or shoot-through at low temperature.
DMP1022UFDF-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 6-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 12 V
- Current - Continuous Drain (Id) @ 25°C:
- 9.5A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.2V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 14.8mOhm @ 4A, 4.5V
- Vgs(th) (Max) @ Id:
- 800mV @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 48.3 nC @ 4.5 V
- Vgs (Max):
- ±8V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2712 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 730mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-DFN2020-6 (Type F)
DMP1022UFDF-13 FAQ
1.How can I place an order for DMP1022UFDF-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMP1022UFDF-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMP1022UFDF-13 reliable?
The price and inventory of DMP1022UFDF-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP1022UFDF-13 is usually 5 days.
3.What payment methods are accepted for DMP1022UFDF-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP1022UFDF-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMP1022UFDF-13?
DMP1022UFDF-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMP1022UFDF-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMP1022UFDF-13?
For technical support, including DMP1022UFDF-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP1022UFDF-13 requirements.
6.How does Aetrix verify that DMP1022UFDF-13 is sourced from the original manufacturer or authorized distributors?
All DMP1022UFDF-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP1022UFDF-13 meets industry standards.
7.What is the process for return or replacement of DMP1022UFDF-13?
All DMP1022UFDF-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMP1022UFDF-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMP1022UFDF-13 part is unused and in its original packaging.
Return procedure for DMP1022UFDF-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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