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Diodes Incorporated DMP1070UCA3-7

Part No.:
DMP1070UCA3-7
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
3-XFDFN
Datasheet:
AetrixDMP1070UCA3-7.pdf
Description:
MOSFET P-CH 12V 3.6A X4DSN0607-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,266

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Product details

Overview

DMP1070UCA3 from Diodes Incorporated is a P-channel enhancement-mode MOSFET optimized for low-RDS(ON) and fast switching in compact power management circuits. It delivers 70 mΩ @ VGS = −4.5 V, −3.6 A continuous drain current at +25°C, and operates with −12 V VDSS, targeting battery protection and load-switching functions in space-constrained portable electronics.

For engineers reviewing the DMP1070UCA3 datasheet, DMP1070UCA3 pinout, DMP1070UCA3 application, or DMP1070UCA3 equivalent, key selection criteria include gate threshold voltage (−0.40 to −0.95 V), thermal resistance (92.2 °C/W under recommended layout), ESD rating (4 kV HBM), and its X4-DSN0607-3 0.22 mm profile package for high-density PCB integration.

Technical Context

This MOSFET employs a trench-gate process to achieve low on-resistance while maintaining controlled gate charge (Qg = 1.45 nC) and low reverse transfer capacitance (Crss = 30 pF). Its −0.66 V typical VGS(TH) enables reliable turn-on from standard logic-level negative gate drive.

The device integrates an intrinsic body diode with VSD = −0.7 to −1.0 V at −0.4 A and exhibits normalized RDS(ON) variation of ≤1.8× across −55°C to +150°C junction temperature, supporting stable operation in thermally dynamic battery systems.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS−12 V - Withstands up to −12 V drain-source blocking voltage without breakdown.
RDS(ON)70 mΩ @ VGS = −4.5 V - Enables <0.1 W conduction loss at 3.6 A, critical for efficiency in battery-fed loads.
ID (continuous)−3.6 A @ TA = +25°C - Supports sustained 3.6 A load switching on FR-4 PCB with minimum pad layout.
Qg1.45 nC - Reduces gate drive power and switching transition time in high-frequency PWM control.
VGS(TH)−0.40 to −0.95 V - Ensures robust turn-on with common −3.3 V or −5 V logic-compatible gate drivers.
RθJA92.2 °C/W - Specifies thermal rise per watt under recommended single-sided FR-4 layout, guiding heatsinking decisions.
ESD Rating4 kV HBM - Protects gate oxide during handling and board assembly without external clamping.

Pinout & Package

Package: X4-DSN0607-3 - ultra-thin (0.22 mm height), 3-terminal leadless package with NiPdAu or NiAu terminations, footprint 0.60 × 0.69 mm, pitch 0.40 mm.

Pin/TerminalCircuit RoleDesign Meaning
1 (Source)Source terminalPrimary current return path; electrically tied to PCB ground plane for thermal and electrical performance.
2 (Gate)Control inputHigh-impedance node requiring clean negative voltage swing (≤−4.5 V) for full enhancement.
3 (Drain)Power outputSwitched high-side or low-side power node; connects to battery cathode or load return in protection circuits.

Key Features

FeatureDesign Value
Low Qg & Qgd1.45 nC total gate charge and 0.28 nC gate-drain charge minimize Miller-induced switching delay and EMI.
0.22 mm profileEnables stacking with other ultra-thin components in slim consumer devices like wearables and hearing aids.
ESD-protected gate4 kV HBM rating eliminates need for external gate protection diodes in most production environments.
Lead-free & greenFully RoHS 3 compliant with <900 ppm Br+Cl and <1000 ppm Sb, meeting automotive and medical regulatory requirements.

Applications

Battery Protection CircuitLoad Switch for Portable Device

Use Scenario: Reverse-current and overcurrent protection in Li-ion battery packs for tablets and power banks.

IC Role / Device Role / Timing Role: High-side P-MOSFET switch controlling battery cathode connection; activated only when system voltage and current are within safe limits.

Use Value: 70 mΩ RDS(ON) limits voltage drop to <260 mV at 3.6 A, preserving battery runtime and reducing thermal stress on adjacent cells.

Use Scenario: Controlled power-up sequencing for USB-C peripheral modules in docking stations.

IC Role / Device Role / Timing Role: Low-side load switch enabling/disabling 3.3 V or 5 V rail to downstream ICs based on host controller command.

Use Value: −0.66 V typical VGS(TH) ensures clean turn-on with standard GPIO, while 0.22 mm height avoids interference with stacked connectors.

Smartphone Power Path ManagementWireless Earbud Charging Case

Use Scenario: Dual-path power routing between USB input and battery during charging in smartphones.

IC Role / Device Role / Timing Role: P-MOSFET used in ideal diode configuration to prevent backfeed and enable seamless source selection.

Use Value: Low Ciss (147 pF) and Crss (30 pF) reduce gate drive burden and improve transient response during path switching.

Use Scenario: Isolating battery from charging circuitry during earbud insertion/removal in compact charging cases.

IC Role / Device Role / Timing Role: Compact load switch placed between case battery and earbud charging contacts to prevent leakage and accidental discharge.

Use Value: X4-DSN0607-3 footprint (0.60 × 0.69 mm) fits tight spacing between battery and PCB edge, enabling sub-20 mm case thickness.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel load switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMN10H023LPS-13RDS(ON) = 23 mΩ @ VGS = −4.5 V; larger TSOP-6 package (1.6 × 2.9 mm); higher ID = −8.5 ASuitable for higher-current industrial load switching where board area is less constrainedSelect when >3.6 A continuous current or lower RDS(ON) is required, accepting larger footprint and higher cost
AO3401RDS(ON) = 85 mΩ @ VGS = −4.5 V; SOT-23 package (2.9 × 1.6 mm); 1.1 mm heightCompatible with legacy SOT-23 footprints but lacks 4 kV HBM ESD rating and green complianceChoose for cost-sensitive, non-automotive designs where existing SOT-23 layout reuse is prioritized over miniaturization and reliability

Compared with DMN10H023LPS-13 and AO3401, DMP1070UCA3 uniquely balances ultra-low profile (0.22 mm), industry-leading ESD robustness (4 kV HBM), and green compliance in a 0.6 × 0.7 mm footprint-making it optimal for next-gen wearable and hearable power switches where vertical stack height and regulatory alignment are critical.

Availability

DMP1070UCA3 is available at Aetrix Electronics and suitable for battery protection, portable load switching, and power path management requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for DMP1070UCA3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and protection solutions for consumer, industrial, and automotive markets.

DMP1070UCA3 belongs to Diodes' X4-DSN ultra-thin MOSFET product line, engineered specifically for space-constrained portable electronics demanding minimal Z-height, high reliability, and simplified compliance with environmental regulations.

FAQ

What is the maximum continuous drain current for DMP1070UCA3 at +70°C ambient?

At TA = +70°C, the DMP1070UCA3 supports −2.9 A continuous drain current when VGS = −4.5 V, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limitations under standard FR-4 mounting conditions with minimum recommended copper area.

Does DMP1070UCA3 require external gate resistors for typical load-switch applications?

No external gate resistor is required for basic on/off load switching at frequencies below 100 kHz. The device's low Qg (1.45 nC) and integrated ESD protection allow direct GPIO or microcontroller drive; however, a 10–100 Ω series resistor is recommended if EMI reduction or ringing suppression is needed in high-speed PWM use.

Can DMP1070UCA3 be used in automotive-grade designs?

DMP1070UCA3 is not AEC-Q101 qualified. While it meets RoHS 3 and green standards, Diodes specifies that automotive applications require explicit qualification-contact Diodes or an authorized representative for PPAP-capable, IATF 16949-manufactured alternatives such as the DMP1045UFD-7.

How does the X4-DSN0607-3 package affect solder reflow profile requirements?

The X4-DSN0607-3 package has Moisture Sensitivity Level 1 per J-STD-020, meaning it can be stored indefinitely at ≤30°C/85% RH without baking. Reflow must follow Diodes' recommended profile: peak temperature ≤260°C, time above 217°C ≤60 seconds, with ramp rates ≤3°C/s to avoid die attach voiding or package warpage.

DMP1070UCA3-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
3-XFDFN
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
P-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
12 V
Current - Continuous Drain (Id) @ 25°C:
3.6A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
1.5V, 4.5V
Rds On (Max) @ Id, Vgs:
70mOhm @ 400mA, 4.5V
Vgs(th) (Max) @ Id:
950mV @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
1.45 nC @ 4.5 V
Vgs (Max):
-6V
Input Capacitance (Ciss) (Max) @ Vds:
147 pF @ 6 V
FET Feature:
-
Power Dissipation (Max):
710mW
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
X4-DSN0607-3

DMP1070UCA3-7 FAQ

1.How can I place an order for DMP1070UCA3-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMP1070UCA3-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMP1070UCA3-7 reliable?

The price and inventory of DMP1070UCA3-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP1070UCA3-7 is usually 5 days.

3.What payment methods are accepted for DMP1070UCA3-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP1070UCA3-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMP1070UCA3-7?

DMP1070UCA3-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMP1070UCA3-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMP1070UCA3-7?

For technical support, including DMP1070UCA3-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP1070UCA3-7 requirements.

6.How does Aetrix verify that DMP1070UCA3-7 is sourced from the original manufacturer or authorized distributors?

All DMP1070UCA3-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP1070UCA3-7 meets industry standards.

7.What is the process for return or replacement of DMP1070UCA3-7?

All DMP1070UCA3-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMP1070UCA3-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMP1070UCA3-7 part is unused and in its original packaging.

Return procedure for DMP1070UCA3-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMP1070UCA3-7 Tags

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