My Inquiry
My Account
Diodes Incorporated DMP2007UFG-13
- Part No.:
- DMP2007UFG-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
DMP2007UFG-13.pdf
- Description:
- MOSFET P-CH 20V 18A PWRDI3333
- Quantity:
- Payment:
- Shipping:
Inventory:6,994
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DMP2007UFG from Diodes Incorporated is a 20V P-channel enhancement-mode MOSFET in POWERDI®3333-8 package, optimized for high-efficiency load switching with RDS(ON) as low as 4.4 mΩ at VGS = −10 V, 40 A continuous drain current capability at TC = +25°C, and −20 V drain-source breakdown voltage - deployed in battery-powered portable electronics power rails.
For engineers reviewing the DMP2007UFG datasheet, DMP2007UFG pinout, DMP2007UFG application, or DMP2007UFG equivalent, key selection criteria include low-voltage gate drive compatibility (−2.5 V threshold), thermal resistance (RθJC = 3.0°C/W), and compact footprint enabling high-density PCB layouts in space-constrained power management systems.
Technical Context
This P-channel MOSFET operates in enhancement mode with gate threshold voltage ranging from −0.4 V to −1.3 V, enabling robust turn-on under low-voltage logic control (e.g., 3.3 V or 5 V microcontroller GPIO). Its body diode exhibits VSD = −0.7 V at −10 A, supporting bidirectional current handling in reverse-polarity protection circuits.
The device features low dynamic parameters: Ciss = 4621 pF, Qg = 39 nC at VGS = −4.5 V, and tF = 51 ns, balancing fast switching with reduced gate drive power - critical for synchronous buck converter high-side switches and hot-swap controllers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS Rating | −20 V - supports input rails up to 16 V with 20 % margin against transients |
| RDS(ON) @ VGS = −10 V | 4.4 mΩ (typ) - limits conduction loss to <0.67 W at 40 A, reducing thermal load |
| ID Continuous @ TC | −40 A - enables high-current load switching without external heatsinking at TC ≤ 25°C |
| Qg @ VGS = −4.5 V | 39 nC - allows efficient gate driving with standard 1-A drivers at ≥1 MHz switching |
| RθJC | 3.0°C/W - provides direct junction-to-case thermal path for board-level heatsinking via exposed drain pad |
| Package | POWERDI®3333-8 - 3.3 mm × 3.3 mm footprint occupying only 33 % of SO-8 area |
Pinout & Package
POWERDI®3333-8 is a thermally enhanced surface-mount package with an exposed drain pad on the bottom side for low-thermal-resistance PCB mounting. The top view shows pins 1–4 on the left side (S, S, S, G) and pins 5–8 on the right side (D, D, D, D), with pin 1 marked by a notch or dot indicator.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 5, 6, 7, 8 | Drain (D) | Internally paralleled terminals - collectively form low-inductance, high-current drain connection tied to exposed copper pad |
| 4 | Gate (G) | Single-point gate input - requires <100 nA leakage control and ESD-safe handling due to ±12 V VGSS rating |
| - (exposed pad) | Drain (D) | Thermal and electrical connection - must be soldered to large PCB copper pour for RθJC = 3.0°C/W performance |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(ON) at low VGS | 7.0 mΩ max @ VGS = −4.5 V - ensures full enhancement with 5 V logic or single-cell Li-ion (3.0–3.6 V) gate drive |
| Thermally optimized package | RθJC = 3.0°C/W - enables >30 W power dissipation with minimal case temperature rise when mounted on 2 oz copper |
| Small footprint density | 3.3 mm × 3.3 mm - reduces board area by 67 % vs SO-8, freeing space for adjacent DC/DC components |
| Green construction | Halogen- and antimony-free, RoHS-compliant - meets IPC-1752A material declaration requirements for industrial and medical end equipment |
Applications
| Battery Reverse-Polarity Protection | USB-C Power Delivery Switching |
|---|---|
|
Use Scenario: Prevents damage to downstream circuitry when Li-ion battery packs are inserted backward into portable medical monitors. IC Role / Device Role / Timing Role: High-side P-channel MOSFET configured as ideal diode replacement, conducting only when VIN polarity matches design intent. Use Value: Eliminates 0.3–0.7 V forward drop of Schottky diodes, preserving >98 % of battery energy during normal operation. |
Use Scenario: Enables bidirectional 20 V/3 A power routing in USB-C docking stations supporting DisplayPort Alt Mode and PD 3.0. IC Role / Device Role / Timing Role: Load switch controlling VBUS path between source and sink ports, responding within 100 µs to PD contract negotiation signals. Use Value: Low RDS(ON) minimizes voltage droop (<25 mV at 3 A), maintaining PD compliance across full operating temperature range. |
| Hot-Swap Controller Back-End | Industrial PLC I/O Module Protection |
|
Use Scenario: Safely inserts 24 V field power into programmable logic controller backplanes without supply rail disturbance. IC Role / Device Role / Timing Role: Current-limited high-side switch controlled by dedicated hot-swap IC (e.g., LTC4215), limiting inrush to <1 A. Use Value: 5.5 mΩ RDS(ON) ensures <130 mW conduction loss at 5 A, avoiding thermal shutdown during sustained operation. |
Use Scenario: Isolates 24 V sensor inputs in factory automation modules subject to frequent cable disconnect/reconnect cycles. IC Role / Device Role / Timing Role: Overvoltage-protected load switch placed upstream of analog front-end, rated for repeated 40 V transients per IEC 61000-4-4. Use Value: −20 V VDS rating with 20 % margin accommodates 24 V nominal rails plus 30 % surge, eliminating need for external TVS clamping. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMT2007LPSQ-13 | Same RDS(ON) (4.4 mΩ typ), but in smaller POWERDI™5060-8 (5.0 × 6.0 mm); higher RθJA = 62°C/W | Preferred where mechanical clearance >5 mm exists but thermal mass is limited | Select when board layout permits larger footprint but demands lower gate charge (Qg = 28 nC) |
| Si7157DP-T1-GE3 | Higher VDS (−30 V), higher RDS(ON) (8.5 mΩ @ −4.5 V), SO-8 package | Used in legacy designs requiring SO-8 footprint compatibility and wider voltage margin | Choose only if existing PCB silkscreen and stencil require SO-8; otherwise avoid due to 54 % larger area and 22 % higher conduction loss |
Compared with DMP2007UFG, DMT2007LPSQ-13 trades footprint size for slightly better gate drive efficiency, while Si7157DP-T1-GE3 sacrifices density and efficiency to maintain legacy SO-8 compatibility - making DMP2007UFG optimal for new compact, thermally constrained 20 V power rails.
Availability
DMP2007UFG is available at Aetrix Electronics and suitable for battery-powered medical devices, USB-C peripheral hubs, and industrial PLC I/O modules requiring stable component supply, long-term lifecycle support, and RoHS-compliant green manufacturing.
Supply support for DMP2007UFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.
DMP2007UFG belongs to Diodes' POWERDI® high-current MOSFET product line, engineered specifically for space-constrained, thermally demanding load-switching and reverse-polarity protection in portable and industrial power systems.
FAQ
What is the maximum safe operating junction temperature for DMP2007UFG?
The absolute maximum junction temperature is +150°C, verified per JEDEC JESD22-A104. Operation above this limit risks permanent parametric shift or bond-wire failure. Derating is required above +125°C ambient; thermal simulation using RθJA = 58°C/W (FR-4, 2 oz Cu) confirms safe operation up to 12.5 W at +70°C ambient with recommended pad layout.
Can DMP2007UFG be used in linear regulation mode?
No - DMP2007UFG is not characterized or guaranteed for linear (ohmic) operation. Its Safe Operating Area (SOA) curve (Figure 12) shows only pulsed operation beyond 10 ms is limited by RDS(ON), and continuous DC operation above 2.3 W at +25°C ambient exceeds its package power rating. Use only in saturated switching mode.
Is the exposed drain pad electrically isolated from other terminals?
No - the exposed drain pad is internally connected to all drain pins (pins 1, 2, 3, 5, 6, 7, 8) and must be soldered to a PCB copper pour designated as the system drain net. It is not insulated; isolation requires external dielectric layer or spacing per IPC-2221B creepage/clearance rules.
Does DMP2007UFG support gate drive from 3.3 V microcontrollers?
Yes - with VGS(TH) as low as −0.4 V, the device turns on strongly at VGS = −3.3 V, delivering RDS(ON) ≈ 6.5 mΩ (max) at −10 A. However, full 40 A current capability requires VGS ≤ −4.5 V; for 3.3 V logic, confirm load current stays below 15 A to maintain <100 mW conduction loss.
DMP2007UFG-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 18A (Ta), 40A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 2.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 5.5mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 1.3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 85 nC @ 10 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 4621 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.3W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- POWERDI3333-8
DMP2007UFG-13 FAQ
1.How can I place an order for DMP2007UFG-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMP2007UFG-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMP2007UFG-13 reliable?
The price and inventory of DMP2007UFG-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP2007UFG-13 is usually 5 days.
3.What payment methods are accepted for DMP2007UFG-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP2007UFG-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMP2007UFG-13?
DMP2007UFG-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMP2007UFG-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMP2007UFG-13?
For technical support, including DMP2007UFG-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP2007UFG-13 requirements.
6.How does Aetrix verify that DMP2007UFG-13 is sourced from the original manufacturer or authorized distributors?
All DMP2007UFG-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP2007UFG-13 meets industry standards.
7.What is the process for return or replacement of DMP2007UFG-13?
All DMP2007UFG-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMP2007UFG-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMP2007UFG-13 part is unused and in its original packaging.
Return procedure for DMP2007UFG-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DMP2007UFG-13 Tags
-
BSZ180P03NS3EGATMA1
Infineon Technologies
-
SIRA14DP-T1-GE3
Vishay Siliconix
-
AO4419
Alpha & Omega Semiconductor Inc.
-
SISA14BDN-T1-GE3
Vishay Siliconix
-
PSMN9R5-30YLC,115
Nexperia USA Inc.
-
BUK9Y21-40E,115
Nexperia USA Inc.
-
RTQ035N03HZGTR
Rohm Semiconductor
-
FDMS7680
onsemi
-
RQ3E180BNTB
Rohm Semiconductor
-
STL6N2VH5
STMicroelectronics
-
DMPH4029LFGQ-7
Diodes Incorporated
-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
