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Diodes Incorporated DMP2010UFV-13

Part No.:
DMP2010UFV-13
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
8-PowerVDFN
Datasheet:
AetrixDMP2010UFV-13.pdf
Description:
MOSFET P-CH 20V 50A POWERDI3333
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,873

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Product details

Overview

DMP2010UFV-13 from Diodes Incorporated is a 20V P-channel enhancement-mode MOSFET in PowerDI3333-8 (Type UX) package, rated for -50A continuous drain current at TC = +25°C, with RDS(ON) of 9.5mΩ @ VGS = -4.5V and -20V VDSS. It serves as a high-current load switch in compact power management circuits requiring low conduction loss and thermally efficient board layout.

For engineers reviewing the DMP2010UFV-13 datasheet, DMP2010UFV-13 pinout, DMP2010UFV-13 application, or DMP2010UFV-13 equivalent, key selection criteria include verified RDS(ON) at low gate drive (-2.5V/-4.5V), thermal resistance (RθJC = 3.5°C/W), safe operating area under pulsed loads, and compatibility with FR-4 PCB layouts using exposed-drain thermal bias.

Technical Context

This P-channel MOSFET employs trench-gate silicon technology to achieve ultra-low on-resistance while maintaining fast switching performance (tD(ON) = 9.7ns, tD(OFF) = 235ns) and robust avalanche capability (EAS = 64mJ). Its gate threshold voltage range (-0.4V to -1.2V) enables reliable turn-on with standard logic-level negative gate drive.

The device integrates a body diode with VSD = -0.7V to -1.2V at -10A and exhibits controlled reverse recovery (tRR = 64ns, QRR = 60nC), supporting synchronous rectification and bidirectional current handling in DC-DC converters and hot-swap circuits.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS -20V - Maximum drain-source blocking voltage for 20V rail applications
RDS(ON) 9.5mΩ @ VGS = -4.5V - Enables ≤1.7W conduction loss at -3.6A, critical for thermal budget in dense layouts
ID (max) -50A @ TC = +25°C - Supports high-current load switching without external heatsinking on properly biased PCB
Qg 50nC @ VGS = -4.5V - Determines gate driver strength requirement for <100ns switching transitions
RθJC 3.5°C/W - Confirms direct thermal path from junction to exposed drain pad, enabling >1.5W dissipation with 5°C rise
EAS 64mJ - Specifies single-pulse avalanche energy handling for inductive load transients in power rails

Pinout & Package

Package: PowerDI3333-8 (Type UX), surface-mount, thermally enhanced with exposed drain pad. Dimensions: 3.30 × 3.30 × 0.80 mm (D × E × A), 0.65 mm pitch, matte tin-plated copper leadframe.

Pin/Terminal Circuit Role Design Meaning
1, 2, 3, 4, 5, 6, 7, 8 (all drain-connected) Drain (D) Internally paralleled terminals forming low-inductance, high-current path to exposed copper pad - primary thermal and power conduction node
Pin 1 (top-left corner marker) Source (S) Primary source connection; used for gate control reference and current return path in high-side switch configurations
Pin 8 (bottom-right corner) Gate (G) Control input; requires negative voltage relative to source to turn on; low Ciss (3350pF) reduces driver loading

Key Features

Feature Design Value
Low RDS(ON) at -2.5V gate drive 12.5mΩ - Enables full turn-on from 2.5V logic-compatible controllers without level-shifting circuitry
Thermally optimized package RθJC = 3.5°C/W - Delivers 2× power dissipation vs. SO-8 in same footprint, validated on 2oz copper FR-4 with thermal bias
Board area reduction 33% of SO-8 footprint - Frees PCB space for additional passive components or routing in space-constrained modules
Green construction Halogen- and antimony-free, RoHS-compliant - Meets IPC-1752A material declaration requirements for industrial and consumer end products

Applications

USB Type-C Power Delivery Industrial PLC I/O Modules

Use Scenario: Bidirectional 20V/3A power path control with overcurrent protection and reverse polarity blocking.

IC Role / Device Role: High-side load switch managing VBUS sourcing/sinking during PD contract negotiation.

Use Value: 9.5mΩ RDS(ON) limits voltage drop to <30mV at 3A, preserving PD voltage compliance margins.

Use Scenario: 24V DC field power distribution with individual channel enable/disable and short-circuit protection.

IC Role / Device Role: P-channel high-side switch per I/O channel, driven by isolated microcontroller GPIOs.

Use Value: -50A rating supports surge currents up to 80A (IDM), ensuring reliability during solenoid or relay coil energization.

Automotive Body Control Module Server VRM Output Stage

Use Scenario: 12V battery-supplied lighting and accessory load switching with load-dump transient resilience.

IC Role / Device Role: Protected high-side switch interfacing with CAN-controlled MCU outputs.

Use Value: 64mJ avalanche energy rating withstands ISO 7637-2 Pulse 5a transients without clamping diodes.

Use Scenario: Multiphase synchronous buck converter high-side switch in 12V-to-1V VRMs for AI accelerators.

IC Role / Device Role: Complementary P-channel switch paired with N-channel driver in dual-phase topology.

Use Value: Low Qg (50nC) and fast tD(OFF) (235ns) minimize dead-time losses at 500kHz–1MHz switching frequencies.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel load switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMT2001UFDF-7 RDS(ON) = 11.5mΩ @ -4.5V; smaller PowerDI3333-8 variant with 0.5mm lower height (0.3mm) Lower profile suits ultra-thin mobile power banks; reduced thermal mass limits sustained 50A operation Select when mechanical clearance <0.8mm is mandatory and peak current ≤35A suffices
Si7157DP-T1-GE3 RDS(ON) = 8.0mΩ @ -4.5V; SO-8 package with higher RθJA (62°C/W vs. 122°C/W) Larger footprint increases PCB cost but simplifies rework; higher thermal resistance demands heatsinking above 20W Select when legacy SO-8 assembly lines are in place and thermal design includes copper pour or heatsink attachment

Compared with DMP2010UFV-13, DMT2001UFDF-7 trades 2.0mΩ higher RDS(ON) for 0.3mm height reduction, while Si7157DP-T1-GE3 improves conduction loss by 1.5mΩ but requires 2.5× more board area and delivers only half the thermal efficiency in unheatsinked layouts.

Availability

DMP2010UFV-13 is available at Aetrix Electronics and suitable for USB Type-C power delivery systems, industrial PLC I/O modules, and automotive body control units requiring stable component supply, long-term lifecycle support, and traceable green-material compliance.

Supply support for DMP2010UFV-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and the U.S.

The PowerDI3333-8 MOSFET product line targets high-density power management in space-constrained applications, emphasizing thermal efficiency, low gate charge, and compatibility with automated SMT assembly processes.

FAQ

What is the maximum allowable gate-source voltage for DMP2010UFV-13?

The absolute maximum VGS rating is ±10V. Operation beyond this risks irreversible gate oxide damage. For reliable long-term use, gate drive should be limited to -4.5V to -8V during turn-on and 0V during turn-off, matching the specified RDS(ON) test conditions and avoiding Miller plateau overstress.

Can DMP2010UFV-13 be used in parallel configurations?

Yes - its negative temperature coefficient of RDS(ON) (normalized resistance increases with junction temperature) enables inherent current sharing. Parallel operation requires matched gate drive impedance, symmetrical PCB layout, and shared thermal plane to maintain <5°C inter-device ΔT for balanced current distribution up to -100A total.

Is the exposed drain pad electrically isolated from other terminals?

No - the exposed drain pad is internally connected to all eight drain pins (1–7 and 8 in some variants; confirmed as drain in DS39131 Fig. "PowerDI3333-8 (Type UX) Top View"). It must be soldered to a dedicated PCB copper pour tied to the system ground or power rail, not left floating or insulated.

Does DMP2010UFV-13 require a gate resistor for stability?

A series gate resistor (typically 4.7Ω–10Ω) is recommended to dampen ringing caused by gate loop inductance and Crss feedback. The datasheet's dynamic test condition (RG = 4.7Ω) confirms this value achieves optimal tD(ON)/tD(OFF) balance without excessive switching loss or oscillation in typical 2-layer FR-4 layouts.

DMP2010UFV-13 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
8-PowerVDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
P-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
20 V
Current - Continuous Drain (Id) @ 25°C:
50A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
2.5V, 4.5V
Rds On (Max) @ Id, Vgs:
9.5mOhm @ 3.6A, 4.5V
Vgs(th) (Max) @ Id:
1.2V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
103 nC @ 10 V
Vgs (Max):
±10V
Input Capacitance (Ciss) (Max) @ Vds:
3350 pF @ 10 V
FET Feature:
-
Power Dissipation (Max):
2W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PowerDI3333-8

DMP2010UFV-13 FAQ

1.How can I place an order for DMP2010UFV-13 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMP2010UFV-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMP2010UFV-13 reliable?

The price and inventory of DMP2010UFV-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP2010UFV-13 is usually 5 days.

3.What payment methods are accepted for DMP2010UFV-13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP2010UFV-13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMP2010UFV-13?

DMP2010UFV-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMP2010UFV-13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMP2010UFV-13?

For technical support, including DMP2010UFV-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP2010UFV-13 requirements.

6.How does Aetrix verify that DMP2010UFV-13 is sourced from the original manufacturer or authorized distributors?

All DMP2010UFV-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP2010UFV-13 meets industry standards.

7.What is the process for return or replacement of DMP2010UFV-13?

All DMP2010UFV-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMP2010UFV-13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMP2010UFV-13 part is unused and in its original packaging.

Return procedure for DMP2010UFV-13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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