My Inquiry
My Account
Diodes Incorporated DMP2033UCB9-7
- Part No.:
- DMP2033UCB9-7
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 9-UFBGA, WLBGA
- Datasheet:
-
DMP2033UCB9-7.pdf
- Description:
- MOSFET P-CH 20V 4.2A U-WLB1515-9
- Quantity:
- Payment:
- Shipping:
Inventory:5,716
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DMP2033UCB9 from Diodes Incorporated is a P-channel enhancement-mode MOSFET in a 1.5 mm × 1.5 mm CSP package, rated for -20 V VDSS, 28 mΩ RDS(on) at VGS = -4.5 V, and 5.4 nC total gate charge. It delivers low on-state loss and fast switching for compact battery protection and load-switching circuits in portable electronics.
For engineers reviewing the DMP2033UCB9 datasheet, DMP2033UCB9 pinout, DMP2033UCB9 application, or DMP2033UCB9 equivalent, key selection criteria include its -0.6 V typical gate threshold voltage, AEC-Q101 qualification, 3 kV HBM ESD rating, and thermal resistance of 69 °C/W on 1-in² copper-critical for space-constrained, high-reliability power management designs.
Technical Context
This MOSFET employs LD-MOS technology to achieve a low figure of merit (RDS(on) × Qg = 151 mΩ·nC), enabling high-efficiency operation in bidirectional blocking configurations. Its -0.4 V to -1.1 V gate threshold range ensures reliable turn-on with low-voltage control signals down to -1.8 V.
The U-WLB1515-9 package integrates nine solder bumps in a 3×3 array with 0.5 mm pitch, supporting ultra-thin PCB assembly. Thermal performance is optimized via direct die-to-PCB conduction, yielding 69 °C/W RθJA under enhanced copper layout conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | -20 V - Supports full battery voltage margin for single-cell Li-ion (up to 4.35 V) with safety headroom in reverse-polarity protection. |
| RDS(on) | 28 mΩ @ VGS = -4.5 V - Limits conduction loss to ≤130 mW at 2 A continuous drain current. |
| Qg | 5.4 nC - Enables <10 ns turn-on delay and <12 ns rise time with 2 Ω gate drive, suitable for 1–2 MHz switching. |
| VGS(th) | -0.6 V typ. - Allows direct interface with 1.8 V or 2.5 V logic without level-shifting circuitry. |
| TJ Range | -55 °C to +150 °C - Qualified per AEC-Q101, enabling use in automotive cabin and industrial ambient environments. |
| ESD Rating | 3 kV HBM - Protects gate integrity during automated PCB assembly and handling without external clamping. |
Pinout & Package
Package: U-WLB1515-9 - 1.5 mm × 1.5 mm × 0.62 mm chip-scale package with 9 solder bumps (3×3 array, 0.5 mm pitch), no leads, bottom-side thermal path.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Bump A1 | Source | Primary current return path; electrically and thermally connected to internal die substrate. |
| Bump A2 | Source | Parallel source connection to reduce bond wire inductance and improve current sharing. |
| Bump A3 | Source | Third source bump enhancing thermal dissipation and reducing RDS(on) variance across temperature. |
| Bump B1 | Gate | Control input; isolated by oxide layer; requires ESD-safe handling due to 3 kV HBM sensitivity. |
| Bump B2 | Drain | Main power output terminal; connects directly to die drain region; handles -30 A pulsed current. |
| Bump B3 | Drain | Secondary drain bump improving current distribution and reducing localized heating at high ID. |
| Bump C1 | Source | Fourth source connection reinforcing low-impedance return path for high di/dt load switching. |
| Bump C2 | Drain | Third drain bump supporting symmetrical current flow and minimizing package parasitic inductance. |
| Bump C3 | Source | Fifth and final source bump completing 5-source / 4-drain asymmetry optimized for unidirectional load switch duty. |
Key Features
| Feature | Design Value |
|---|---|
| LD-MOS process technology | Enables 28 mΩ RDS(on) at -4.5 V while maintaining <115 pF Crss for stable high-frequency gate drive. |
| Ultra-low VGS(th) | -0.6 V typical threshold allows direct control from 1.8 V microcontroller GPIOs without external bias networks. |
| U-WLB1515-9 footprint | 1.5 mm × 1.5 mm area saves >70% board space vs. SOT-23; 0.62 mm height enables ultra-thin wearable designs. |
| AEC-Q101 qualification | Validated for automotive-grade reliability including HTOL, TC, and ESD stress-suitable for infotainment and body control modules. |
| 3 kV HBM ESD protection | Eliminates need for discrete gate protection diodes in production lines handling bare PCBs pre-assembly. |
Applications
| Battery Protection Circuit | USB-C Load Switch |
|---|---|
|
Use Scenario: Reverse-current blocking and overcurrent shutdown in single-cell Li-ion battery packs. IC Role / Device Role / Timing Role: High-side P-channel switch controlled by battery management IC to isolate cell during fault conditions. Use Value: 28 mΩ RDS(on) limits voltage drop to <116 mV at 4.2 A, preserving battery runtime and enabling accurate Coulomb counting. |
Use Scenario: Power delivery path control in USB-C port controllers managing 5 V/3 A bus power. IC Role / Device Role / Timing Role: Low-latency load switch enabling <50 ns response to VBUS enable/disable commands. Use Value: 5.4 nC Qg supports clean 100 ns turn-on with minimal overshoot, meeting USB PD 3.0 power state transition timing. |
| Smartphone Power Rail Isolation | Automotive Cabin Sensor Module |
|
Use Scenario: Independent power gating of camera, display, and modem subsystems to minimize standby leakage. IC Role / Device Role / Timing Role: Always-on P-MOSFET isolating auxiliary rails during deep-sleep modes. Use Value: -0.6 V VGS(th) ensures full enhancement with 1.8 V PMIC control outputs, eliminating boot-up sequencing delays. |
Use Scenario: Power switching for LIN-connected seat occupancy sensors and ambient light modules. IC Role / Device Role / Timing Role: AEC-Q101-qualified high-side switch interfacing with 3.3 V automotive microcontrollers. Use Value: -55 °C to +150 °C operating range and 69 °C/W RθJA ensure stable operation in under-hood temperature cycling without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMG2305UVT-7 | RDS(on) = 42 mΩ @ -4.5 V; Qg = 7.2 nC; SOT-23 package (2.9 mm × 1.6 mm) | Larger footprint and higher conduction loss; better thermal mass for intermittent loads | Select when board space permits larger package and lower gate drive strength is acceptable. |
| AO3401A | RDS(on) = 44 mΩ @ -4.5 V; VGS(th) = -0.7 V min; TSOP-6 package (3.0 mm × 1.6 mm) | Higher threshold spread (-0.7 V to -1.3 V); less predictable turn-on with 1.8 V logic | Prefer only where cost sensitivity outweighs precision gate control and thermal performance requirements. |
Compared with DMG2305UVT-7 and AO3401A, DMP2033UCB9 offers superior RDS(on)/Qg ratio and smallest footprint-critical for wearables and multi-rail mobile SoCs-while its tighter VGS(th) tolerance ensures deterministic switching with low-voltage controllers.
Availability
DMP2033UCB9 is available at Aetrix Electronics and suitable for battery protection, USB-C load switching, and automotive sensor module power management requiring stable component supply and long-term lifecycle support.
Supply support for DMP2033UCB9 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management and signal integrity solutions for consumer, industrial, and automotive markets.
DMP2033UCB9 belongs to Diodes' ultra-compact power MOSFET product line, engineered specifically for space-constrained, high-reliability load-switching applications where thermal density and gate-drive compatibility with low-voltage logic are primary design constraints.
FAQ
What is the maximum continuous drain current for DMP2033UCB9 at 70°C ambient?
At TA = +70°C with 1-inch² 2-oz copper pad, the continuous drain current is -4.5 A. This rating reflects thermal derating from the -5.8 A value at 25°C, based on the 69 °C/W junction-to-ambient thermal resistance and 150°C maximum junction temperature limit.
Does DMP2033UCB9 require external gate resistors for stability?
No external gate resistor is required for basic switching, but a 2–10 Ω series resistor is recommended to dampen ringing caused by package inductance and PCB trace inductance. The device's 26.1 Ω intrinsic gate resistance and low Crss (86–115 pF) provide inherent Miller immunity in typical 1–2 MHz DC-DC applications.
Can DMP2033UCB9 be used in synchronous rectification?
No-it is a P-channel enhancement-mode MOSFET optimized for high-side switching, not synchronous rectification. Its body diode forward voltage is -0.7 V (typ.) at -2 A, and it lacks the low Qrr (<5 nC) and fast trr (<20 ns) required for efficient synchronous buck secondary-side operation.
Is the U-WLB1515-9 package compatible with standard reflow profiles?
Yes-the U-WLB1515-9 package is qualified for IPC/JEDEC J-STD-020D-compliant lead-free reflow, with peak temperature up to 260°C for ≤30 seconds. Its copper pillar interconnects withstand thermal cycling better than traditional solder bumps, supporting ≥1000 cycles between -40°C and +125°C.
DMP2033UCB9-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 9-UFBGA, WLBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 4.2A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 33mOhm @ 2A, 4.5V
- Vgs(th) (Max) @ Id:
- 1.1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 7 nC @ 4.5 V
- Vgs (Max):
- -6V
- Input Capacitance (Ciss) (Max) @ Vds:
- 500 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-WLB1515-9
DMP2033UCB9-7 FAQ
1.How can I place an order for DMP2033UCB9-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMP2033UCB9-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMP2033UCB9-7 reliable?
The price and inventory of DMP2033UCB9-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP2033UCB9-7 is usually 5 days.
3.What payment methods are accepted for DMP2033UCB9-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP2033UCB9-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMP2033UCB9-7?
DMP2033UCB9-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMP2033UCB9-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMP2033UCB9-7?
For technical support, including DMP2033UCB9-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP2033UCB9-7 requirements.
6.How does Aetrix verify that DMP2033UCB9-7 is sourced from the original manufacturer or authorized distributors?
All DMP2033UCB9-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP2033UCB9-7 meets industry standards.
7.What is the process for return or replacement of DMP2033UCB9-7?
All DMP2033UCB9-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMP2033UCB9-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMP2033UCB9-7 part is unused and in its original packaging.
Return procedure for DMP2033UCB9-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DMP2033UCB9-7 Tags
-
BSZ180P03NS3EGATMA1
Infineon Technologies
-
SIRA14DP-T1-GE3
Vishay Siliconix
-
AO4419
Alpha & Omega Semiconductor Inc.
-
SISA14BDN-T1-GE3
Vishay Siliconix
-
PSMN9R5-30YLC,115
Nexperia USA Inc.
-
BUK9Y21-40E,115
Nexperia USA Inc.
-
RTQ035N03HZGTR
Rohm Semiconductor
-
FDMS7680
onsemi
-
RQ3E180BNTB
Rohm Semiconductor
-
STL6N2VH5
STMicroelectronics
-
DMPH4029LFGQ-7
Diodes Incorporated
-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
