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Diodes Incorporated DMP2040UFDF-13
- Part No.:
- DMP2040UFDF-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 6-UDFN Exposed Pad
- Datasheet:
-
DMP2040UFDF-13.pdf
- Description:
- MOSFET P-CH 20V 13A 6UDFN
- Quantity:
- Payment:
- Shipping:
Inventory:7,355
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Product details
Overview
DMP2040UFDF-13 from Diodes Incorporated is a P-channel enhancement-mode MOSFET in U-DFN2020-6 (Type F) package, rated for -20V VDSS, 32mΩ RDS(ON) @ VGS = -4.5V, and -13A ID at TC = +25°C. It serves as a low-profile, high-efficiency power switch in battery management and DC-DC converter output stages.
For engineers reviewing the DMP2040UFDF-13 datasheet, DMP2040UFDF-13 pinout, DMP2040UFDF-13 application, or DMP2040UFDF-13 equivalent, key selection criteria include gate threshold voltage (-0.6 to -1.5V), thermal resistance (RθJC = 16°C/W), body diode forward voltage (-0.7 to -1.2V), and ultra-low 0.6mm profile for space-constrained PCB layouts.
Technical Context
This MOSFET employs a trench-gate process optimized for low RDS(ON) while maintaining fast switching performance: tD(ON) = 5.8ns, tF = 14.6ns, and Qg = 8.6nC at VGS = -4.5V. Its negative gate threshold enables direct logic-level drive from 3.3V/5V controllers without level shifting.
The device integrates a robust body diode with tRR = 9.8ns and QRR = 2.7nC, supporting synchronous rectification and reverse recovery in buck converters. Thermal design is enabled by an exposed drain pad and RθJC = 16°C/W, allowing efficient heat transfer to the PCB ground plane.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | -20V - Supports input rails up to 16V with 20% derating for reliability in portable power systems. |
| RDS(ON) | 32mΩ @ VGS = -4.5V - Enables ≤330mW conduction loss at 10A, critical for thermally constrained battery-powered designs. |
| ID (TC = 25°C) | -13A - Sustains high pulsed load currents in power delivery paths without thermal runaway under proper PCB copper layout. |
| VGS(TH) | -0.6 to -1.5V - Ensures full enhancement with standard 3.3V GPIOs; eliminates need for gate driver ICs in low-voltage control circuits. |
| RθJC | 16°C/W - Allows direct junction-to-PCB thermal path via exposed drain pad, enabling >1W continuous dissipation with 1-inch² 2oz copper thermal pad. |
| Qg | 8.6nC @ VGS = -4.5V - Minimizes gate drive power and switching losses in high-frequency (>1MHz) DC-DC applications. |
| tRR | 9.8ns - Reduces shoot-through risk and EMI in synchronous buck topologies operating above 500kHz. |
Pinout & Package
U-DFN2020-6 (Type F) package with 0.6mm maximum height, 2.0×2.0mm footprint, and exposed drain pad for thermal and electrical connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Top View) | Source | Primary current return path; tied to system ground or low-side reference in high-side switch configurations. |
| Pin 2 | Gate | Control input requiring <100nA leakage; sensitive to ESD but compatible with standard microcontroller GPIOs. |
| Pin 3 | Drain | High-current output node connected to exposed pad; must be soldered to large copper area for thermal management. |
| Pin 4 | Source | Second source terminal - paralleled internally with Pin 1 to reduce package inductance and improve current sharing. |
| Pin 5 | Gate | Redundant gate connection - used to minimize gate loop inductance and suppress ringing during fast switching transitions. |
| Pin 6 (Exposed Pad) | Drain | Primary thermal and power path; electrically identical to Pin 3 and required for rated current and thermal performance. |
Key Features
| Feature | Design Value |
|---|---|
| 0.6mm profile | Enables integration into ultra-thin consumer electronics (e.g., wearables, slim tablets) where Z-height is constrained to <1.0mm. |
| 4mm² PCB footprint | Reduces board area by >50% vs. SO-8 or TSOP-6 equivalents, freeing space for additional passive components or routing layers. |
| Low VGS(TH) | Guarantees turn-on with 3.3V logic signals, eliminating external level shifters and reducing BOM count in MCU-based power sequencers. |
| NiPdAu-plated terminals | Ensures reliable solderability per MIL-STD-202 Method 208 and compatibility with lead-free reflow profiles up to 260°C peak. |
| Halogen- and antimony-free | Meets IPC-1752A Class 3 requirements for green electronics, with Br+Cl <1500ppm and Sb <1000ppm for environmental compliance. |
Applications
| Battery Protection Circuit | USB-C Power Delivery Sink |
|---|---|
Use Scenario: Reverse polarity and overcurrent protection in single-cell Li-ion battery packs for portable medical devices. IC Role / Device Role / Timing Role: High-side load switch controlling battery connection to system load; activated only after voltage and temperature validation. Use Value: 32mΩ RDS(ON) limits voltage drop to <320mV at 10A, preserving battery runtime and enabling accurate fuel gauging. |
Use Scenario: Input power path management in USB-C PD 3.0 compliant accessories accepting up to 20V/5A. IC Role / Device Role / Timing Role: Low-side OR-ing switch selecting between adapter and battery sources with automatic switchover. Use Value: Fast 9.8ns body diode recovery prevents cross-conduction during source transition, eliminating output voltage droop. |
| Step-Down DC-DC Converter | Load Switch for IoT Sensor Node |
Use Scenario: Synchronous rectifier in 3.3V-output buck converter powering FPGA core voltage in edge AI modules. IC Role / Device Role / Timing Role: Low-side synchronous rectifier replacing Schottky diode to improve efficiency at light loads. Use Value: 8.6nC gate charge enables efficient 2MHz operation with <50mW gate drive loss, increasing full-load efficiency by 2.1%. |
Use Scenario: Controlled power gating of BLE radio and environmental sensors in battery-operated smart agriculture nodes. IC Role / Device Role / Timing Role: Always-on load switch enabling <1µA quiescent current shutdown mode while retaining MCU wake capability. Use Value: -1µA IDSS leakage ensures <10nA total system standby current, extending 2000mAh coin cell life to >10 years. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMG2305UVT-7 | RDS(ON) = 45mΩ @ -4.5V; higher threshold (-1.0 to -2.5V); same U-DFN2020-6 package. | Less suitable for 3.3V logic drive; requires stronger gate pull-down for reliable turn-off in noisy environments. | Select when lower cost is prioritized over minimal conduction loss and gate drive simplicity. |
| Si2301DDS-T1-GE3 | RDS(ON) = 115mΩ @ -4.5V; higher Qg (12nC); same footprint but non-exposed drain pad. | Limited thermal performance (RθJA = 220°C/W); unsuitable for >3A continuous operation without forced air. | Select only for low-current (<2A), low-frequency (<100kHz) applications where thermal headroom is abundant. |
Compared with DMG2305UVT-7 and Si2301DDS-T1-GE3, DMP2040UFDF-13 delivers superior thermal performance via its exposed drain pad, lowest gate charge among U-DFN2020-6 P-ch devices, and widest VGS(TH) range for robust logic-level compatibility - making it optimal for high-density, high-efficiency portable power designs.
Availability
DMP2040UFDF-13 is available at Aetrix Electronics and suitable for battery management systems, USB-C power delivery sinks, and step-down DC-DC converters requiring stable component supply across industrial, medical, and consumer production programs.
Supply support for DMP2040UFDF-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.
This device belongs to Diodes' PowerMOS™ portfolio, engineered specifically for high-efficiency, low-voltage power switching in space- and thermally-constrained portable electronics.
FAQ
What is the maximum continuous drain current at TA = +70°C?
The DMP2040UFDF-13 supports -4.9A continuous drain current at ambient temperature +70°C with VGS = -4.5V, based on FR-4 PCB with minimum recommended pad layout. This rating assumes no thermal vias or copper pour beyond the datasheet's single-sided 1oz copper reference design.
Is the exposed drain pad electrically isolated from other pins?
No - the exposed drain pad (Pin 6) is electrically and thermally connected to Pin 3 (Drain) and forms part of the primary current path. It must be soldered to a PCB copper area tied to the system drain net and cannot be left floating or grounded independently.
Can this MOSFET be used in linear regulation mode?
No - the device is not characterized or rated for linear (ohmic) operation. Its Safe Operating Area (SOA) curve shows DC limitation at low VDS, and sustained linear use risks thermal runaway due to positive temperature coefficient of RDS(ON) and lack of SOA derating data beyond pulse conditions.
Does the -13 suffix indicate tape-and-reel packaging quantity?
Yes - the "-13" suffix denotes 10,000 units per tape-and-reel reel, consistent with Diodes Incorporated's standard ordering nomenclature. The "-7" variant contains 3,000 units per reel and shares identical electrical and mechanical specifications.
DMP2040UFDF-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 6-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 13A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 2.5V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 32mOhm @ 8.9A, 4.5V
- Vgs(th) (Max) @ Id:
- 1.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 19 nC @ 8 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 834 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.8W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-DFN2020-6 (Type F)
DMP2040UFDF-13 FAQ
1.How can I place an order for DMP2040UFDF-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMP2040UFDF-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMP2040UFDF-13 reliable?
The price and inventory of DMP2040UFDF-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP2040UFDF-13 is usually 5 days.
3.What payment methods are accepted for DMP2040UFDF-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP2040UFDF-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMP2040UFDF-13?
DMP2040UFDF-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMP2040UFDF-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMP2040UFDF-13?
For technical support, including DMP2040UFDF-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP2040UFDF-13 requirements.
6.How does Aetrix verify that DMP2040UFDF-13 is sourced from the original manufacturer or authorized distributors?
All DMP2040UFDF-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP2040UFDF-13 meets industry standards.
7.What is the process for return or replacement of DMP2040UFDF-13?
All DMP2040UFDF-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMP2040UFDF-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMP2040UFDF-13 part is unused and in its original packaging.
Return procedure for DMP2040UFDF-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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