Diodes Incorporated DMP2101UCP9-7
- Part No.:
- DMP2101UCP9-7
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 9-XFBGA, DSBGA
- Datasheet:
-
DMP2101UCP9-7.pdf
- Description:
- MOSFET 2P-CH 20V 2.5A 9DSN1515
- Quantity:
- Payment:

- Shipping:

Inventory:6,526
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Product details
Overview
DMP2101UCP9-7 from Diodes Incorporated is a dual P-channel enhancement-mode MOSFET in a 1.5 mm × 1.5 mm CSP package, rated for -20 V drain-to-drain voltage, 63 mΩ RD1D2(ON) at VGS = -4.5 V, and -3.1 A continuous drain current at TA = +25°C. It serves as a compact, low-loss load switch or battery protection device in space-constrained portable electronics.
For engineers reviewing the DMP2101UCP9-7 datasheet, DMP2101UCP9-7 pinout, DMP2101UCP9-7 application, or DMP2101UCP9-7 equivalent, key selection criteria include its ultra-low on-resistance at low gate drive (-0.74 V typical VGS(TH)), 3.2 nC total gate charge for fast switching, and thermal performance on minimal PCB copper (RθJA = 84.8 °C/W with 1 in² Cu).
Technical Context
This dual P-channel MOSFET integrates two identical enhancement-mode silicon devices in a single X2-DSN1515-9 (Type B) chip-scale package with nine terminals. Its LD-MOS process enables simultaneous optimization of RD1D2(ON) and Qg, supporting high-efficiency DC-DC power path control without external level-shifting circuitry.
The device operates with a negative gate threshold voltage (-0.74 V typ), allowing direct interface with 1.8 V or 2.5 V logic controllers. Its symmetric dual configuration supports independent or paralleled channel use, and the integrated body diode (VSD = -0.7 V typ at -1 A) enables reverse-current blocking in battery-backup paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VD1D2 | -20 V maximum drain-to-drain voltage - defines safe operating range for battery-input circuits up to 2-cell Li-ion (8.4 V) with margin. |
| RD1D2(ON) | 63 mΩ typical at VGS = -4.5 V - minimizes conduction loss in 1 A load-switch applications (e.g., <63 mW dissipation per channel). |
| ID1D2 | -3.1 A continuous at TA = +25°C with 1 in² Cu - supports sustained 3 A loads in thermally optimized portable PCB layouts. |
| Qg | 3.2 nC total gate charge - enables sub-10 ns turn-on delay and <100 ns full switching with 30 Ω gate resistor, reducing dynamic losses. |
| VGS(TH) | -0.74 V typical - ensures reliable turn-on from 1.8 V GPIOs without gate boosting, simplifying system-level power sequencing. |
| RθJA | 84.8 °C/W with 1 in² 2 oz Cu - allows ~1.47 W power dissipation before junction exceeds 150°C, critical for unheatsinked mobile designs. |
Pinout & Package
Package: X2-DSN1515-9 (Type B), 1.5 mm × 1.5 mm footprint, 0.32 mm height, SnAg over Cu pillar terminations. Moisture sensitivity level 1 per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5 | Source 1 (S1) | Common source connection for Channel 1 - electrically tied internally; used for low-impedance return path in high-current load switches. |
| 6 | Gate 1 (G1) | Control input for Channel 1 - accepts standard logic-level negative gate drive; threshold enables direct MCU GPIO interface. |
| 7, 8, 9 | Source 2 (S2) | Common source connection for Channel 2 - isolated from S1; supports independent dual-channel operation or parallel configuration. |
| - | Drain 1 / Drain 2 (D1/D2) | Exposed drain pads (top view labels D1/D2) - serve as primary current-carrying terminals and thermal conduction paths to PCB copper. |
Key Features
| Feature | Design Value |
|---|---|
| LD-MOS process technology | Delivers industry-leading figure of merit (RDS(ON) × Qg = 202 mΩ·nC), enabling high efficiency in compact battery-powered systems. |
| Ultra-low VGS(TH) | -0.74 V typical threshold ensures robust turn-on with 1.8 V/2.5 V microcontrollers, eliminating need for gate drivers in many portable designs. |
| 0.32 mm profile CSP package | Reduces board area by >50% vs. SO-8 equivalents while maintaining thermal performance via direct die-to-PCB conduction through exposed drains. |
| Lead-free & halogen-free construction | Fully RoHS 3 compliant (<900 ppm Br/Cl, <1000 ppm Sb); meets automotive change-control requirements when qualified per AEC-Q101. |
Applications
| Battery Protection Circuit | USB-C Power Path Switch |
|---|---|
|
Use Scenario: Dual-channel reverse-current and overcurrent protection in 2-cell Li-ion battery packs. IC Role / Device Role / Timing Role: P-channel MOSFET pair acting as back-to-back switches to block charging/discharging faults and enable bidirectional current control. Use Value: 63 mΩ RD1D2(ON) limits voltage drop to <63 mV at 1 A, preserving battery runtime and enabling accurate coulomb counting. |
Use Scenario: USB-C port power delivery path management in portable docking stations. IC Role / Device Role / Timing Role: Dual independent load switches controlling VBUS routing between host, device, and accessory ports. Use Value: 3.2 nC Qg supports <100 ns switching transitions, meeting USB-C power role swap timing requirements (<15 ms total). |
| Smartphone Power-Rail Sequencing | Wireless Earbud Charging Case |
|
Use Scenario: Controlled power-up/down sequencing of RF, audio, and sensor subsystems in smartphones. IC Role / Device Role / Timing Role: Dual P-MOSFETs isolating individual rails (e.g., display backlight, camera module) under PMIC command. Use Value: -0.74 V VGS(TH) allows direct control from 1.8 V PMIC GPIOs, eliminating level-shifters and saving BOM cost and board space. |
Use Scenario: Load switching between main Li-ion cell and earbud charging coils in compact charging cases. IC Role / Device Role / Timing Role: Dual-channel switch managing separate charging paths for left/right earbuds with independent status monitoring. Use Value: 1.5 mm × 1.5 mm footprint fits within tight mechanical constraints of sub-50 cm³ charging cases while delivering <3 A per channel. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual P-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMC2038LVT-7 | RDS(ON) = 80 mΩ @ -4.5 V; Qg = 2.8 nC; same X2-DSN1515-9 package | Higher on-resistance increases conduction loss by ~27% at 1 A; lower Qg yields marginally faster switching | Select when gate drive strength is limited but thermal margin exists; not optimal for <1 A high-efficiency paths. |
| SIA925DJ-T1-GE3 | RDS(ON) = 55 mΩ @ -4.5 V; Qg = 4.5 nC; different 1.6 mm × 1.6 mm TDFN package | Lower RDS(ON) improves efficiency but higher Qg increases dynamic loss; larger footprint may conflict with layout constraints | Prefer for maximum efficiency where board area permits; requires revalidation of thermal pad layout and solder stencil. |
Compared with DMC2038LVT-7 and SIA925DJ-T1-GE3, the DMP2101UCP9-7 delivers the best balance of low RDS(ON), low Qg, and minimal footprint - making it optimal for space- and efficiency-critical battery management in wearables and ultra-thin mobile devices.
Availability
DMP2101UCP9-7 is available at Aetrix Electronics and suitable for battery management, load switching, and battery protection applications requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for DMP2101UCP9-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance, energy-efficient components for consumer, computing, industrial, and automotive markets.
The DMP2101UCP9-7 belongs to Diodes' LD-MOS dual P-channel MOSFET product line, engineered specifically for ultra-compact, high-efficiency power-path control in portable and battery-powered electronics.
FAQ
What is the maximum continuous drain current rating for DMP2101UCP9-7 at 70°C ambient?
The DMP2101UCP9-7 supports -2.5 A continuous drain current per channel at TA = +70°C when mounted on FR-4 with 1 in² 2 oz copper. This derating reflects thermal limitations under real-world PCB conditions and must be verified against actual board layout and airflow.
Does DMP2101UCP9-7 require external gate resistors for ESD protection?
No external gate resistor is required solely for ESD protection - the device incorporates internal gate protection structures compliant with HBM ≥ 2 kV. However, a small series gate resistor (10–30 Ω) is recommended to dampen ringing during fast switching and reduce EMI in sensitive RF environments.
Can both channels be paralleled to increase current capacity?
Yes, both P-channel channels can be paralleled to handle up to -6.2 A total current at TA = +25°C, provided PCB layout ensures matched thermal and electrical paths. The matched RD1D2(ON) tolerance (typical ±15%) and identical thermal resistance support balanced current sharing without external balancing components.
Is DMP2101UCP9-7 qualified for automotive applications?
The base DMP2101UCP9-7 is not AEC-Q101 qualified. However, Diodes offers automotive-grade variants (e.g., DMP2101UCP9Q-7) with PPAP documentation, IATF 16949 manufacturing, and extended temperature validation. Contact Diodes or Aetrix for qualified part numbers and qualification reports.
DMP2101UCP9-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 9-XFBGA, DSBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 P-Channel (Dual)
- FET Feature:
- -
- Drain to Source Voltage (Vdss):
- 20V
- Current - Continuous Drain (Id) @ 25°C:
- 2.5A (Ta)
- Rds On (Max) @ Id, Vgs:
- 100mOhm @ 1A, 4.5V
- Vgs(th) (Max) @ Id:
- 900mV @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 3.2nC @ 4.5V
- Input Capacitance (Ciss) (Max) @ Vds:
- 392pF @ 10V
- Power - Max:
- 970mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DSN1515-9 (Type B)
DMP2101UCP9-7 FAQ
1.How can I place an order for DMP2101UCP9-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMP2101UCP9-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMP2101UCP9-7 reliable?
The price and inventory of DMP2101UCP9-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP2101UCP9-7 is usually 5 days.
3.What payment methods are accepted for DMP2101UCP9-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP2101UCP9-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMP2101UCP9-7?
DMP2101UCP9-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMP2101UCP9-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMP2101UCP9-7?
For technical support, including DMP2101UCP9-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP2101UCP9-7 requirements.
6.How does Aetrix verify that DMP2101UCP9-7 is sourced from the original manufacturer or authorized distributors?
All DMP2101UCP9-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP2101UCP9-7 meets industry standards.
7.What is the process for return or replacement of DMP2101UCP9-7?
All DMP2101UCP9-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMP2101UCP9-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMP2101UCP9-7 part is unused and in its original packaging.
Return procedure for DMP2101UCP9-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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