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Diodes Incorporated DMP2160UFDBQ-7

Part No.:
DMP2160UFDBQ-7
Manufacturer:
Diodes Incorporated
Category:
FET, MOSFET Arrays
Package:
6-UDFN Exposed Pad
Datasheet:
AetrixDMP2160UFDBQ-7.pdf
Description:
MOSFET 2P-CH 20V 3.8A 6UDFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:66,393

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Product details

Overview

DMP2160UFDBQ from Diodes Incorporated is a dual P-channel enhancement-mode MOSFET in a U-DFN2020-6 (Type B) package, rated for -20V VDSS, 70mΩ RDS(ON) at VGS = -4.5V, and -3.8A continuous drain current at TA = +25°C. It serves as a compact, low-profile load switch in portable power adaptors and automotive-grade power management circuits.

For engineers reviewing the DMP2160UFDBQ datasheet, DMP2160UFDBQ pinout, DMP2160UFDBQ application, or DMP2160UFDBQ equivalent, key selection criteria include its AEC-Q101 qualification, low gate threshold voltage (-0.9V max), dual-channel layout, thermal resistance (RθJA = 89°C/W), and lead-free, halogen-free "Green" construction compliant with RoHS 3.

Technical Context

This dual MOSFET integrates two identical P-channel silicon die in a single 2.0mm × 2.0mm U-DFN2020-6 (Type B) package with exposed thermal pad and NiPdAu-plated terminals. Each channel operates independently with matched VGS(TH) (-0.45 to -0.9V) and RDS(ON) characteristics across temperature.

Its fast switching performance is enabled by low total gate charge (Qg = 6.5nC), low Crss (59pF), and optimized gate resistance (Rg = 8.72Ω), supporting efficient synchronous rectification and high-frequency load switching up to several hundred kHz in space-constrained designs.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS-20V - Maximum blocking voltage per channel before avalanche conduction
RDS(ON) @ VGS = -4.5V70mΩ - On-resistance enabling ≤0.4W conduction loss at 2.8A per channel
ID (continuous)-3.8A - Max DC current per channel at TA = +25°C on FR-4 PCB with minimum copper pad
VGS(TH) max-0.9V - Ensures full enhancement with low-voltage logic-level gate drive (e.g., 1.8V/2.5V I/O)
Qg6.5nC - Total gate charge determining drive strength requirement and switching transition time
RθJA89°C/W - Junction-to-ambient thermal resistance defining power derating above +25°C ambient
PD1.4W - Maximum steady-state power dissipation on standard PCB layout

Pinout & Package

Package: U-DFN2020-6 (Type B), 2.0mm × 2.0mm × 0.5mm profile, exposed thermal pad (Pin 4), NiPdAu-plated copper leadframe, moisture sensitivity level 1.

Pin/TerminalCircuit RoleDesign Meaning
1 (D1)Drain of Q1Main current path input for first P-MOSFET; connected to high-side rail in load switch configuration
2 (S1)Source of Q1Current return node for Q1; tied to output or ground depending on topology
3 (G1)Gate of Q1Control terminal for Q1; requires negative VGS relative to S1 to turn on
4 (Thermal Pad)Exposed Drain / Thermal PathInternally connected to both drains (D1 & D2); must be soldered to PCB copper for thermal and electrical integrity
5 (G2)Gate of Q2Independent control terminal for second P-MOSFET; enables dual independent switching
6 (S2)Source of Q2Current return node for Q2; electrically isolated from S1 unless externally connected

Key Features

FeatureDesign Value
Low RDS(ON) at low VGS85mΩ @ VGS = -2.5V enables operation with 2.5V logic or battery-sourced gate drivers
AEC-Q101 qualificationValidated for automotive applications including engine control modules and body electronics requiring PPAP documentation
Ultra-low profile0.5mm max height supports thin portable devices and stacked PCB assemblies
Halogen- and antimony-free "Green" constructionMeets <900ppm Br, <900ppm Cl, <1000ppm Sb; compliant with EU RoHS 3 and J-STD-020 Level 1

Applications

Portable Power AdaptorsAutomotive Body Control Modules

Use Scenario: Dual independent USB-C PD port power routing in compact travel adapters.

IC Role / Device Role: Dual high-side load switch controlling 5V/9V/15V rails with reverse-current blocking.

Use Value: Low RDS(ON) minimizes voltage drop and heat generation; small footprint allows dual-channel integration without board area penalty.

Use Scenario: Power distribution to LED lighting zones and sensor clusters in door modules.

IC Role / Device Role: AEC-Q101-qualified dual P-channel switch enabling controlled power-up/down sequencing.

Use Value: -0.9V VGS(TH) max ensures reliable turn-on with 3.3V microcontroller GPIO; thermal robustness supports under-hood ambient conditions.

Industrial IoT Sensor NodesUSB-C Power Delivery Accessories

Use Scenario: Battery-powered wireless sensor nodes requiring selective subsystem power gating.

IC Role / Device Role: Dual-channel load switch isolating RF transceiver and MCU domains to reduce standby leakage.

Use Value: <1µA IDSS and low gate leakage enable multi-year battery life; U-DFN2020-6 fits tight 10mm² PCB real estate budgets.

Use Scenario: Compact USB-C cable assemblies with integrated overcurrent protection and VCONN switching.

IC Role / Device Role: Dual P-MOSFET managing VBUS path and VCONN supply with independent control.

Use Value: Matched RDS(ON) and fast tf (27.5ns) support clean hot-plug transitions and minimize EMI during state changes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual P-channel load switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMP2110UFDBQLower RDS(ON) (50mΩ @ -4.5V) but higher VGS(TH) (-1.2V max); same package and pinoutBetter efficiency at high current, but requires ≥3.3V gate drive; not recommended for new designs per datasheet noteSelect only if legacy compatibility required and gate drive voltage ≥3.3V is guaranteed
DMC2020UFDBQHigher VDSS (-30V), higher RDS(ON) (100mΩ @ -4.5V), same AEC-Q101 rating and U-DFN2020-6 footprintSupports wider input voltage range (e.g., 24V industrial systems), but higher conduction loss at 5–12V railsChoose when system voltage exceeds 20V or higher blocking margin is needed

Compared with DMP2110UFDBQ and DMC2020UFDBQ, the DMP2160UFDBQ offers optimal balance of low-threshold drive compatibility, thermal performance (89°C/W), and automotive qualification-making it preferred for 5–12V portable and automotive load-switching where gate drive headroom is limited.

Availability

DMP2160UFDBQ is available at Aetrix Electronics and suitable for portable power adaptors, automotive body control modules, and industrial IoT sensor nodes requiring stable component supply, AEC-Q101 compliance, and ultra-compact dual-MOSFET integration.

Supply support for DMP2160UFDBQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for industrial, automotive, and consumer markets.

The DMP2160UFDBQ belongs to Diodes' U-DFN2020-6 dual MOSFET product line, designed specifically for space-constrained, high-efficiency load switching in automotive and portable electronics where low gate threshold, thermal performance, and regulatory compliance are critical.

FAQ

Is the DMP2160UFDBQ pin-compatible with the DMP2110UFDBQ?

Yes-the DMP2160UFDBQ shares identical U-DFN2020-6 (Type B) pinout and mechanical footprint with the DMP2110UFDBQ, including Pin 1 (D1), Pin 2 (S1), Pin 3 (G1), Pin 4 (thermal pad/drain common), Pin 5 (G2), and Pin 6 (S2). Both use the same terminal finish (NiPdAu) and soldering requirements.

What is the maximum allowable junction temperature for continuous operation?

The DMP2160UFDBQ has an operating junction temperature range of -55°C to +150°C. For continuous DC operation, the maximum sustained junction temperature is +150°C, constrained by thermal design: at TA = +25°C, 1.4W power dissipation yields ΔT = 124.6°C, resulting in TJ ≈ 149.6°C-within specification.

Does the thermal pad (Pin 4) require electrical connection?

Yes-Pin 4 is the exposed thermal pad internally connected to both drains (D1 and D2). It must be soldered to a PCB copper pour for thermal conduction and electrical reference. Leaving it floating degrades RθJA by >30% and risks thermal runaway under load.

Can the two channels be used in parallel to increase current capacity?

No-parallel operation is not recommended. The channels are not matched for current sharing under dynamic conditions due to VGS(TH) variation (±0.2V typical) and RDS(ON) tolerance (±20%). Uneven current division may cause thermal imbalance and premature failure; use a single higher-current device instead.

DMP2160UFDBQ-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
6-UDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
2 P-Channel (Dual)
FET Feature:
-
Drain to Source Voltage (Vdss):
20V
Current - Continuous Drain (Id) @ 25°C:
3.8A
Rds On (Max) @ Id, Vgs:
70mOhm @ 2.8A, 4.5V
Vgs(th) (Max) @ Id:
900mV @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
6.5nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds:
536pF @ 10V
Power - Max:
1.4W
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
U-DFN2020-6 (Type B)

DMP2160UFDBQ-7 FAQ

1.How can I place an order for DMP2160UFDBQ-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMP2160UFDBQ-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMP2160UFDBQ-7 reliable?

The price and inventory of DMP2160UFDBQ-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP2160UFDBQ-7 is usually 5 days.

3.What payment methods are accepted for DMP2160UFDBQ-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP2160UFDBQ-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMP2160UFDBQ-7?

DMP2160UFDBQ-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMP2160UFDBQ-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMP2160UFDBQ-7?

For technical support, including DMP2160UFDBQ-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP2160UFDBQ-7 requirements.

6.How does Aetrix verify that DMP2160UFDBQ-7 is sourced from the original manufacturer or authorized distributors?

All DMP2160UFDBQ-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP2160UFDBQ-7 meets industry standards.

7.What is the process for return or replacement of DMP2160UFDBQ-7?

All DMP2160UFDBQ-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMP2160UFDBQ-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMP2160UFDBQ-7 part is unused and in its original packaging.

Return procedure for DMP2160UFDBQ-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMP2160UFDBQ-7 Tags

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