Diodes Incorporated DMP22D5UDR4-7

Overview

DMP22D5UDR4 from Diodes Incorporated is a dual P-channel enhancement-mode MOSFET in a 1.0 mm × 1.0 mm X2-DFN1010-6 package, rated for -20 V V_DSS, 1.9 Ω R_DS(ON) at V_GS = -4.5 V, and -0.36 A continuous drain current at +25°C - designed for compact, low-power load switching in space-constrained portable electronics.

For engineers reviewing the DMP22D5UDR4 datasheet, DMP22D5UDR4 pinout, DMP22D5UDR4 application, or DMP22D5UDR4 equivalent, key selection criteria include its ultra-small footprint, gate-threshold voltage range (-0.4 V to -1.0 V), ESD-protected gate, low leakage (<±10 µA), and thermal resistance of 328 °C/W on standard FR-4 PCBs.

Technical Context

This dual P-MOSFET integrates two independent channels in a single die with shared source terminals (as confirmed by the equivalent circuit diagram), enabling synchronous or independent load control. Its low R_DS(ON) at low gate voltages (-1.5 V to -4.5 V) supports direct interfacing with 1.8 V/2.5 V/3.3 V logic outputs without level-shifting.

The device features an ESD-protected gate (HBM >2 kV per JEDEC JESD22-A114), operates across -55°C to +150°C, and exhibits normalized R_DS(ON) variation of ≤1.7× over temperature - critical for stable performance in battery-powered backlighting and power-rail sequencing circuits.

Key Specifications

Pinout & Package

Package: X2-DFN1010-6 (Type UXC), 1.0 mm × 1.0 mm × 0.39 mm height, thermally enhanced copper leadframe with NiPdAu plating, moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual P-channel load switch applications.

Compared with DMN2020LSD-13 and AOB2202L, DMP22D5UDR4 delivers 3× smaller footprint, 25% lower R_DS(ON), and guaranteed ESD protection - making it optimal for miniaturized, battery-sensitive designs where gate drive simplicity and reliability are prioritized over legacy package compatibility.

Availability

DMP22D5UDR4 is available at Aetrix Electronics and suitable for portable medical monitors, smart wearable power management, and USB-C accessory power control requiring stable component supply and long-term lifecycle support.

Supply support for DMP22D5UDR4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

The DMP22D5UDR4 belongs to Diodes' X2-DFN ultra-miniature MOSFET product line, engineered specifically for space-constrained, low-voltage power-switching applications in portable consumer and IoT electronics.

FAQ

What is the maximum allowable gate-source voltage for DMP22D5UDR4?

The absolute maximum V_GS is ±8 V per the datasheet's Maximum Ratings table. Exceeding this risks permanent gate oxide damage. For reliable operation, keep V_GS within -4.5 V to 0 V during normal switching - especially critical since V_GS(TH) is as low as -0.4 V, making the device sensitive to overdrive.

Does DMP22D5UDR4 support independent control of its two channels?

No - the device uses a shared-source configuration where Pins 1–3 and Pins 4–6 are internally connected to separate source nodes, but both gates (Pin 1 and Pin 6) are isolated. Independent gate control is fully supported; however, both channels share the same source reference plane, so they cannot operate with different source potentials.

Can DMP22D5UDR4 be used in automotive applications?

While DMP22D5UDR4 meets AEC-Q200 stress test conditions in qualification reports, it is not officially AEC-Q101 qualified. Diodes states that automotive-grade versions require explicit PPAP documentation and IATF 16949-manufactured lots - contact Diodes directly for certified automotive variants such as DMP22D5UDR4Q.

What PCB layout practices are recommended for thermal performance?

Use the recommended 1-inch² copper pad under the exposed thermal pad (connected to source), with ≥4 thermal vias (0.3 mm diameter) to inner ground planes. Maintain minimum 0.25 mm solder mask opening around the pad per Diodes' layout guide - this achieves the 190 °C/W R_θJA rating cited for enhanced thermal mounting.