Diodes Incorporated DMP22D5UFA-7B

Overview

DMP22D5UFA-7B from Diodes Incorporated is a 20V P-channel enhancement-mode MOSFET in a 0.8mm × 0.6mm X2-DFN0806-3 package, featuring 1.9Ω R_DS(ON) at V_GS = −4.5V, −360mA continuous drain current, and a gate threshold voltage of −1.0V max - optimized for low-voltage power switching in space-constrained portable electronics.

For engineers reviewing the DMP22D5UFA-7B datasheet, DMP22D5UFA-7B pinout, DMP22D5UFA-7B application, or DMP22D5UFA-7B equivalent, key selection criteria include ultra-low gate threshold for 1.8V logic compatibility, sub-0.4mm profile for thin-profile PCBs, and ESD-protected gate for robust handling in automated assembly.

Technical Context

This P-channel MOSFET operates with a negative gate-source control voltage and exhibits strong conduction down to V_GS = −1.5V (R_DS(ON) = 5.0Ω), enabling direct drive from 1.8V/2.5V microcontroller I/O pins without level shifting. Its low C_iss (17pF) and fast switching times (t_D(ON) = 7.3ns, t_F = 97ns) support high-frequency load switching up to several MHz.

The device integrates an intrinsic body diode with V_SD = −0.6V typical at −250μA, suitable for reverse-polarity protection and analog signal routing. Thermal resistance R_θJA = 337°C/W on FR-4 ensures stable operation up to +150°C junction temperature under defined pad layout conditions.

Key Specifications

Pinout & Package

Package: X2-DFN0806-3, 0.8mm × 0.6mm × 0.4mm (max), 3-terminal leadless plastic package with exposed drain pad for thermal relief.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel low-voltage switching applications.

Compared with DMN2016LFG-7 and AO3415, DMP22D5UFA-7B uniquely balances ultra-small footprint, guaranteed low V_GS(TH), and minimal gate charge - making it optimal for 1.8V/2.5V-controlled, space-limited switching where dynamic efficiency matters more than absolute R_DS(ON) minimization.

Availability

DMP22D5UFA-7B is available at Aetrix Electronics and suitable for battery-powered load switching, reverse-polarity protection, and analog signal routing requiring stable component supply across high-mix, low-volume production runs.

Supply support for DMP22D5UFA-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.

DMP22D5UFA-7B belongs to Diodes' X2-DFN ultra-miniature MOSFET product line, engineered specifically for space-constrained, low-voltage portable electronics requiring logic-level compatibility and high reliability.

FAQ

What is the maximum operating junction temperature for DMP22D5UFA-7B?

The DMP22D5UFA-7B has a specified operating junction temperature range of −55°C to +150°C. Its thermal resistance R_θJA is 337°C/W on FR-4 with minimum recommended pad layout, meaning it can sustain continuous operation at +150°C junction temperature when power dissipation remains within derated limits per the SOA curve in Figure 12.

Is DMP22D5UFA-7B suitable for driving loads from a 1.8V microcontroller GPIO?

Yes - its gate threshold voltage is guaranteed ≤−1.0V, ensuring full enhancement with 1.8V logic high (i.e., V_GS = −1.8V). At that drive level, R_DS(ON) is 3.4Ω (typical), supporting up to ~270mA with acceptable voltage drop, making it ideal for direct GPIO control without external level shifters.

Does DMP22D5UFA-7B include integrated ESD protection?

Yes - the device features ESD-protected gate structure rated to ≥2kV HBM per JEDEC JESD22-A114. This eliminates the need for external gate protection diodes in most production environments and improves robustness during automated PCB assembly and handling.

What is the recommended PCB pad layout for thermal performance?

Diodes specifies a minimum recommended pad layout for the X2-DFN0806-3 package, including thermal vias under the exposed drain pad connected to internal ground or power planes. Full dimensions and layout guidance are published in Diodes' package outline document PN-00001-X2-DFN0806-3, accessible via www.diodes.com/package-outlines.html.