Diodes Incorporated DMP22D5UFB4-7R

Overview

DMP22D5UFB4-7R from Diodes Incorporated is a 20V P-channel enhancement-mode MOSFET in X2-DFN1006-3 package, with R_DS(ON) = 1.9 Ω @ V_GS = −4.5 V, I_D = −0.4 A at T_A = +25°C, and ESD protection. It serves as a compact load switch or power rail controller in space-constrained portable electronics.

For engineers reviewing the DMP22D5UFB4-7R datasheet, DMP22D5UFB4-7R pinout, DMP22D5UFB4-7R application, or DMP22D5UFB4-7R equivalent, key selection criteria include low-profile footprint (0.6 mm²), gate threshold voltage (−0.4 to −1.0 V), thermal resistance (272.1 °C/W on FR-4), and body diode forward voltage (−1.1 V @ −10 mA).

Technical Context

This device operates as a single P-channel enhancement-mode MOSFET with integrated gate protection diode and ESD-hardened structure. Its low V_GS(TH) enables direct interface with 1.8 V and 2.5 V logic, while its normalized R_DS(ON) variation remains ≤1.8× across −55°C to +150°C junction temperature.

The X2-DFN1006-3 package features NiPdAu-plated copper leadframe, 0.4 mm profile, and 0.35 mm pitch terminals. Thermal performance is specified for two PCB conditions: minimum pad layout (R_θJA = 272.1 °C/W) and thermally enhanced layout with vias (R_θJA = 106.2 °C/W).

Key Specifications

Pinout & Package

Package: X2-DFN1006-3, 0.4 mm height, 1.0 × 0.6 mm outline, 3-terminal surface-mount with exposed drain pad (no thermal pad connection required per datasheet layout).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel load switch applications.

Compared with DMN2016LFG-7 and AO3415, DMP22D5UFB4-7R delivers the smallest footprint and lowest profile among P-channel MOSFETs rated for −20 V, with verified ESD hardening and guaranteed −1.0 V V_GS(TH) max-critical for robust 1.8 V logic interfacing.

Availability

DMP22D5UFB4-7R is available at Aetrix Electronics and suitable for smartphone power sequencing, wireless earbud battery management, and USB-C accessory detection requiring stable component supply and consistent DFN1006 assembly yield.

Supply support for DMP22D5UFB4-7R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.

This device belongs to Diodes' X2-DFN ultra-compact MOSFET product line, engineered specifically for space-constrained portable electronics where footprint, height, and logic-level compatibility are primary constraints.

FAQ

What is the maximum allowable gate-source voltage for DMP22D5UFB4-7R?

The absolute maximum V_GS is ±8 V per the datasheet's "Maximum Ratings" table. Exceeding this risks permanent gate oxide damage. For reliable operation, keep V_GS between −4.5 V and 0 V in normal switching use, as R_DS(ON) is fully specified down to −1.5 V.

Does DMP22D5UFB4-7R require a gate resistor for typical 1.8 V GPIO drive?

No external gate resistor is required when driven by standard CMOS GPIO with ≤10 mA sink/source capability. The device's Q_g = 0.3 nC and C_iss = 17 pF allow full switching within 20 ns using typical microcontroller outputs; a 10–100 Ω resistor may be added only to damp ringing in high-noise environments.

How is thermal performance affected when mounted without thermal vias?

Without thermal vias, R_θJA degrades from 106.2 °C/W (enhanced layout) to 272.1 °C/W (minimum pad). At I_D = −0.3 A and R_DS(ON) = 2.4 Ω, junction temperature rise exceeds 195°C above ambient-exceeding the 150°C limit. Thermal vias to inner ground planes are mandatory for sustained operation above 150 mA.

Is the exposed drain pad electrically isolated or connected internally?

The exposed drain pad is electrically connected to Pin 2 (Drain) and must be soldered to a PCB copper pour tied to the drain net. It is not isolated; using it as a thermal relief without electrical connection violates the recommended layout and compromises both thermal performance and voltage rating integrity.