Diodes Incorporated DMP22D5UFZ-7B

Overview

DMP22D5UFZ-7B from Diodes Incorporated is a P-channel enhancement-mode MOSFET in a 0.62 mm × 0.62 mm X2-DFN0606-3 package, rated for -20 V V_DSS, 1.9 Ω R_DS(ON) at V_GS = -4.5 V, and -0.33 A continuous drain current at T_A = +25°C. It serves as a low-voltage load switch in space-constrained power management circuits such as battery-powered IoT sensors and portable USB peripherals.

For engineers reviewing the DMP22D5UFZ-7B datasheet, DMP22D5UFZ-7B pinout, DMP22D5UFZ-7B application, or DMP22D5UFZ-7B equivalent, key selection criteria include ultra-low gate threshold (-1.0 V max), sub-1Ω on-resistance at low V_GS, ESD-protected gate, and thermal resistance of 394 °C/W on FR-4 with 2 oz copper.

Technical Context

This device operates as a single P-channel switch with depletion-free enhancement-mode behavior, enabling turn-on with gate voltages as low as -1.0 V (V_GS(TH) max) and full conduction at -4.5 V. Its R_DS(ON) varies from 1.9 Ω to 5.0 Ω across V_GS = -1.5 V to -4.5 V, supporting flexible biasing in low-power logic-level control systems.

Designed for surface-mount operation in thermally constrained layouts, it features a 0.42 mm max package height and NiPdAu-plated terminals compatible with standard reflow profiles. The integrated gate protection diode and ESD rating support robust handling in automated assembly without external clamping.

Key Specifications

Pinout & Package

Package: X2-DFN0606-3, 0.62 mm × 0.62 mm footprint, 0.42 mm max height, 3-terminal leadless plastic package with exposed drain pad (Pin 3).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel load switch applications.

Compared with DMN2016LFG-7 and AO3415, DMP22D5UFZ-7B uniquely balances ultra-small footprint, guaranteed low V_GS(TH), and sub-2 Ω R_DS(ON) - making it optimal for miniaturized, 1.8 V–controlled battery switches where thermal margin is limited and gate drive headroom is minimal.

Availability

DMP22D5UFZ-7B is available at Aetrix Electronics and suitable for battery protection circuits, USB port power switches, and IoT sensor node power gating requiring stable component supply, long-lifecycle availability, and consistent parametric performance across production lots.

Supply support for DMP22D5UFZ-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.

This device belongs to Diodes' X2-DFN logic-level MOSFET product line, engineered specifically for ultra-compact, low-voltage power switching in portable and wearable electronics where board space, gate drive compatibility, and thermal efficiency are critical constraints.

FAQ

What is the maximum allowable gate-source voltage for DMP22D5UFZ-7B?

The absolute maximum gate-source voltage (V_GS) is ±8 V per the datasheet's Maximum Ratings table. Exceeding this value risks permanent gate oxide damage. For reliable operation, gate drive should be limited to -4.5 V for full enhancement and kept within -1.5 V to -4.5 V for partial conduction control, avoiding the ±8 V limit with safety margin.

Does DMP22D5UFZ-7B include an integrated body diode, and what is its forward voltage?

Yes, it includes a parasitic body diode inherent to the MOSFET structure. The datasheet specifies V_SD = -1.1 V max at I_S = -10 mA and V_GS = 0 V. This diode conducts from source to drain and is relevant during reverse-current conditions, such as inductive load flyback or bidirectional power paths.

Can DMP22D5UFZ-7B be used in automotive applications?

No - DMP22D5UFZ-7B is not AEC-Q101 qualified. The datasheet explicitly states that automotive-grade versions require specific change control, PPAP capability, and IATF 16949 manufacturing; this part is intended for commercial and industrial applications only. For automotive use, consult Diodes' AEC-Q101-qualified equivalents like DMP22D5UQ-7.

What is the recommended PCB pad layout for thermal reliability?

Per Diodes' package outline documentation, the drain pad (Pin 3) must be connected to a minimum 1.0 mm² copper pour with at least four thermal vias (0.3 mm diameter) to inner ground planes. The suggested pad dimensions are X = 0.280 mm, Y = 0.200 mm, X1 = 0.350 mm, Y1 = 0.600 mm, with solder mask defined to expose full metal area for optimal heat transfer.