Diodes Incorporated DMP26M1UFG-7
- Part No.:
- DMP26M1UFG-7
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
DMP26M1UFG-7.pdf
- Description:
- MOSFET BVDSS: 8V~24V POWERDI3333
- Quantity:
- Payment:

- Shipping:

Inventory:1,970
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Product details
Overview
DMP26M1UFG-7 from Diodes Incorporated is a 20V P-channel enhancement-mode MOSFET in PowerDI3333-8 package, rated for -71A continuous drain current at TC = +25°C, with RDS(ON) of 5.5mΩ at VGS = -4.5V and -15A, optimized for high-efficiency load switching in compact DC/DC power rails and battery protection circuits.
For engineers reviewing the DMP26M1UFG-7 datasheet, DMP26M1UFG-7 pinout, DMP26M1UFG-7 application, or DMP26M1UFG-7 equivalent, key selection criteria include its low on-resistance at low gate drive (-2.5V compatible), thermally efficient exposed-drain package, and validated performance in high-density portable and industrial power management systems.
Technical Context
This P-channel MOSFET operates as a high-side load switch with gate threshold voltage (VGS(TH)) between -0.4V and -1.0V, enabling robust turn-on with standard logic-level controllers. Its RDS(ON) remains stable across junction temperatures up to +150°C, supported by RθJC = 3.0°C/W and RθJA = 41°C/W (with 1-inch² copper plate).
Dynamic parameters include Qg = 75nC at VGS = -4.5V and tF = 107ns, confirming fast switching capability suitable for synchronous buck converters and hot-swap controllers. The integrated body diode exhibits VSD = -0.7V to -1.1V at -10A, supporting bidirectional current handling in reverse-polarity protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | -20V - Withstands up to 20V reverse drain-source voltage without breakdown in load-switch or battery-protection configurations. |
| RDS(ON) | 5.5mΩ @ VGS = -4.5V, -15A - Enables <100mW conduction loss at 7A, critical for thermal budget in space-constrained PCBs. |
| ID (continuous) | -71A @ TC = +25°C - Supports high-current rail switching when mounted on thermally enhanced copper pads. |
| Qg | 75nC @ VGS = -4.5V - Determines gate drive energy requirement; enables efficient operation with low-power microcontroller GPIOs. |
| RθJC | 3.0°C/W - Confirms direct thermal path from junction to case via exposed drain pad, essential for accurate thermal modeling. |
| tF | 107ns - Fall time measured under VDD = -10V, ID = -10A, defining minimum dead-time requirements in half-bridge designs. |
Pinout & Package
Package: PowerDI3333-8 - Thermally enhanced 8-pin surface-mount package with exposed drain pad (pins 1–4 and 6–8 are source terminals; pin 5 is gate; drain connected to underside thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 6, 7, 8 | Source (S) | Seven parallel source connections reduce bond-wire inductance and improve current sharing in high-di/dt load-switch applications. |
| 5 | Gate (G) | Single gate input with RG = 2.05Ω - Enables predictable turn-on/turn-off timing without external gate resistor in most 3.3V/5V control schemes. |
| Drain (exposed pad) | Drain (D) | Thermally and electrically connected to PCB copper pour - primary heat dissipation path and main high-current output node. |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(ON) at -2.5V gate drive | 7.5mΩ @ -2.5V, -10A - Ensures reliable turn-on with 2.5V logic or battery-voltage-referenced controllers in portable systems. |
| PowerDI3333-8 footprint | 33% board area vs. SO-8 - Reduces PCB real estate by >65mm², enabling higher component density in USB-C PD adapters and wearables. |
| Exposed drain thermal pad | RθJC = 3.0°C/W - Delivers 2.3× better thermal resistance than comparable SO-8 MOSFETs, allowing sustained -50A operation with minimal heatsinking. |
| Halogen- and antimony-free "Green" construction | <900ppm Br, <900ppm Cl, <1000ppm Sb - Meets IPC-1752A Class 3 material declarations for automotive and medical OEM compliance. |
Applications
| Battery Protection Circuit | USB-C Power Delivery Switch |
|---|---|
|
Use Scenario: Reverse-polarity and overcurrent protection in 2-cell Li-ion battery packs for power tools and medical devices. IC Role / Device Role / Timing Role: High-side P-channel MOSFET controlling battery-to-load connection; gate driven by dedicated protection IC (e.g., DW01A) with 1ms response. Use Value: 5.5mΩ RDS(ON) limits voltage drop to <40mV at 7A, preserving battery runtime and minimizing thermal rise in sealed enclosures. |
Use Scenario: 20V/5A power path switching in USB-C PD 3.0 sink applications requiring programmable voltage negotiation. IC Role / Device Role / Timing Role: Load switch isolating VBUS from system rails during CC logic handshaking; controlled by PD controller (e.g., FUSB302) GPIO. Use Value: Fast 107ns fall time ensures clean VBUS ramp-down during disconnect, preventing bus contention and meeting USB-IF EMI limits. |
| Industrial PLC I/O Module | Automotive Body Control Module |
|
Use Scenario: 24V DC load switching for solenoid drivers and LED indicators in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: High-side switch managed by isolated microcontroller output; supports PWM dimming at 1kHz with minimal shoot-through risk. Use Value: -71A rating allows derated use at 30A with 50°C ambient, ensuring long-term reliability under continuous industrial duty cycles. |
Use Scenario: Reverse-battery protection and accessory power gating in 12V vehicle subsystems (e.g., infotainment display backlighting). IC Role / Device Role / Timing Role: P-channel MOSFET placed between battery and load, activated only when ignition signal is present and polarity is correct. Use Value: Gate threshold range (-0.4V to -1.0V) guarantees turn-on even with aged battery voltage (down to 10.5V), preventing false shutdowns. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMT2001UFDF-7 | RDS(ON) = 6.2mΩ @ -4.5V, -15A; lower ID = -50A; same PowerDI3333-8 package | Slightly higher conduction loss at full load; reduced thermal margin above 40A continuous | Select when cost sensitivity outweighs peak current demand and board layout allows minor efficiency trade-off. |
| Si7157DP-T1-GE3 | RDS(ON) = 4.8mΩ @ -4.5V, -15A; higher Qg = 92nC; SO-8 package with inferior RθJA = 62°C/W | Larger footprint (2× board area); slower switching due to higher gate charge; requires larger gate driver | Prefer only if legacy SO-8 compatibility is mandatory and thermal headroom exceeds 25°C above ambient. |
Compared with DMT2001UFDF-7 and Si7157DP-T1-GE3, DMP26M1UFG-7 delivers the lowest RDS(ON) in its class with superior thermal performance and smallest footprint-making it optimal for next-generation compact, high-current power switches where efficiency and size are co-constrained.
Availability
DMP26M1UFG-7 is available at Aetrix Electronics and suitable for battery protection circuits, USB-C power delivery switches, and industrial PLC I/O modules requiring stable component supply, consistent parametric performance, and long-term manufacturing continuity.
Supply support for DMP26M1UFG-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global semiconductor manufacturer specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.
DMP26M1UFG-7 belongs to Diodes' Power MOSFET product line, engineered specifically for high-efficiency, high-density load switching in portable, industrial, and automotive power systems where low RDS(ON) and thermal performance are critical.
FAQ
What is the maximum safe operating temperature for DMP26M1UFG-7?
The device has an operating junction temperature range of -55°C to +150°C. Under continuous DC conditions with 1-inch² copper on FR-4, its thermal resistance RθJA is 41°C/W. At 3.0W power dissipation, this yields a 123°C rise above ambient-so maximum ambient must be ≤27°C for safe 150°C junction operation. Derating curves in Figure 7 confirm stable RDS(ON) up to 150°C.
Can DMP26M1UFG-7 be used in avalanche mode?
Yes-it is rated for single-pulse avalanche energy EAS = 71mJ and current IAS = 37A with L = 0.1mH, per Note 8. This capability supports inductive load switching in relay drivers and motor controls where flyback energy must be safely clamped without external snubbers.
Is the PowerDI3333-8 package lead-free and RoHS-compliant?
Yes-DMP26M1UFG-7 is fully lead-free and compliant with EU RoHS directives 2002/95/EC, 2011/65/EU, and 2015/863/EU. Its matte tin annealed terminals meet MIL-STD-202 solderability requirements, and the molding compound is halogen- and antimony-free (<900ppm Br+Cl, <1000ppm Sb), certified "Green" per Diodes' definitions.
How does the multiple-source-pin configuration affect PCB layout?
The seven-source pins (1,2,3,4,6,7,8) require symmetric fan-out traces to minimize current imbalance and parasitic inductance. Recommended layout uses equal-length, ≥0.5mm-wide copper traces connecting all source pins to a common ground plane, avoiding daisy-chaining. The exposed drain pad must be soldered to ≥100mm² of inner-layer copper for optimal thermal performance.
DMP26M1UFG-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 71A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.5V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 5.5mOhm @ 15A, 4.5V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 164 nC @ 10 V
- Vgs (Max):
- ±10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 5392 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.67W (Ta), 3W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- POWERDI3333-8
DMP26M1UFG-7 FAQ
1.How can I place an order for DMP26M1UFG-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMP26M1UFG-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMP26M1UFG-7 reliable?
The price and inventory of DMP26M1UFG-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP26M1UFG-7 is usually 5 days.
3.What payment methods are accepted for DMP26M1UFG-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP26M1UFG-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMP26M1UFG-7?
DMP26M1UFG-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMP26M1UFG-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMP26M1UFG-7?
For technical support, including DMP26M1UFG-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP26M1UFG-7 requirements.
6.How does Aetrix verify that DMP26M1UFG-7 is sourced from the original manufacturer or authorized distributors?
All DMP26M1UFG-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP26M1UFG-7 meets industry standards.
7.What is the process for return or replacement of DMP26M1UFG-7?
All DMP26M1UFG-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMP26M1UFG-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMP26M1UFG-7 part is unused and in its original packaging.
Return procedure for DMP26M1UFG-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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