My Inquiry
My Account
Diodes Incorporated DMP2900UFBQ-7B
- Part No.:
- DMP2900UFBQ-7B
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 3-UFDFN
- Datasheet:
-
DMP2900UFBQ-7B.pdf
- Description:
- MOSFET BVDSS: 8V~24V X1-DFN1006-
- Quantity:
- Payment:
- Shipping:
Inventory:5,101
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DMP2900UFBQ-7B from Diodes Incorporated is a P-channel enhancement-mode MOSFET optimized for low-voltage load switching in space-constrained automotive and portable electronics. It delivers 0.75 Ω RDS(on) at VGS = −4.5 V, −0.99 A continuous drain current, and −20 V drain-source breakdown voltage in a 1.0 mm × 0.6 mm X1-DFN1006-3 package-ideal for USB power switches and battery protection circuits.
For engineers reviewing the DMP2900UFBQ-7B datasheet, DMP2900UFBQ-7B pinout, DMP2900UFBQ-7B application, or DMP2900UFBQ-7B equivalent, key selection criteria include gate threshold voltage (−0.5 to −1.0 V), thermal resistance (113 °C/W with copper pad), AEC-Q101 qualification, and ESD-protected gate architecture for robust system-level reliability.
Technical Context
This MOSFET operates as a high-side load switch with fast turn-on (16 ns delay) and turn-off (213 ns delay) timing, enabled by low total gate charge (0.7 nC) and minimal input capacitance (49 pF). Its −1.0 V typical VGS(th) ensures reliable activation from 1.8 V logic rails.
The device integrates an intrinsic body diode with −0.7 to −1.2 V forward voltage at −150 mA, supporting reverse-current blocking in bidirectional power paths. Junction temperature range spans −55 °C to +150 °C, validated under IATF 16949 manufacturing controls.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | −20 V - Supports 12 V automotive rail and 5 V/3.3 V system inputs with margin |
| RDS(on) | 0.75 Ω @ VGS = −4.5 V - Enables <100 mW conduction loss at 430 mA load |
| ID (continuous) | −0.99 A @ TA = +25 °C - Sustains full-rated current in compact PCB layouts |
| VGS(th) | −0.5 to −1.0 V - Compatible with 1.8 V GPIO control without level shifting |
| Qg | 0.7 nC - Reduces gate drive power and enables high-frequency PWM switching |
| TJ range | −55 °C to +150 °C - Validated for under-hood automotive environments |
| Ciss | 49 pF - Minimizes capacitive loading on driving logic and improves EMI behavior |
Pinout & Package
Package: X1-DFN1006-3 (1.0 mm × 0.6 mm, 0.4 mm height), thermally enhanced leadframe with NiPdAu plating, moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Drain) | Power output node | Connected to load side of switched rail; electrically tied to exposed thermal pad |
| 2 (Source) | Reference return path | Bonded to ground or supply rail; forms source terminal for P-channel operation |
| 3 (Gate) | Control input | ESD-protected interface accepting −4.5 V logic; requires no external gate resistor for ≤1 MHz switching |
Key Features
| Feature | Design Value |
|---|---|
| 0.6 mm² footprint | 13× smaller than SOT-23 - saves >1.2 mm² PCB area per switch in multi-rail PMICs |
| AEC-Q101 qualified | Validated for automotive load switching per stress test requirements including HTGB, HTRB, and TC |
| Low RDS(on) vs. VGS | 1.05 Ω @ VGS = −2.5 V - enables stable operation down to 2.5 V battery voltage |
| ESD-protected gate | HBM rating ≥2 kV - eliminates need for external TVS in most board-level ESD events |
| Green, halogen-free | <900 ppm Br+Cl, <1000 ppm Sb - compliant with JEDEC J-STD-709 and EU RoHS 3 |
Applications
| USB Type-C Power Delivery Switch | Automotive Body Control Module |
|---|---|
|
Use Scenario: Isolating VBUS during hot-plug insertion to prevent inrush and bus contention. IC Role / Device Role / Timing Role: High-side load switch controlling 5 V/20 V power path with <200 ns response to CC logic signals. Use Value: 0.75 Ω RDS(on) limits voltage drop to <400 mV at 500 mA, preserving PD negotiation margins. |
Use Scenario: Enabling/disabling LED lighting zones in door modules and interior ambient lighting. IC Role / Device Role / Timing Role: Low-quiescent-load power switch driven directly by 3.3 V microcontroller GPIO. Use Value: −0.83 A rating at VGS = −2.5 V supports 3× 20 mA LEDs per channel with headroom. |
| Portable Medical Sensor Node | Industrial IoT Edge Controller |
|
Use Scenario: Power gating BLE radio and analog front-end during sleep cycles to extend battery life. IC Role / Device Role / Timing Role: Ultra-low-leakage (−100 nA IDSS) switch enabling >10-year shelf life in sealed devices. Use Value: 0.001 g mass and 0.6 mm² footprint minimize weight and volume in wearable form factors. |
Use Scenario: Controlling auxiliary 3.3 V rail for isolated CAN transceivers and sensor interfaces. IC Role / Device Role / Timing Role: AEC-Q101-qualified switch ensuring functional safety compliance in ASIL-B subsystems. Use Value: 150 °C max junction temperature supports operation in unventilated DIN-rail enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN2016LFG-7 | RDS(on) = 0.85 Ω @ −4.5 V; SOT-723 package (1.2 × 0.8 mm); higher RθJA (250 °C/W) | Larger footprint; less suitable for ultra-dense USB-C designs but offers higher ID (−1.2 A) | Select when higher current headroom outweighs board space constraints |
| AO3401 | RDS(on) = 0.085 Ω @ −4.5 V; SOT-23 package; not AEC-Q101 qualified | Lower on-resistance but larger size (2.9 × 1.3 mm); unsuitable for automotive PPAP programs | Prefer for cost-sensitive consumer applications where qualification is not required |
Compared with DMN2016LFG-7 and AO3401, DMP2900UFBQ-7B uniquely balances ultra-small footprint, AEC-Q101 compliance, and gate-threshold compatibility with 1.8 V logic-making it optimal for next-generation automotive USB-C and space-limited industrial sensors.
Availability
DMP2900UFBQ-7B is available at Aetrix Electronics and suitable for USB Type-C power delivery systems, automotive body control modules, and portable medical sensor nodes requiring stable component supply across extended product lifecycles.
Supply support for DMP2900UFBQ-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in IATF 16949-certified facilities.
This device belongs to Diodes' Automotive-Grade Power MOSFET product line, engineered specifically for high-reliability load switching in harsh-environment applications including infotainment, ADAS, and body electronics.
FAQ
What is the maximum allowable gate-source voltage for DMP2900UFBQ-7B?
The absolute maximum VGS rating is ±6 V. Operation beyond this risks irreversible gate oxide damage. For reliable 1.8 V logic interfacing, the −0.5 to −1.0 V VGS(th) ensures clean turn-on while maintaining safe margin below the ±6 V limit under transient conditions.
Can DMP2900UFBQ-7B be used in high-frequency PWM applications?
Yes-it supports PWM switching up to 1 MHz due to low Qg (0.7 nC), fast tD(on) (16 ns), and minimal Ciss (49 pF). However, thermal derating must be applied above 100 kHz in high-duty-cycle scenarios to maintain TJ ≤ 150 °C on standard FR-4 layouts.
Is the exposed thermal pad electrically connected to any terminal?
Yes-the thermal pad is internally connected to the Drain (Pin 1). It must be soldered to a PCB copper pour for both thermal performance and electrical continuity. The datasheet specifies a recommended 0.70 mm × 0.70 mm pad with thermal vias to inner ground planes.
Does DMP2900UFBQ-7B require external gate pull-down resistors?
No-its gate leakage (±2.0 μA) and ESD protection structure ensure stable off-state without external biasing. However, a 10–100 kΩ pull-down is recommended in systems with long PCB traces or noisy environments to prevent unintended turn-on from capacitive coupling.
DMP2900UFBQ-7B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 3-UFDFN
- Packaging:
- Bulk
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 990mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 750mOhm @ 430mA, 4.5V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 0.7 nC @ 4.5 V
- Vgs (Max):
- ±6V
- Input Capacitance (Ciss) (Max) @ Vds:
- 49 pF @ 16 V
- FET Feature:
- -
- Power Dissipation (Max):
- 550mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X1-DFN1006-3
DMP2900UFBQ-7B FAQ
1.How can I place an order for DMP2900UFBQ-7B through Aetrix?
Please submit a Request for Quotation (RFQ) for DMP2900UFBQ-7B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMP2900UFBQ-7B reliable?
The price and inventory of DMP2900UFBQ-7B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP2900UFBQ-7B is usually 5 days.
3.What payment methods are accepted for DMP2900UFBQ-7B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP2900UFBQ-7B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMP2900UFBQ-7B?
DMP2900UFBQ-7B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMP2900UFBQ-7B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMP2900UFBQ-7B?
For technical support, including DMP2900UFBQ-7B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP2900UFBQ-7B requirements.
6.How does Aetrix verify that DMP2900UFBQ-7B is sourced from the original manufacturer or authorized distributors?
All DMP2900UFBQ-7B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP2900UFBQ-7B meets industry standards.
7.What is the process for return or replacement of DMP2900UFBQ-7B?
All DMP2900UFBQ-7B units undergo pre-shipment inspection (PSI). If there is an issue with DMP2900UFBQ-7B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMP2900UFBQ-7B part is unused and in its original packaging.
Return procedure for DMP2900UFBQ-7B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DMP2900UFBQ-7B Tags
-
BSZ180P03NS3EGATMA1
Infineon Technologies
-
SIRA14DP-T1-GE3
Vishay Siliconix
-
AO4419
Alpha & Omega Semiconductor Inc.
-
SISA14BDN-T1-GE3
Vishay Siliconix
-
PSMN9R5-30YLC,115
Nexperia USA Inc.
-
BUK9Y21-40E,115
Nexperia USA Inc.
-
RTQ035N03HZGTR
Rohm Semiconductor
-
FDMS7680
onsemi
-
RQ3E180BNTB
Rohm Semiconductor
-
STL6N2VH5
STMicroelectronics
-
DMPH4029LFGQ-7
Diodes Incorporated
-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
