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Diodes Incorporated DMP3007SCG-13
- Part No.:
- DMP3007SCG-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
DMP3007SCG-13.pdf
- Description:
- MOSFET P-CH 30V 50A 8DFN
- Quantity:
- Payment:
- Shipping:
Inventory:839
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Product details
Overview
DMP3007SCG-13 from Diodes Incorporated is a 30V P-channel enhancement-mode MOSFET in a V-DFN3333-8 (Type B) package, optimized for high-efficiency power management with 6.8 mΩ RDS(ON) at VGS = −10 V and −50 A continuous drain current at TC = +25°C. It serves as a low-loss synchronous rectifier or load switch in compact DC-DC converters and LED backlighting circuits.
For engineers reviewing the DMP3007SCG-13 datasheet, DMP3007SCG-13 pinout, DMP3007SCG-13 application, or DMP3007SCG-13 equivalent, key selection criteria include its thermally efficient 3.3 mm × 3.3 mm footprint, 8 kV HBM ESD rating, −30 V VDSS, gate threshold range of −1.0 to −3.0 V, and validated performance under pulsed avalanche conditions (EAS = 130 mJ).
Technical Context
This P-channel MOSFET employs a trench-gate process to achieve low on-resistance while maintaining fast switching characteristics: tD(OFF) = 306 ns and Qg = 64.2 nC at VGS = −10 V. Its integrated body diode supports reverse recovery (tRR = 19 ns, QRR = 9.8 nC), enabling use in synchronous buck topologies without external diode substitution.
The device features an exposed drain pad for direct thermal conduction to PCB copper, delivering RθJC = 4.0°C/W and RθJA = 52°C/W with 1-inch² copper pour. Gate protection diodes and NiPdAu-plated terminals ensure robust ESD immunity and solderability per MIL-STD-202.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | −30 V - Maximum blocking voltage before avalanche onset in high-side switch configurations |
| RDS(ON) | 6.8 mΩ @ VGS = −10 V - Enables <1.5 W conduction loss at −11.5 A, critical for thermal budget in space-constrained converters |
| ID (Continuous) | −50 A @ TC = +25°C - Supports high-current load switching when mounted on thermally enhanced PCB layout |
| Qg | 64.2 nC @ VGS = −10 V - Determines gate drive power requirement and switching speed trade-off in PWM control |
| EAS | 130 mJ - Specifies single-pulse avalanche energy handling capability for inductive load transient suppression |
| HBM ESD | 8 kV - Ensures robustness during board assembly and system-level electrostatic discharge events |
| RθJA | 52°C/W (with 1″² copper) - Defines junction-to-ambient thermal resistance under recommended heatsinking conditions |
Pinout & Package
Package: V-DFN3333-8 (Type B), 3.3 mm × 3.3 mm × 0.8 mm profile with exposed drain pad (Pin 1–4 and Pin 5–8 are source terminals; Pin 7 is gate; Pin 8 is drain). Molded green compound, UL 94V-0 rated, moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Source (S) | Four parallel source connections reduce bond wire inductance and improve current sharing in high-frequency operation |
| 5, 6 | Source (S) | Additional source terminals enhance thermal conduction path from die to PCB copper via multiple solder joints |
| 7 | Gate (G) | Single gate input with 23 Ω intrinsic gate resistance-limits dV/dt-induced shoot-through in half-bridge layouts |
| 8 | Drain (D) | Exposed drain pad occupies full bottom surface-provides primary thermal path to PCB ground plane |
Key Features
| Feature | Design Value |
|---|---|
| Thermally optimized footprint | 33% board area vs. SO-8-enables higher power density in portable and automotive lighting modules |
| Low RDS(ON) at 4.5 V drive | 13 mΩ @ VGS = −4.5 V-supports logic-level gate drive from 5 V microcontrollers without level-shifting |
| Integrated gate protection | On-chip Zener clamp and diode-eliminates need for external gate protection components in cost-sensitive designs |
| Green material compliance | Halogen- and antimony-free (<900 ppm Br/Cl, <1000 ppm Sb)-meets IPC-1752A Class 3 environmental reporting requirements |
Applications
| LED Backlighting | USB-C Power Delivery Switch |
|---|---|
Use Scenario: Driving white LED strings in thin-profile LCD displays with dynamic dimming. IC Role / Device Role / Timing Role: High-side load switch controlling current flow to boost converter output stage. Use Value: 6.8 mΩ RDS(ON) minimizes voltage drop across switch, preserving headroom for LED forward voltage and improving efficiency by >1.2% at 2 A. | Use Scenario: Reverse-voltage protection and hot-swap control in USB-C PD sink applications. IC Role / Device Role / Timing Role: P-channel MOSFET configured as ideal diode with gate driven by dedicated PD controller. Use Value: 8 kV HBM ESD rating ensures reliability during repeated plug/unplug cycles; 13 mΩ RDS(ON) at −4.5 V enables direct interface with 5 V logic outputs. |
| Automotive Body Control Module | Industrial DC-DC POL Converter |
Use Scenario: Low-side switching of solenoids and relays in 12 V vehicle subsystems. IC Role / Device Role / Timing Role: Load switch with integrated body diode managing inductive kickback during turn-off. Use Value: 130 mJ avalanche energy rating absorbs flyback energy without external snubber, reducing BOM count and board area. | Use Scenario: Synchronous rectification in 48 V to 12 V point-of-load converters for industrial PLCs. IC Role / Device Role / Timing Role: Secondary-side switch replacing Schottky diode to reduce conduction losses. Use Value: 5.7 mΩ typical RDS(ON) cuts rectifier loss by 65% vs. 40 V Schottky, improving full-load efficiency from 92.1% to 94.8%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMT3007LSD-13 | Same RDS(ON) (6.8 mΩ), but in larger PowerDI3333 package with higher RθJA (60°C/W) | Requires more PCB area; better suited for lower-power, cost-driven consumer applications | Select when thermal margin exceeds 15°C and board space permits larger footprint |
| Si2307DS-T1-GE3 | Higher RDS(ON) (22 mΩ @ −4.5 V); lower ID (−4.5 A); smaller SOT-23 package | Limited to sub-1 A loads; unsuitable for high-current DC-DC or backlighting | Choose only for ultra-low-cost, low-current signal-switching roles-not for power switching |
Compared with DMT3007LSD-13 and Si2307DS-T1-GE3, DMP3007SCG-13 delivers superior thermal performance (RθJA = 52°C/W) and higher current capability (−50 A) in the smallest footprint, making it optimal for space- and efficiency-critical power stages where thermal dissipation must be minimized without sacrificing current rating.
Availability
DMP3007SCG-13 is available at Aetrix Electronics and suitable for LED backlighting, USB-C power delivery systems, and automotive body control modules requiring stable component supply and consistent parametric performance across production batches.
Supply support for DMP3007SCG-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for industrial, computing, and automotive markets.
The DMP3007SCG belongs to Diodes' PowerMOS™ portfolio, engineered specifically for high-efficiency, high-density DC-DC conversion and load switching where low RDS(ON), fast switching, and thermally robust packaging are essential.
FAQ
What is the maximum safe operating temperature for DMP3007SCG-13?
The device supports junction temperatures from −55°C to +150°C. Under continuous operation with 1-inch² copper pour, its RθJA = 52°C/W allows a maximum ambient temperature of +105°C at 2.4 W power dissipation. Derating is required above 25°C ambient per the datasheet's thermal curves.
Does DMP3007SCG-13 require external gate resistors for stability?
No external gate resistor is mandatory due to its intrinsic 23 Ω gate resistance, which dampens ringing and limits peak gate current. However, a 5–10 Ω series resistor is recommended in high-dV/dt environments (e.g., half-bridge configurations) to further suppress oscillation and reduce EMI.
Can DMP3007SCG-13 be used in avalanche mode repeatedly?
The device is rated for single-pulse avalanche energy (EAS = 130 mJ), but repetitive avalanche operation is not characterized or guaranteed. For inductive load switching, use clamping circuits or snubbers to avoid sustained avalanche stress, which may degrade long-term reliability.
Is the exposed drain pad electrically isolated from other terminals?
No-the exposed drain pad (Pin 8) is electrically connected to the MOSFET's drain terminal and must be soldered to a PCB copper pour designated as the drain net. It is not insulated and serves as both the primary thermal path and the main current-carrying node for high-current paths.
DMP3007SCG-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 50A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 6.8mOhm @ 11.5A, 10V
- Vgs(th) (Max) @ Id:
- 3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 64.2 nC @ 10 V
- Vgs (Max):
- ±25V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2826 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.4W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- V-DFN3333-8 (Type B)
DMP3007SCG-13 FAQ
1.How can I place an order for DMP3007SCG-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMP3007SCG-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMP3007SCG-13 reliable?
The price and inventory of DMP3007SCG-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP3007SCG-13 is usually 5 days.
3.What payment methods are accepted for DMP3007SCG-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP3007SCG-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMP3007SCG-13?
DMP3007SCG-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMP3007SCG-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMP3007SCG-13?
For technical support, including DMP3007SCG-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP3007SCG-13 requirements.
6.How does Aetrix verify that DMP3007SCG-13 is sourced from the original manufacturer or authorized distributors?
All DMP3007SCG-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP3007SCG-13 meets industry standards.
7.What is the process for return or replacement of DMP3007SCG-13?
All DMP3007SCG-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMP3007SCG-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMP3007SCG-13 part is unused and in its original packaging.
Return procedure for DMP3007SCG-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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