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Diodes Incorporated DMP3008SFGQ-13
- Part No.:
- DMP3008SFGQ-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
DMP3008SFGQ-13.pdf
- Description:
- MOSFET P-CH 30V 8.6A PWRDI3333-8
- Quantity:
- Payment:
- Shipping:
Inventory:5,800
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Product details
Overview
DMP3008SFGQ-13 from Diodes Incorporated is a 30V P-channel enhancement-mode MOSFET in PowerDI®3333-8 package, featuring 17mΩ RDS(ON) at VGS = −10V, −8.6A continuous drain current at TA = 25°C, and AEC-Q101 qualification for automotive reliability. It serves as a high-efficiency synchronous rectifier or load switch in DC-DC converters and backlight power stages.
For engineers reviewing the DMP3008SFGQ-13 datasheet, DMP3008SFGQ-13 pinout, DMP3008SFGQ-13 application, or DMP3008SFGQ-13 equivalent, key selection criteria include low RDS(ON) at −4.5V gate drive, thermally efficient PowerDI3333-8 footprint, AEC-Q101 compliance, and body diode forward voltage of −0.7V at −1A.
Technical Context
This MOSFET employs a trench-gate process to achieve low on-resistance while maintaining fast switching performance (tD(ON) = 10.5ns, tF = 40ns) and low gate charge (Qg = 47nC at −10V). Its −1.6V typical gate threshold voltage enables robust turn-on with standard logic-level drivers.
The device integrates a monolithic body diode with VSD = −0.7V at −1A and exhibits stable RDS(ON) over temperature (1.5× increase from −55°C to +150°C), supported by RθJC = 7.1°C/W for direct heatsinking via the exposed drain pad.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | −30V - Withstands reverse-biased drain-source voltage up to 30V in blocking state. |
| RDS(ON) | 17mΩ @ VGS = −10V - Enables <145mW conduction loss at −8.6A, critical for high-efficiency power stages. |
| ID (continuous) | −7.1A @ VGS = −4.5V, TA = 25°C - Supports logic-level gate drive in space-constrained buck converter topologies. |
| Qg | 47nC @ VGS = −10V - Determines gate driver power requirement and switching transition time in PWM circuits. |
| RθJA | 57°C/W (with 1-inch² copper) - Defines thermal derating slope: ~1.8W max power at 100°C ambient before exceeding 150°C junction limit. |
| VGS(th) | −1.6V (typ) - Ensures full enhancement with −3.3V or −5V logic outputs without level-shifting circuitry. |
| VSD | −0.7V @ IS = −1A - Reduces reverse-conduction losses in synchronous rectification and bidirectional power paths. |
Pinout & Package
Package: PowerDI®3333-8 - Thermally enhanced surface-mount package with exposed drain pad for direct PCB heatsinking; occupies 33% board area of SO-8; RoHS-compliant matte tin finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Source (S) | Common source connection for all four parallel internal cells; tied to ground or low-side reference in high-side switch configurations. |
| 5, 6, 7, 8 | Drain (D) | High-current output node connected to exposed copper pad; primary heat path to PCB; requires thermal relief design per AP02001 layout guidelines. |
| Gate (G) | Control input | Single gate terminal (pin not assigned individually; internal gate bus connects to leadframe); accepts −10V or −4.5V logic-level drive. |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(ON) at −4.5V | 25mΩ - Enables use with 3.3V microcontrollers in battery-powered DC-DC modules without gate drivers. |
| Thermally optimized package | RθJC = 7.1°C/W - Allows >2W pulsed power dissipation when mounted on 1-inch² copper, reducing need for external heatsinks. |
| AEC-Q101 qualification | Qualified for automotive power management - Validated for temperature cycling, HTRB, and ESD per AEC stress test standards. |
| Green construction | Halogen- and antimony-free (<900ppm Br/Cl, <1000ppm Sb) - Meets automotive OEM environmental requirements and EU ELV directives. |
| Small footprint | 3.3mm × 3.3mm outline - Saves board space in portable electronics where SO-8 is prohibitively large for multi-phase regulators. |
Applications
| Automotive LED Headlight Driver | USB-C PD Buck Converter |
|---|---|
Use Scenario: High-side switch controlling 12V–24V LED strings in adaptive front lighting systems (AFS). IC Role / Device Role / Timing Role: P-channel high-side load switch enabling rapid on/off control and reverse-polarity protection. Use Value: 17mΩ RDS(ON) limits power loss to <1.5W at 8A, preventing thermal runaway during extended beam operation. |
Use Scenario: Synchronous rectifier in 20V-to-5V buck stage of USB-C power delivery adapter. IC Role / Device Role / Timing Role: Low-side synchronous rectifier replacing Schottky diode to improve efficiency above 2A load. Use Value: −0.7V VSD and 25mΩ RDS(ON) at −4.5V reduce conduction loss by 40% vs. 40V Schottky in 5A applications. |
| Industrial PLC Digital Output Module | Smartphone Backlight Boost Converter |
Use Scenario: Solid-state relay replacement in 24V digital output channels driving solenoids and indicators. IC Role / Device Role / Timing Role: P-channel MOSFET configured as high-side switch with integrated gate pull-up for fail-safe off-state. Use Value: AEC-Q101 qualification ensures 10-year field reliability under industrial temperature cycling (−40°C to +85°C). |
Use Scenario: Current-sink switch regulating white LED current in AMOLED display backlight circuits. IC Role / Device Role / Timing Role: Low-RDS(ON) current sink enabling precise PWM dimming at 1–3A per channel. Use Value: 3.3mm × 3.3mm footprint fits within tight bezel constraints; 0.008g weight minimizes mechanical stress on flex PCBs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMG3415L-7 | RDS(ON) = 25mΩ @ −4.5V; SO-8 package; no AEC-Q101 qualification | Larger footprint (5mm × 6mm); higher thermal resistance (RθJA = 62°C/W) | Preferred for cost-sensitive industrial non-automotive designs where AEC-Q101 is not required. |
| IPD250N03L G | RDS(ON) = 2.5mΩ @ −10V; TO-252 package; 30V rating; AEC-Q101 qualified | Higher current (25A), larger TO-252 footprint; requires more PCB area and thermal mass | Selected when >10A continuous current or lower RDS(ON) is mandatory, accepting larger board real estate. |
Compared with DMG3415L-7, DMP3008SFGQ-13 offers 33% smaller footprint and automotive qualification; versus IPD250N03L G, it trades 7× higher RDS(ON) for 60% smaller area and lower gate charge-ideal for compact 5–8A power rails.
Availability
DMP3008SFGQ-13 is available at Aetrix Electronics and suitable for automotive LED drivers, USB-C PD adapters, and industrial PLC output modules requiring stable component supply across multi-year production cycles.
Supply support for DMP3008SFGQ-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and the U.S.
This device belongs to Diodes' PowerMOS™ portfolio, engineered specifically for high-efficiency, space-constrained power conversion in automotive and industrial applications where thermal density and AEC-Q101 compliance are mandatory.
FAQ
What is the maximum safe operating junction temperature for DMP3008SFGQ-13?
The absolute maximum junction temperature is +150°C per the datasheet. Derating begins at +25°C ambient using RθJA = 57°C/W (with 1-inch² copper), allowing ~2.2W continuous power at +70°C ambient. Exceeding 150°C risks permanent parametric shift or bondwire failure.
Can DMP3008SFGQ-13 be used with 3.3V GPIO for gate drive?
Yes-its −1.6V typical VGS(th) and 25mΩ RDS(ON) at −4.5V ensure reliable enhancement with 3.3V logic. However, full RDS(ON) specification (17mΩ) requires −10V drive; at −3.3V, RDS(ON) rises to ~45mΩ, increasing conduction loss proportionally.
How does the PowerDI3333-8 package improve thermal performance over SO-8?
PowerDI3333-8 reduces RθJA from ~62°C/W (SO-8) to 57°C/W (with same copper area) due to its exposed drain pad directly soldered to PCB copper. Its 3.3mm × 3.3mm footprint also allows tighter thermal vias placement, improving heat spreading efficiency by 22% in comparative board-level testing.
Is the body diode suitable for reverse-current protection in hot-swap applications?
Yes-the integrated body diode has VSD = −0.7V at −1A and is rated for −3.0A continuous forward current. In hot-swap circuits, it provides inherent reverse-current blocking when the MOSFET is off, but external Schottky clamping is recommended for >5A surge currents to avoid diode thermal runaway.
DMP3008SFGQ-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 8.6A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 17mOhm @ 10A, 10V
- Vgs(th) (Max) @ Id:
- 2.1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 47 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2230 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 900mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- POWERDI3333-8
DMP3008SFGQ-13 FAQ
1.How can I place an order for DMP3008SFGQ-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMP3008SFGQ-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMP3008SFGQ-13 reliable?
The price and inventory of DMP3008SFGQ-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP3008SFGQ-13 is usually 5 days.
3.What payment methods are accepted for DMP3008SFGQ-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP3008SFGQ-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMP3008SFGQ-13?
DMP3008SFGQ-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMP3008SFGQ-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMP3008SFGQ-13?
For technical support, including DMP3008SFGQ-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP3008SFGQ-13 requirements.
6.How does Aetrix verify that DMP3008SFGQ-13 is sourced from the original manufacturer or authorized distributors?
All DMP3008SFGQ-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP3008SFGQ-13 meets industry standards.
7.What is the process for return or replacement of DMP3008SFGQ-13?
All DMP3008SFGQ-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMP3008SFGQ-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMP3008SFGQ-13 part is unused and in its original packaging.
Return procedure for DMP3008SFGQ-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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