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Diodes Incorporated DMP3025SFDF-13

Part No.:
DMP3025SFDF-13
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
6-UDFN Exposed Pad
Datasheet:
AetrixDMP3025SFDF-13.pdf
Description:
MOSFET BVDSS: 25V~30V U-DFN2020-
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,177

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Product details

Overview

DMP3025SFDF-13 from Diodes Incorporated is a P-channel enhancement-mode MOSFET in U-DFN2020-6 (Type F) package, rated for -30V VDSS, 19mΩ RDS(ON) @ VGS = -10V, and -8.6A continuous drain current at TA = +25°C. It serves as a high-efficiency synchronous rectifier or load switch in compact DC-DC converters and battery management systems.

For engineers reviewing the DMP3025SFDF-13 datasheet, DMP3025SFDF-13 pinout, DMP3025SFDF-13 application, or DMP3025SFDF-13 equivalent, key selection criteria include low-profile 0.6mm height, ESD-protected gate, -1.2V to -2.6V gate threshold voltage, and thermal resistance of 59.7°C/W with enhanced copper pad layout.

Technical Context

This MOSFET employs a trench-gate structure optimized for low RDS(ON) while maintaining fast switching performance via low Qg (20nC @ VGS = -10V) and low Ciss (1031pF). Its negative VGS(TH) enables direct logic-level drive from 3.3V/5V controllers in high-side configurations.

The integrated body diode exhibits VSD = -0.7V @ IS = -2A and supports reverse recovery in buck converter freewheeling paths. Thermal design leverages the U-DFN2020-6's low RθJC (8.4°C/W) and 1-inch² copper plate layout for 2.1W power dissipation.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS-30V - Maximum blocking voltage in high-side switch or reverse polarity protection circuits
RDS(ON)19mΩ @ VGS = -10V - Enables <150mW conduction loss at 8.6A in 12V input DC-DC stages
ID (max)-8.6A @ TA = +25°C - Supports >10W load switching with FR-4 board and 1-inch² copper
Qg20nC @ VGS = -10V - Reduces gate drive power and switching transition time in 500kHz+ converters
RθJA59.7°C/W - Achievable with 1-inch² copper pad; limits junction rise to ~120°C at 2.1W dissipation
VGS(TH)-1.2V to -2.6V - Ensures reliable turn-on with 3.3V GPIO or dedicated gate drivers without level shifting
Ciss1031pF @ VDS = -15V - Minimizes Miller effect during hard-switching transitions

Pinout & Package

U-DFN2020-6 (Type F) is a 2.0mm × 2.0mm × 0.6mm leadless surface-mount package with exposed thermal pad on bottom side and NiPdAu-plated terminals. It complies with J-STD-020 Level 1 moisture sensitivity and UL 94V-0 flammability rating.

Pin/TerminalCircuit RoleDesign Meaning
1 (Top-left corner marker)SourceMain current return path; tied to ground or low-side rail in high-side switch topology
2GateControl terminal requiring <20nC charge for full enhancement; ESD-protected per HBM 2kV
3DrainHigh-voltage input node; connects to input rail in load switch or buck high-side position
4SourceSecond source connection; paralleled with Pin 1 to reduce package inductance and improve thermal spreading
5DrainSecond drain connection; paralleled with Pin 3 to lower RDS(ON) contribution from bond wires
6 (Exposed Pad)Source (Thermal)Primary heat transfer path to PCB; must be soldered to ≥1-inch² copper area for rated 2.1W PD

Key Features

FeatureDesign Value
Low-profile 0.6mm heightEnables use in space-constrained portable electronics and ultra-thin power modules
ESD-protected gateHBM-rated to 2kV, eliminating need for external gate protection in automated assembly lines
Lead-free & halogen-freeComplies with RoHS 3 (2015/863/EU) and Diodes' "Green" definition (<900ppm Br/Cl, <1000ppm Sb)
Optimized for logic-level driveVGS(TH) range ensures full enhancement with 3.3V microcontroller outputs without gate driver ICs
Enhanced thermal pad designExposed Source pad reduces RθJA by 37% versus standard layout (95.7 → 59.7°C/W)

Applications

Battery Protection CircuitUSB-C Power Delivery Switch

Use Scenario: Reverse polarity and overcurrent protection in single-cell Li-ion battery packs for wearables and medical sensors.

IC Role / Device Role / Timing Role: High-side load switch controlling battery-to-system power path with fast turn-off during fault detection.

Use Value: 19mΩ RDS(ON) limits voltage drop to <160mV at 8.6A, preserving battery runtime and enabling accurate coulomb counting.

Use Scenario: Input power path control in USB-C PD sink devices supporting 20V/5A operation.

IC Role / Device Role / Timing Role: P-channel MOSFET configured as hot-swap controller between Type-C connector and internal DC-DC stage.

Use Value: -30V VDSS withstands 20V PD transients plus margin; 0.6mm profile fits within tight connector keep-out zones.

Point-of-Load DC-DC ConverterIndustrial Sensor Node Power Rail

Use Scenario: Synchronous rectification in 12V-to-3.3V buck converters powering FPGA I/O banks or high-speed SerDes.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier replacing Schottky diode to reduce conduction losses and improve efficiency above 500kHz.

Use Value: 21mΩ RDS(ON) @ VGS = -5V enables >92% efficiency at 5A output with minimal thermal derating.

Use Scenario: Always-on power switch for wireless sensor nodes powered by coin-cell or energy-harvesting sources.

IC Role / Device Role / Timing Role: Ultra-low-quiescent-load enable switch isolating MCU peripherals during deep sleep modes.

Use Value: Gate leakage <±10µA and VGS(TH) stability over -55°C to +150°C ensure reliable wake-up across industrial temperature ranges.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMG3415L-7RDS(ON) = 28mΩ @ VGS = -4.5V; larger U-DFN2020-6 footprint (2.1×2.1mm)Higher conduction loss at 3.3V gate drive; less suitable for high-current 5V logic interfacesSelect when cost sensitivity outweighs RDS(ON) and thermal performance requirements
AO3415RDS(ON) = 30mΩ @ VGS = -4.5V; no specified ESD rating; RθJA = 120°C/W (standard layout)Limited thermal headroom in compact layouts; requires external gate protection in ESD-prone environmentsChoose only for non-critical consumer applications where qualification rigor is not required

Compared with DMG3415L-7 and AO3415, DMP3025SFDF-13 delivers 32% lower RDS(ON) at -5V drive and 40% better thermal resistance, making it optimal for thermally constrained, high-efficiency industrial and portable designs.

Availability

DMP3025SFDF-13 is available at Aetrix Electronics and suitable for battery protection circuits, USB-C power delivery switches, and point-of-load DC-DC converters requiring stable component supply and long-term production continuity.

Supply support for DMP3025SFDF-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

This device belongs to Diodes' PowerMOS™ portfolio, engineered specifically for high-efficiency, space-constrained power management in portable, industrial, and automotive-qualified systems.

FAQ

What is the maximum safe operating junction temperature for DMP3025SFDF-13?

The absolute maximum junction temperature is +150°C, and the device is characterized for RDS(ON) stability up to this limit. Operation beyond this temperature risks permanent parametric shift or bond wire failure. Derating curves in Figure 7 confirm usable RDS(ON) performance across the full -55°C to +150°C range.

Can DMP3025SFDF-13 be used in automotive applications?

This part is not AEC-Q101 qualified. While its -55°C to +150°C operating range meets automotive ambient requirements, Diodes explicitly states that automotive-grade versions require separate PPAP-capable qualification and IATF 16949 manufacturing. Customers must contact Diodes directly for AEC-compliant variants.

How does the U-DFN2020-6 (Type F) package differ from standard U-DFN2020-6?

Type F specifies tighter dimensional tolerances (e.g., A = 0.57–0.63mm height), enhanced thermal pad metallization (NiPdAu), and J-STD-020 Level 1 moisture sensitivity. These features enable higher reliability in reflow processes and improved thermal transfer versus generic U-DFN2020-6 packages lacking these controls.

Is the body diode suitable for reverse recovery in synchronous rectification?

Yes - the intrinsic body diode has VSD = -0.7V @ IS = -2A and exhibits soft reverse recovery behavior confirmed by characterization data. However, for hard-switched topologies above 1MHz, external Schottky clamping may still be advised to minimize ringing.

DMP3025SFDF-13 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
6-UDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
P-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
8.6A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
5V, 10V
Rds On (Max) @ Id, Vgs:
19mOhm @ 8A, 10V
Vgs(th) (Max) @ Id:
2.6V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
20 nC @ 10 V
Vgs (Max):
±25V
Input Capacitance (Ciss) (Max) @ Vds:
1031 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
1.3W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
U-DFN2020-6 (Type F)

DMP3025SFDF-13 FAQ

1.How can I place an order for DMP3025SFDF-13 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMP3025SFDF-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMP3025SFDF-13 reliable?

The price and inventory of DMP3025SFDF-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP3025SFDF-13 is usually 5 days.

3.What payment methods are accepted for DMP3025SFDF-13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP3025SFDF-13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMP3025SFDF-13?

DMP3025SFDF-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMP3025SFDF-13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMP3025SFDF-13?

For technical support, including DMP3025SFDF-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP3025SFDF-13 requirements.

6.How does Aetrix verify that DMP3025SFDF-13 is sourced from the original manufacturer or authorized distributors?

All DMP3025SFDF-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP3025SFDF-13 meets industry standards.

7.What is the process for return or replacement of DMP3025SFDF-13?

All DMP3025SFDF-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMP3025SFDF-13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMP3025SFDF-13 part is unused and in its original packaging.

Return procedure for DMP3025SFDF-13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMP3025SFDF-13 Tags

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