Diodes Incorporated DMP31D1UFB4-7B
- Part No.:
- DMP31D1UFB4-7B
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 3-XFDFN
- Datasheet:
-
DMP31D1UFB4-7B.pdf
- Description:
- MOSFET BVDSS: 8V~24V X2-DFN1006-
- Quantity:
- Payment:

- Shipping:

Inventory:3,612
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Product details
Overview
DMP31D1UFB4-7B from Diodes Incorporated is a 30V P-channel enhancement-mode MOSFET in X2-DFN1006-3 package, designed for low-voltage load switching in space-constrained portable electronics. It delivers RDS(ON) = 0.6Ω (typ) at VGS = −4.5V, supports −0.9A continuous drain current at +25°C, and features ESD-protected gate with −1.1V max VGS(TH).
For engineers reviewing the DMP31D1UFB4-7B datasheet, DMP31D1UFB4-7B pinout, DMP31D1UFB4-7B application, or DMP31D1UFB4-7B equivalent, key selection criteria include ultra-small footprint (0.6 mm²), low gate threshold for 1.8V–2.5V logic compatibility, thermal resistance of 103°C/W on optimized PCB, and body diode forward voltage of −0.8V at −300mA.
Technical Context
This MOSFET employs a trench-gate silicon process optimized for low RDS(ON) while maintaining fast switching (tr = 11 ns, tf = 20 ns) and low gate charge (Qg = 1.0 nC @ −4.5V). Its −30V VDSS rating and ±8V VGSS support robust operation in battery-powered systems with transient overvoltage exposure.
The device integrates an ESD protection diode across gate-source terminals and uses NiPdAu-plated copper leadframe for solderability and reliability. Thermal performance is characterized under two mounting conditions: 248°C/W (minimal pad) and 103°C/W (1-inch² copper), enabling accurate power derating in real layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | −30 V - Withstands up to −30V drain-source voltage before avalanche breakdown, suitable for 3.3V/5V rail switching with margin. |
| RDS(ON) @ VGS = −4.5V | 0.6 Ω (typ) - Enables <100 mW conduction loss at −400 mA, critical for high-efficiency battery load control. |
| ID (continuous, TA = +25°C) | −0.9 A - Supports sustained load currents up to 900 mA with standard FR-4 PCB layout and 2 oz copper. |
| VGS(TH) | −0.5 to −1.1 V - Ensures reliable turn-on with 1.8V GPIO or low-voltage logic drivers without level-shifting. |
| Qg @ VGS = −4.5V | 1.0 nC - Reduces gate drive power and enables >1 MHz switching in compact DC-DC or power-path applications. |
| RθJA (optimized layout) | 103 °C/W - Allows 1.2 W power dissipation at +75°C ambient when using 1-inch² copper pour, supporting higher current bursts. |
| Ciss | 54 pF - Low input capacitance minimizes Miller effect and improves noise immunity in high-speed switching nodes. |
Pinout & Package
Package: X2-DFN1006-3 - 0.4 mm profile, 1.0 × 0.6 mm outline, 3-terminal bottom-side thermal pad, RoHS-compliant "Green" molding compound (UL 94V-0).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Source) | Source terminal (S) | Connected to system ground or higher-potential rail; forms return path for load current and anchors body diode cathode. |
| 2 (Drain) | Drain terminal (D) | Connects to load; carries full switched current and withstands −30V reverse bias during off-state. |
| 3 (Gate) | Gate terminal (G) | Control input with ESD protection; requires ≤±8V drive; −1.1V max threshold enables direct microcontroller interfacing. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-compact footprint | 0.6 mm² area - 13× smaller than SOT-23, enabling dense integration in wearables and hearing aids. |
| Low-profile package | 0.4 mm height - Fits beneath thin display assemblies and stacked PCB interposers in slim mobile devices. |
| ESD-protected gate | ±10 µA IGSS max at ±8V - Prevents latch-up or damage during board handling and automated assembly. |
| Halogen- and antimony-free | <900 ppm Br/Cl, <1000 ppm Sb - Meets automotive and medical environmental compliance without sacrificing thermal or electrical performance. |
| Fast switching speed | tr = 11 ns, tf = 20 ns - Minimizes transition losses in PWM-controlled LED drivers and power-path OR-ing circuits. |
Applications
| Smartphone Power Management | Wireless Earbud Battery Protection |
|---|---|
|
Use Scenario: Controlling power delivery to USB-C port logic and charging circuitry during insertion detection and mode negotiation. IC Role / Device Role / Timing Role: High-side load switch isolating VBUS path with fast turn-on (<10 µs) and minimal voltage drop. Use Value: 0.6Ω RDS(ON) limits voltage drop to <240 mV at 400 mA, preserving USB PD handshake timing margins. |
Use Scenario: Enabling/disabling battery-to-charge-management IC connection during charging state transitions. IC Role / Device Role / Timing Role: Reverse-polarity protected load switch managing bidirectional current flow between Li-ion cell and charger IC. Use Value: Integrated body diode with −0.8V VSD ensures safe reverse-current blocking without external Schottky. |
| Portable Medical Sensor Hub | Compact IoT Node Power Gating |
|
Use Scenario: Sequencing power to BLE radio, sensor array, and MCU subsystems to meet strict standby current targets. IC Role / Device Role / Timing Role: Low-threshold (−0.5V min) P-MOSFET driven directly by 1.8V GPIO for precise sub-µA sleep-state isolation. Use Value: −1.1V max VGS(TH) guarantees full enhancement at 1.8V logic, eliminating need for gate driver ICs. |
Use Scenario: Shutting down peripheral sensors and RF modules during deep-sleep cycles in battery-operated edge nodes. IC Role / Device Role / Timing Role: Ultra-low-leakage (−1 µA IDSS) high-side switch minimizing quiescent current in always-on monitoring systems. Use Value: −1 µA max IDSS at −30V reduces standby power loss to <30 nW, extending 10-year battery life targets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3020LSD-13 | 30V P-ch, RDS(ON) = 0.85Ω @ −4.5V, SOT-23 package (2.9 × 1.3 mm), higher RθJA = 220°C/W | Larger footprint and lower current capability (−0.7A) limit use in ultra-thin designs requiring <0.4 mm height | Select when board space permits larger package and higher thermal mass is acceptable for intermittent loads |
| AO3401 | 30V P-ch, RDS(ON) = 0.085Ω @ −4.5V, SOT-23, but VGS(TH) = −0.7 to −1.3V and no ESD protection | Lower RDS(ON) suits higher-current loads, but gate vulnerability requires external TVS and layout care | Choose only with added gate protection circuitry and where 0.85 mm height is acceptable |
Compared with DMN3020LSD-13 and AO3401, DMP31D1UFB4-7B uniquely combines 0.4 mm profile, 0.6Ω RDS(ON), and integrated ESD protection-enabling single-component, zero-height load switching in next-gen wearables without layout overhead.
Availability
DMP31D1UFB4-7B is available at Aetrix Electronics and suitable for smartphone power sequencing, wireless earbud battery management, portable medical sensor hubs, and compact IoT node power gating requiring stable component supply and long-term lifecycle assurance.
Supply support for DMP31D1UFB4-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, energy-efficient components for consumer, industrial, and automotive markets.
DMP31D1UFB4-7B belongs to Diodes' X2-DFN ultra-miniature MOSFET product line, engineered specifically for space- and height-constrained portable electronics requiring logic-level gate drive and robust ESD tolerance.
FAQ
What is the maximum continuous drain current for DMP31D1UFB4-7B at +75°C ambient?
The maximum continuous drain current is −0.7 A at +75°C ambient temperature when mounted on an FR-4 PCB with 1-inch² copper pour (RθJA = 103°C/W). This value is derived from thermal derating curves in the datasheet and assumes no additional heatsinking beyond the specified layout.
Does DMP31D1UFB4-7B require an external gate resistor for typical 1.8V GPIO switching?
No external gate resistor is required for basic on/off control with 1.8V GPIO, as the device's low gate charge (1.0 nC) and −0.5V minimum VGS(TH) ensure full enhancement. However, a 10–100Ω series resistor is recommended if driving from high-impedance sources or to damp ringing in high-frequency PWM applications.
Can DMP31D1UFB4-7B be used in reverse-battery protection circuits?
Yes-it functions as a high-side reverse-polarity protector when placed between battery positive and load. With its −30V VDSS and integrated body diode, it blocks reverse current flow while allowing normal forward conduction, provided gate is tied to battery positive via a pull-up resistor during normal operation.
Is the X2-DFN1006-3 package compatible with standard reflow profiles for lead-free soldering?
Yes-the package is qualified for IPC/JEDEC J-STD-020 moisture sensitivity Level 1 and supports standard lead-free reflow profiles (peak 260°C, 60 sec max). The NiPdAu over copper leadframe ensures solderability per MIL-STD-202, Method 208, and the UL 94V-0 molding compound withstands thermal cycling without delamination.
DMP31D1UFB4-7B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 3-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 900mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 1Ohm @ 400mA, 4.5V
- Vgs(th) (Max) @ Id:
- 1.1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 1.6 nC @ 8 V
- Vgs (Max):
- ±8V
- Input Capacitance (Ciss) (Max) @ Vds:
- 54 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 500mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN1006-3
DMP31D1UFB4-7B FAQ
1.How can I place an order for DMP31D1UFB4-7B through Aetrix?
Please submit a Request for Quotation (RFQ) for DMP31D1UFB4-7B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMP31D1UFB4-7B reliable?
The price and inventory of DMP31D1UFB4-7B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP31D1UFB4-7B is usually 5 days.
3.What payment methods are accepted for DMP31D1UFB4-7B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP31D1UFB4-7B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMP31D1UFB4-7B?
DMP31D1UFB4-7B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMP31D1UFB4-7B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMP31D1UFB4-7B?
For technical support, including DMP31D1UFB4-7B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP31D1UFB4-7B requirements.
6.How does Aetrix verify that DMP31D1UFB4-7B is sourced from the original manufacturer or authorized distributors?
All DMP31D1UFB4-7B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP31D1UFB4-7B meets industry standards.
7.What is the process for return or replacement of DMP31D1UFB4-7B?
All DMP31D1UFB4-7B units undergo pre-shipment inspection (PSI). If there is an issue with DMP31D1UFB4-7B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMP31D1UFB4-7B part is unused and in its original packaging.
Return procedure for DMP31D1UFB4-7B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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