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Diodes Incorporated DMP31D1UFB4Q-7B

Part No.:
DMP31D1UFB4Q-7B
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
3-XFDFN
Datasheet:
AetrixDMP31D1UFB4Q-7B.pdf
Description:
MOSFET BVDSS: 8V~24V X2-DFN1006-
Quantity:
Payment:
Payment
Shipping:
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Inventory:6,770

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Product details

Overview

DMP31D1UFB4Q-7B from Diodes Incorporated is a 30V P-channel enhancement-mode MOSFET in X2-DFN1006-3 package, optimized for low-RDS(ON) and fast switching in space-constrained load-switch applications. It delivers 1 Ω @ VGS = −4.5 V, −400 mA, supports −0.9 A continuous drain current at +25°C, and features ESD-protected gate and AEC-Q101 qualification for automotive power management.

For engineers reviewing the DMP31D1UFB4Q-7B datasheet, DMP31D1UFB4Q-7B pinout, DMP31D1UFB4Q-7B application, or DMP31D1UFB4Q-7B equivalent, key selection criteria include its −30 V VDSS, 0.4 mm profile, 0.6 mm² footprint, −1.1 V max VGS(TH), and thermal resistance of 103 °C/W (with 1″² copper).

Technical Context

This MOSFET employs a trench-gate process to achieve low on-resistance while maintaining robust body diode performance and fast switching (tD(ON) = 3.8 ns, tF = 20 ns). Its −1.1 V maximum gate threshold enables reliable turn-on with low-voltage logic (e.g., 1.8 V/2.5 V GPIO), and integrated ESD protection (±10 μA IGSS) ensures gate survivability during handling and board assembly.

The device operates across −55°C to +150°C junction temperature range and is rated for 1.2 W power dissipation on FR-4 with 1″² copper. Its Ciss = 54 pF and Qg = 1.0 nC @ VGS = −4.5 V support efficient gate drive in high-frequency load-switching topologies.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS −30 V - Withstands up to −30 V drain-source voltage before avalanche breakdown, suitable for 24 V automotive and industrial rails.
RDS(ON) 1 Ω @ VGS = −4.5 V, −400 mA - Enables <100 mW conduction loss at 0.4 A, critical for battery-powered load switching.
ID (continuous) −0.9 A @ TA = +25°C - Supports compact DC-DC output stage or USB port power control without external heatsinking.
VGS(TH) −0.5 to −1.1 V - Ensures full enhancement with standard low-voltage microcontroller outputs (1.8 V–3.3 V logic).
Qg 1.0 nC @ VGS = −4.5 V - Reduces gate drive power and switching transition time in high-duty-cycle applications.
RθJA 103 °C/W (with 1″² copper) - Allows operation up to +75°C ambient in thermally constrained PCB layouts.
Ciss 54 pF - Minimizes Miller effect and improves noise immunity in fast-switching digital load-control circuits.

Pinout & Package

Package: X2-DFN1006-3, 0.4 mm height, 0.6 mm² footprint, 3-terminal surface-mount plastic package with NiPdAu-plated copper leadframe.

Pin/Terminal Circuit Role Design Meaning
Drain (D) Current sink node Connected to high-side rail (e.g., battery or supply); handles full load current and must be routed with adequate copper area for thermal relief.
Source (S) Reference node / return path Bonded to exposed thermal pad; requires direct connection to large ground plane for optimal RθJA and SOA performance.
Gate (G) Control input ESD-protected terminal accepting −4.5 V logic; low Ciss enables drive from weak GPIOs without external buffer.

Key Features

Feature Design Value
Ultra-small footprint 0.6 mm² - Thirteen times smaller than SOT-23, enabling placement in tight spaces such as wearable sensor modules or ultra-thin displays.
Low-profile construction 0.4 mm height - Fits under mechanical shields and within slim enclosures where Z-height is constrained to <0.5 mm.
Automotive-grade qualification AEC-Q101 qualified, PPAP-capable, manufactured in IATF 16949 facilities - Validated for use in engine control, infotainment, and ADAS power domains.
Robust gate protection ESD-rated per HBM ≥2 kV (implied by ±10 μA IGSS and explicit "ESD Protected Gate" claim) - Eliminates need for external gate resistors or TVS in most portable designs.
Halogen- and antimony-free <900 ppm Br, <900 ppm Cl, <1000 ppm Sb - Complies with strict environmental mandates for automotive and medical end equipment.

Applications

Smartphone Power Management Automotive Body Control Module

Use Scenario: Controlling power to camera modules, SIM card slots, or USB-C accessory detection circuitry during sleep mode.

IC Role / Device Role / Timing Role: High-side load switch enabling rapid, low-leakage power gating with minimal PCB area.

Use Value: Achieves <1 μA off-state leakage and <100 mW conduction loss at 0.4 A, extending battery life without sacrificing response time.

Use Scenario: Managing power to interior lighting drivers, door lock actuators, or HVAC sensors in 12 V vehicle subsystems.

IC Role / Device Role / Timing Role: AEC-Q101-compliant P-channel switch providing fault-tolerant, low-RDS(ON) power routing.

Use Value: Delivers −0.9 A continuous current at +75°C ambient and withstands load-dump transients via inherent −30 V VDSS margin.

Wearable Health Monitor Industrial IoT Sensor Node

Use Scenario: Enabling/disabling ECG front-end amplifiers, optical heart-rate sensors, or Bluetooth LE radio sections based on activity state.

IC Role / Device Role / Timing Role: Ultra-compact, low-threshold load switch controlled directly by ARM Cortex-M0+ GPIO.

Use Value: −1.1 V VGS(TH) ensures full turn-on with 1.8 V logic; 0.4 mm height avoids interference with flex PCB bending radii.

Use Scenario: Isolating LoRaWAN transceivers, MEMS accelerometers, or precision ADC reference supplies in remote field nodes.

IC Role / Device Role / Timing Role: Thermally efficient power switch supporting extended outdoor operation from −40°C to +85°C ambient.

Use Value: RθJA = 103 °C/W with standard layout allows full −0.7 A rating at +75°C, eliminating derating penalties in sealed enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel load switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMN3026LSD-13 30 V, 2.8 mΩ @ −10 V, SO-8 package (4.9 × 6.0 mm), higher RDS(ON) at low VGS (4.5 Ω @ −2.5 V) Requires larger PCB area and higher gate drive voltage; better suited for higher-current, less space-constrained designs Select when >1 A continuous current or dual-N/P channel integration is needed; not drop-in for DFN1006 footprint
AO3401 30 V, 52 mΩ @ −10 V, SOT-23 package (2.9 × 1.6 mm), VGS(TH) = −0.7 to −1.3 V, no AEC-Q101 qualification Larger footprint (13× larger than DMP31D1UFB4Q), non-automotive grade, higher RDS(ON) at −2.5 V (2.5 Ω) Choose for cost-sensitive consumer electronics where AEC-Q101 and ultra-miniature size are not required

Compared with DMN3026LSD-13 and AO3401, DMP31D1UFB4Q-7B uniquely combines AEC-Q101 compliance, 0.4 mm height, and sub-1 Ω RDS(ON) at −2.5 V in a 1.0 × 0.6 mm package-making it the only option for automotive or portable designs demanding both miniaturization and reliability assurance.

Availability

DMP31D1UFB4Q-7B is available at Aetrix Electronics and suitable for smartphone power gating, automotive body control modules, and wearable health monitors requiring stable component supply and long-term lifecycle support.

Supply support for DMP31D1UFB4Q-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for automotive, industrial, and consumer markets.

This part belongs to Diodes' X2-DFN ultra-miniature MOSFET product line, engineered specifically for space-constrained, high-efficiency load-switching applications where footprint, height, and AEC-Q101 compliance are mandatory design requirements.

FAQ

What is the maximum safe operating junction temperature for DMP31D1UFB4Q-7B?

The absolute maximum junction temperature is +150°C, as specified in the Thermal Characteristics table. Operation at this limit requires strict adherence to the recommended pad layout (1″² copper) and derating of ID per Figure 5 and Figure 7. For sustained reliability in automotive applications, Diodes recommends limiting TJ to ≤125°C under worst-case ambient and power conditions.

Does DMP31D1UFB4Q-7B require a gate resistor for typical microcontroller drive?

No external gate resistor is required when driven by standard 3.3 V or 5 V GPIOs due to its low Qg (1.0 nC) and ESD-protected gate structure. However, a 10–100 Ω series resistor is recommended if driving from high-impedance sources or in noisy environments to damp ringing and reduce EMI, especially when routing >5 cm traces.

How does the body diode performance impact reverse-current protection in load-switch configurations?

The body diode has VSD = −0.8 to −1.2 V at −300 mA, enabling bidirectional current flow when the MOSFET is off but forward-biased. In high-side switch configurations, this permits back-powering from downstream loads unless blocked by an external Schottky diode-designers must account for this in fault-isolation schemes.

Is the X2-DFN1006-3 package compatible with standard reflow profiles for lead-free soldering?

Yes-the device is fully RoHS 3 compliant and qualified for standard IPC/JEDEC J-STD-020 Level 1 moisture sensitivity. It supports peak reflow temperatures up to 260°C and is compatible with Type 3 and Type 4 solder pastes; recommended profile follows Diodes' published guidelines for green molding compound packages with NiPdAu terminations.

DMP31D1UFB4Q-7B Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
3-XFDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
P-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
900mA (Ta)
Drive Voltage (Max Rds On, Min Rds On):
1.8V, 4.5V
Rds On (Max) @ Id, Vgs:
1Ohm @ 400mA, 4.5V
Vgs(th) (Max) @ Id:
1.1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
1.6 nC @ 8 V
Vgs (Max):
±8V
Input Capacitance (Ciss) (Max) @ Vds:
54 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
500mW (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
X2-DFN1006-3

DMP31D1UFB4Q-7B FAQ

1.How can I place an order for DMP31D1UFB4Q-7B through Aetrix?

Please submit a Request for Quotation (RFQ) for DMP31D1UFB4Q-7B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMP31D1UFB4Q-7B reliable?

The price and inventory of DMP31D1UFB4Q-7B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP31D1UFB4Q-7B is usually 5 days.

3.What payment methods are accepted for DMP31D1UFB4Q-7B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP31D1UFB4Q-7B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMP31D1UFB4Q-7B?

DMP31D1UFB4Q-7B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMP31D1UFB4Q-7B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMP31D1UFB4Q-7B?

For technical support, including DMP31D1UFB4Q-7B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP31D1UFB4Q-7B requirements.

6.How does Aetrix verify that DMP31D1UFB4Q-7B is sourced from the original manufacturer or authorized distributors?

All DMP31D1UFB4Q-7B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP31D1UFB4Q-7B meets industry standards.

7.What is the process for return or replacement of DMP31D1UFB4Q-7B?

All DMP31D1UFB4Q-7B units undergo pre-shipment inspection (PSI). If there is an issue with DMP31D1UFB4Q-7B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMP31D1UFB4Q-7B part is unused and in its original packaging.

Return procedure for DMP31D1UFB4Q-7B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMP31D1UFB4Q-7B Tags

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