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Diodes Incorporated DMP6250SFDF-13
- Part No.:
- DMP6250SFDF-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 6-UDFN Exposed Pad
- Datasheet:
-
DMP6250SFDF-13.pdf
- Description:
- MOSFET BVDSS: 41V-60V U-DFN2020-
- Quantity:
- Payment:
- Shipping:
Inventory:6,248
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Product details
Overview
DMP6250SFDF-13 from Diodes Incorporated is a P-channel enhancement-mode MOSFET in U-DFN2020-6 (Type F) package, rated for -60V VDSS, 155 mΩ RDS(ON) @ VGS = -10V, and -3.2A continuous drain current at +25°C. It serves as a high-efficiency power switch in compact DC-DC converters and battery management systems where low gate threshold (-1 to -3V) and fast switching (tF = 37.8 ns) are critical.
For engineers reviewing the DMP6250SFDF-13 datasheet, DMP6250SFDF-13 pinout, DMP6250SFDF-13 application, or DMP6250SFDF-13 equivalent, key selection criteria include verified RDS(ON) at -4.5V (240 mΩ), thermal resistance (RθJA = 63 °C/W with 1-inch2 copper), and JEDEC-qualified reliability for industrial power management designs.
Technical Context
This MOSFET employs a trench-gate silicon process optimized for low on-resistance while maintaining controlled gate charge (QG = 4.3 nC @ VGS = -4.5V) and low input capacitance (Ciss = 612 pF). Its -60V breakdown voltage and -3.2A rating support mid-voltage buck converter high-side switching and load-switching topologies.
The device features a body diode with VSD = -0.7 to -1.2V at -2A and reverse recovery charge QRR = 3.8 nC, enabling synchronous rectification in flyback and buck-boost configurations without external Schottky supplementation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | -60 V - Withstands up to -60V drain-source voltage before avalanche conduction, suitable for 48V system rail protection. |
| RDS(ON) | 155 mΩ @ VGS = -10V - Enables <150 mW conduction loss at 2A, critical for thermally constrained PCB layouts. |
| ID (cont.) | -3.2 A @ TA = +25°C - Supports sustained 3.2A load switching in ambient-cooled applications with minimal heatsinking. |
| QG | 4.3 nC @ VGS = -4.5V - Low gate drive energy reduces driver IC loading and enables >1 MHz PWM operation. |
| RθJA | 63 °C/W (with 1-inch² copper) - Allows 2.0 W power dissipation at +70°C ambient, supporting high-density power stage integration. |
| VGS(TH) | -1 to -3 V - Ensures reliable turn-on with standard 3.3V/5V logic-level gate drivers without level-shifting circuitry. |
| Ciss | 612 pF - Limits high-frequency gate oscillation risk and simplifies gate resistor selection for EMI control. |
Pinout & Package
U-DFN2020-6 (Type F) surface-mount package: 2.0 mm × 2.0 mm footprint, 0.6 mm nominal height, NiPdAu-plated terminals, moisture sensitivity level 1, UL 94V-0 mold compound.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (G) | Gate | Control terminal accepting -10V/-4.5V logic-level signals; low Ciss enables fast edge rates with minimal drive power. |
| Pin 2 (S) | Source | Reference node for gate drive; tied to system ground or floating rail; hosts body diode cathode for reverse current path. |
| Pin 3 (D) | Drain | High-side switching node; connects to input rail; handles full load current and avalanche energy (EAS = 8 mJ). |
| Pin 4 (S) | Source (redundant) | Second source connection for lower parasitic inductance and improved thermal spreading across the die attach area. |
| Pin 5 (D) | Drain (redundant) | Second drain connection enhancing current sharing and reducing package-level RDS(ON) contribution. |
| Pin 6 (D) | Drain (thermal pad) | Exposed drain pad on bottom surface; primary thermal path to PCB copper; must be soldered to solid ground/power plane. |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(ON) at -4.5V | 240 mΩ - Enables efficient operation directly from 5V microcontroller GPIOs without gate boosters. |
| Fast switching speed | tF = 37.8 ns - Reduces transition losses in high-frequency DC-DC converters (>500 kHz). |
| Low gate threshold spread | VGS(TH) = -1 to -3 V - Ensures consistent turn-on across temperature (-55°C to +150°C) and unit-to-unit variation. |
| JEDEC-qualified reliability | Qualified per AEC-Q standards for high-reliability industrial use - supports long-term deployment in unattended equipment. |
| Green packaging | Halogen- and antimony-free, RoHS 3 compliant - meets environmental compliance requirements for global OEM shipments. |
Applications
| Battery Protection Circuit | USB-C Power Delivery Load Switch |
|---|---|
|
Use Scenario: Reverse-current blocking and overcurrent shutdown in single-cell Li-ion battery packs. IC Role / Device Role / Timing Role: High-side P-channel switch controlling battery discharge path; activated by protection IC's enable signal. Use Value: 240 mΩ RDS(ON) at -4.5V ensures <120 mW loss at 2A, minimizing self-heating during sustained load conditions. |
Use Scenario: Hot-swap control of 5–20V USB-C PD power rails to downstream peripherals. IC Role / Device Role / Timing Role: Load switch isolating VBUS during plug insertion/removal; driven by PD controller GPIO. Use Value: Fast tF = 37.8 ns and low QG = 4.3 nC prevent voltage droop during dynamic load transients. |
| Industrial DC-DC Buck Converter | Smart Home Sensor Node Power Management |
|
Use Scenario: High-side synchronous rectifier in 12V-to-3.3V buck regulator for PLC I/O modules. IC Role / Device Role / Timing Role: Upper switch in N+P complementary topology; commutated at 1 MHz with gate driver IC. Use Value: 155 mΩ RDS(ON) @ -10V and 63 °C/W RθJA sustain 92% efficiency at 2A output with no forced air cooling. |
Use Scenario: Controlled power gating of BLE SoC and environmental sensors in battery-powered smart thermostats. IC Role / Device Role / Timing Role: Low-quiescent-load power switch enabling <1 μA off-state leakage (IDSS ≤ -1 μA). Use Value: -60V VDSS headroom accommodates transient spikes on 24V HVAC supply rails without clamping components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMG1012T-7 | RDS(ON) = 220 mΩ @ -4.5V; smaller U-DFN1616-6 package; lower ID = -2.0A | Suitable only for sub-2A loads; limited thermal margin in enclosed enclosures | Select when board space is constrained and peak current remains below 1.8A. |
| SI2301DS-T1-BE3 | RDS(ON) = 200 mΩ @ -4.5V; SO-23 package; higher RθJA = 220 °C/W (no thermal pad) | Requires larger PCB copper area for same power dissipation; incompatible with ultra-thin profiles | Prefer for legacy SO-23 footprints or when thermal pad rework is not feasible. |
Compared with DMG1012T-7 and SI2301DS-T1-BE3, DMP6250SFDF-13 delivers superior thermal performance (63 vs. ≥220 °C/W), higher current capability (-3.2A vs. ≤-2.0A), and tighter VGS(TH) control-making it optimal for high-density, high-reliability industrial power switches.
Availability
DMP6250SFDF-13 is available at Aetrix Electronics and suitable for battery protection circuits, USB-C power delivery load switching, and industrial DC-DC buck converters requiring stable component supply, JEDEC-qualified reliability, and lead-free green compliance.
Supply support for DMP6250SFDF-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and distribution operations across Asia, Europe, and the Americas.
The DMP6250SFDF belongs to Diodes' high-efficiency power MOSFET product line, engineered specifically for compact, high-reliability power management in industrial, computing, and consumer applications where thermal density and logic-level drive compatibility are essential.
FAQ
What is the maximum safe operating junction temperature for DMP6250SFDF-13?
The absolute maximum junction temperature is +150°C, and the device is characterized across -55°C to +150°C. Derating begins at +70°C ambient for continuous operation; at +100°C ambient, the maximum allowable power dissipation drops to 0.8 W with the recommended 1-inch² copper pad layout.
Can DMP6250SFDF-13 be used in automotive applications?
DMP6250SFDF-13 is not AEC-Q200 qualified; Diodes offers automotive-grade equivalents (e.g., DMP6250SFDFQ-13) with PPAP documentation, IATF 16949 manufacturing, and extended temperature screening. This part is intended for industrial and commercial use only.
How does the U-DFN2020-6 (Type F) package affect PCB layout requirements?
The exposed drain pad (Pin 6) must be soldered to a minimum 10 mm² copper pour connected to internal ground/power planes via ≥4 thermal vias (0.3 mm diameter, spaced ≤1 mm apart); insufficient thermal relief causes RθJA to degrade from 63 to >120 °C/W, risking thermal runaway at >1.5A.
Is the body diode suitable for reverse recovery in synchronous rectification?
Yes-the body diode has tRR = 10.8 ns and QRR = 3.8 nC at di/dt = 100 A/μs, enabling clean commutation in synchronous buck topologies up to 1 MHz; however, external Schottky clamping is still recommended for >5A peak currents to minimize voltage overshoot.
DMP6250SFDF-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 6-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 3.2A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 155mOhm @ 2A, 10V
- Vgs(th) (Max) @ Id:
- 3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 8.9 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 612 pF @ 20 V
- FET Feature:
- -
- Power Dissipation (Max):
- 800mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-DFN2020-6 (Type F)
DMP6250SFDF-13 FAQ
1.How can I place an order for DMP6250SFDF-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMP6250SFDF-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMP6250SFDF-13 reliable?
The price and inventory of DMP6250SFDF-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMP6250SFDF-13 is usually 5 days.
3.What payment methods are accepted for DMP6250SFDF-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMP6250SFDF-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMP6250SFDF-13?
DMP6250SFDF-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMP6250SFDF-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMP6250SFDF-13?
For technical support, including DMP6250SFDF-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMP6250SFDF-13 requirements.
6.How does Aetrix verify that DMP6250SFDF-13 is sourced from the original manufacturer or authorized distributors?
All DMP6250SFDF-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMP6250SFDF-13 meets industry standards.
7.What is the process for return or replacement of DMP6250SFDF-13?
All DMP6250SFDF-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMP6250SFDF-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMP6250SFDF-13 part is unused and in its original packaging.
Return procedure for DMP6250SFDF-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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