Diodes Incorporated DMT10H015LSS-13
- Part No.:
- DMT10H015LSS-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
DMT10H015LSS-13.pdf
- Description:
- MOSFET N-CH 100V 8.3A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:3,900
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Product details
Overview
DMT10H015LSS from Diodes Incorporated is a 100V N-channel enhancement-mode MOSFET in SO-8 package, rated for 8.3A continuous drain current at VGS = 10V, with RDS(ON) = 16mΩ (max), and qualified to AEC-Q101. It serves as a high-efficiency load switch in notebook battery power management systems.
For engineers reviewing the DMT10H015LSS datasheet, DMT10H015LSS pinout, DMT10H015LSS application, or DMT10H015LSS equivalent, key selection criteria include RDS(ON) at 4.5V/6V/10V gate drive, UIS ruggedness, SO-8 thermal performance (RθJA = 75°C/W with 1-in² copper), and AEC-Q101 qualification for automotive-adjacent portable power designs.
Technical Context
This MOSFET employs planar trench-gate technology optimized for low conduction loss while maintaining fast switching (tD(ON) = 6.5ns, tD(OFF) = 19.7ns) and low gate charge (QG = 33.3nC). Its body diode exhibits VSD = 0.9–1.3V at 20A, supporting synchronous rectification in DC-DC converters.
The device features 100% production-tested unclamped inductive switching (UIS) capability (IAS = 7.5A, EAS = 85mJ), enabling robust operation in load-switch and power-path fault conditions without external snubbers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 100V - supports input rails up to 80V DC with margin for transients in battery-powered systems |
| RDS(ON) @ VGS = 10V | 16mΩ max - enables ≤1.3W conduction loss at 8.3A, critical for thermally constrained notebook PCBs |
| ID (continuous) | 8.3A @ TA = 25°C - sufficient for single-cell Li-ion battery load switching with derating |
| QG | 33.3nC - determines gate drive strength requirement; compatible with standard 5V logic-level drivers |
| RθJA (with 1-in² copper) | 75°C/W - allows ~1.67W dissipation before junction exceeds 150°C ambient, defining practical power handling |
| EAS | 85mJ - quantifies energy-handling capability during inductive turn-off, essential for reliable load-break operation |
Pinout & Package
SO-8 surface-mount package with exposed drain pad for enhanced thermal performance; molded green compound (UL 94V-0), matte tin-plated leads, moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Control terminal; requires ≥4.5V drive for full enhancement; low Ciss (1871pF) reduces driver loading |
| 2 (S) | Source | Reference node for gate drive; tied to system ground in high-side switch configurations |
| 3 (D) | Drain | Main current path output; internally connected to exposed pad for thermal conduction to PCB |
| 4 (D) | Drain | Parallel drain connection; shares current path and thermal path with Pin 3 |
| 5 (D) | Drain | Parallel drain connection; improves current sharing and thermal spreading across SO-8 footprint |
| 6 (D) | Drain | Parallel drain connection; reduces effective RDS(ON) and thermal resistance via multiple internal bonds |
| 7 (S) | Source | Secondary source connection; lowers source inductance in high-frequency switching applications |
| 8 (S) | Source | Secondary source connection; minimizes voltage overshoot during fast turn-off by reducing loop inductance |
Key Features
| Feature | Design Value |
|---|---|
| 100% UIS tested | Guarantees survival under worst-case inductive turn-off stress (7.5A/85mJ), eliminating need for design margin assumptions |
| Low RDS(ON) @ 4.5V | 25mΩ max enables direct interfacing with 5V microcontrollers or PMICs without level-shifting circuitry |
| AEC-Q101 qualified | Validated for automotive-adjacent reliability (−55°C to +150°C TJ), supporting industrial and medical portable equipment |
| Green, halogen-free construction | Meets RoHS 2 and JEDEC J-STD-020 MSL-1 requirements, ensuring compatibility with lead-free reflow profiles |
Applications
| Notebook Battery Load Switch | DC-DC Converter High-Side Switch |
|---|---|
Use Scenario: Isolating main battery from system rail during sleep or fault conditions in ultrabook platforms. IC Role / Device Role / Timing Role: Power-path MOSFET controlling bidirectional current flow between battery and system bus. Use Value: Low RDS(ON) minimizes standby voltage drop and self-heating; SO-8 thermal design sustains 8.3A without heatsink. | Use Scenario: High-side synchronous rectifier in buck converter supplying CPU core voltage. IC Role / Device Role / Timing Role: Main switching element operating at 300–1000kHz with fast tR/tF (7ns/8.1ns). Use Value: Low QG and Ciss reduce gate drive losses; body diode VSD < 1.3V ensures low reverse conduction loss. |
| Backlight LED Power Switch | USB-C Power Delivery Load Switch |
Use Scenario: Enabling/disabling high-current LED strings in laptop displays using PWM dimming control. IC Role / Device Role / Timing Role: Constant-current switch modulated at >1kHz to avoid visible flicker. Use Value: Fast switching (tD(ON) = 6.5ns) supports precise PWM edge timing; low RDS(ON) prevents brightness drift over temperature. | Use Scenario: Controlling 20V/3A USB-C PD power path between port controller and system rail. IC Role / Device Role / Timing Role: Overcurrent-protected load switch responding to fault signals within microseconds. Use Value: UIS rating handles inrush and cable-disconnect transients; AEC-Q101 qualification ensures long-term field reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMT10H015LPS-13 | Same die, but in PSOP-8 package with larger exposed drain pad and lower RθJA (50°C/W) | Better thermal performance for >10A continuous loads; requires different PCB layout | Select when board space permits larger footprint and higher sustained current is required |
| SI7157DP-T1-GE3 | 100V, 12mΩ @ 10V, 12A, SO-8, but not AEC-Q101 qualified; higher QG (42nC) | Higher current rating but less rugged UIS (EAS = 55mJ); no automotive qualification | Select for cost-sensitive consumer applications where AEC-Q101 is not mandated |
Compared with DMT10H015LSS, DMT10H015LPS-13 offers superior thermal management for high-power density designs, while SI7157DP-T1-GE3 trades ruggedness and qualification for higher current and lower RDS(ON), requiring careful evaluation of fault-energy margins.
Availability
DMT10H015LSS is available at Aetrix Electronics and suitable for notebook battery management, DC-DC converter high-side switching, and USB-C power delivery load switching requiring stable component supply and AEC-Q101 reliability assurance.
Supply support for DMT10H015LSS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.
This MOSFET belongs to Diodes' "PowerMOS" product line, engineered specifically for high-efficiency, high-reliability power switching in portable computing and industrial power systems where low RDS(ON), fast switching, and rugged transient handling are critical.
FAQ
What is the maximum safe operating junction temperature for DMT10H015LSS?
The absolute maximum junction temperature is +150°C, and the device is characterized across −55°C to +150°C. Thermal design must ensure TJ remains below this limit under worst-case ambient and power dissipation conditions, using the specified RθJA = 75°C/W (with 1-in² copper) or RθJC = 12°C/W for heatsink-coupled layouts.
Does DMT10H015LSS support 5V gate drive in practical applications?
Yes - RDS(ON) is specified at 18mΩ max (VGS = 6V) and 25mΩ max (VGS = 4.5V), confirming full enhancement with standard 5V logic or PMIC outputs. Gate threshold voltage (VGS(TH)) ranges from 1.4V to 3.0V, ensuring reliable turn-on with 5V drive even considering process variation and temperature drift.
How is the SO-8 package's exposed drain pad connected internally?
All four drain pins (Pins 3, 4, 5, 6) and the exposed bottom thermal pad are electrically and thermally connected to the MOSFET's drain terminal. This multi-pin drain configuration reduces package inductance and spreads heat across the PCB copper area, directly supporting the stated RθJA = 75°C/W rating with proper board layout.
Is DMT10H015LSS suitable for reverse polarity protection circuits?
No - as an N-channel MOSFET in SO-8, it lacks integrated body diode orientation for reverse-voltage blocking in series-with-load configurations. For reverse polarity protection, a P-channel device or back-to-back N-channel arrangement is required; this part is optimized for forward-load switching where its low RDS(ON) and UIS rating provide primary value.
DMT10H015LSS-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 8.3A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 16mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 3.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 33.3 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1871 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.2W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
DMT10H015LSS-13 FAQ
1.How can I place an order for DMT10H015LSS-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMT10H015LSS-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMT10H015LSS-13 reliable?
The price and inventory of DMT10H015LSS-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMT10H015LSS-13 is usually 5 days.
3.What payment methods are accepted for DMT10H015LSS-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMT10H015LSS-13 transactions.
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4.How is shipping managed for DMT10H015LSS-13?
DMT10H015LSS-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMT10H015LSS-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMT10H015LSS-13?
For technical support, including DMT10H015LSS-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMT10H015LSS-13 requirements.
6.How does Aetrix verify that DMT10H015LSS-13 is sourced from the original manufacturer or authorized distributors?
All DMT10H015LSS-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMT10H015LSS-13 meets industry standards.
7.What is the process for return or replacement of DMT10H015LSS-13?
All DMT10H015LSS-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMT10H015LSS-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMT10H015LSS-13 part is unused and in its original packaging.
Return procedure for DMT10H015LSS-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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