Diodes Incorporated DMT12H007SPS-13
- Part No.:
- DMT12H007SPS-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerTDFN
- Datasheet:
-
DMT12H007SPS-13.pdf
- Description:
- MOSFET BVDSS: 101V~250V POWERDI5
- Quantity:
- Payment:

- Shipping:

Inventory:7,958
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DMT12H007SPS from Diodes Incorporated is a 120V N-channel enhancement-mode MOSFET in PowerDI5060-8 package, rated for 80A continuous drain current at TC = +25°C, with RDS(ON) of 7.5 mΩ (typ) at VGS = 10V and 12 mΩ (typ) at VGS = 6V. It delivers high-efficiency power switching in DC-DC converters and synchronous rectification stages.
For engineers reviewing the DMT12H007SPS datasheet, DMT12H007SPS pinout, DMT12H007SPS application, or DMT12H007SPS equivalent, key selection criteria include its 1.2°C/W junction-to-case thermal resistance, 100% production-tested UIS robustness, low-profile 1.1mm height, and AEC-Q101 readiness for automotive-grade power stages.
Technical Context
This MOSFET employs a trench-gate silicon process optimized for low RDS(ON) while preserving fast switching performance-evidenced by 44 nC total gate charge at VGS = 10V and 10.9 ns turn-off fall time. Its internal body diode supports synchronous rectification with 0.8 V forward voltage (typ) at IS = 30A and 55 ns reverse recovery time.
The device operates across –55°C to +150°C junction temperature range and features a thermally enhanced exposed-drain PowerDI5060-8 package with 1.2°C/W RθJC, enabling high-current operation without external heatsinking in compact board layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 120 V - Withstands up to 120V drain-source blocking voltage in off-state, suitable for 48V and 60V bus systems. |
| RDS(ON) | 7.5 mΩ (typ) @ VGS = 10V - Minimizes conduction loss in high-current paths; enables <1.5W dissipation at 60A. |
| ID (cont) | 80 A @ TC = +25°C - Supports high-power output stages when mounted on adequate copper area. |
| Qg | 44 nC @ VGS = 10V - Determines gate drive energy requirement; compatible with standard PWM controllers. |
| RθJC | 1.2°C/W - Enables direct thermal coupling to PCB copper or heatsink; critical for thermal management in sealed enclosures. |
| EAS | 360.4 mJ - Confirmed avalanche energy rating ensures reliability under inductive load switching stress. |
| tRR | 55 ns - Fast body diode recovery reduces cross-conduction loss in synchronous buck topologies. |
Pinout & Package
Package: PowerDI5060-8 - Thermally enhanced surface-mount package with exposed drain pad, 1.1 mm profile, and UL 94V-0 molded compound. Dimensions: 5.15 × 6.15 mm footprint, 1.0 mm nominal height.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Drain) | Main current path (high-side or low-side switch) | Connected to exposed copper pad; primary thermal and electrical path for drain current. |
| Pin 2 (Source) | Reference node for gate control and current return | Provides low-inductance source connection; ties to ground plane or power rail return. |
| Pin 3 (Gate) | Control input for channel modulation | High-impedance terminal requiring <2.7Ω series resistance to damp ringing per layout guidelines. |
| Exposed Pad (Drain) | Primary drain terminal and thermal interface | Mandatory solder connection to large PCB copper pour for thermal and current handling. |
Key Features
| Feature | Design Value |
|---|---|
| 100% UIS tested in production | Guarantees avalanche ruggedness without derating; eliminates need for external snubbers in flyback or boost converters. |
| Thermally efficient PowerDI5060-8 | 1.2°C/W RθJC enables >80A operation with minimal board-level thermal design overhead. |
| Low-profile 1.1 mm height | Enables use in ultra-thin power modules and space-constrained consumer/industrial enclosures. |
| Halogen- and antimony-free "Green" construction | Meets IEC 61249-2-21 and JEDEC J-STD-020 Level 1 standards for eco-compliant manufacturing. |
Applications
| Server VRM Power Stage | Automotive DC-DC Converter |
|---|---|
Use Scenario: High-current, high-frequency buck converter supplying core voltage to CPU/GPU in datacenter servers. IC Role / Device Role / Timing Role: Low-side synchronous rectifier MOSFET operating at 500 kHz–1 MHz with tight duty-cycle control. Use Value: 7.5 mΩ RDS(ON) reduces conduction loss by >30% vs. legacy 12V MOSFETs, improving VRM efficiency above 94% at full load. | Use Scenario: 12V-to-48V bidirectional DC-DC stage in 48V mild-hybrid vehicle architectures. IC Role / Device Role / Timing Role: Primary switching element in interleaved phase-leg topology, handling 60A+ continuous current. Use Value: 100% UIS qualification and –55°C to +150°C operation ensure reliability across engine bay thermal cycling and load dump transients. |
| Industrial Motor Drive Inverter | Telecom PSU Half-Bridge |
Use Scenario: Three-phase inverter stage driving BLDC motors in HVAC compressors and factory automation drives. IC Role / Device Role / Timing Role: High-side and low-side switch in 600V-class half-bridge modules, operating at 20–40 kHz PWM frequency. Use Value: 360.4 mJ EAS withstands motor winding inductance energy during fault conditions without failure. | Use Scenario: Primary-side switch in 3 kW telecom rectifier with LLC resonant topology. IC Role / Device Role / Timing Role: Fast-switching MOSFET in high-frequency half-bridge configuration with zero-voltage switching (ZVS). Use Value: 55 ns tRR and low Crss (29 pF) minimize dead-time losses and improve ZVS margin at light loads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current, low-RDS(ON) N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPB180N15N3 G | RDS(ON) = 1.8 mΩ @ 10V but rated only for 150V; larger TO-263-7 package (4.7 mm height); higher Qg (120 nC). | Better for ultra-low-loss 12V/24V systems; unsuitable where board height <1.2 mm is mandatory. | Select when lowest possible conduction loss dominates over profile and gate drive strength. |
| DMTH10H015LPS-13 | Same PowerDI5060-8 package; 100V rating; RDS(ON) = 1.5 mΩ @ 10V; lower VDSS limits bus voltage headroom. | Preferred for cost-sensitive 48V systems where 120V rating is unnecessary; reduced avalanche margin. | Choose when system max VDS stays below 80V and thermal budget allows tighter RDS(ON) trade-off. |
Compared with IPB180N15N3G and DMTH10H015LPS-13, DMT12H007SPS uniquely balances 120V rating, sub-8mΩ RDS(ON), 1.1mm profile, and production UIS validation-making it optimal for space-constrained, high-reliability 48–60V industrial and automotive power stages.
Availability
DMT12H007SPS is available at Aetrix Electronics and suitable for server VRMs, automotive DC-DC converters, and industrial motor drives requiring stable component supply, long-term lifecycle support, and AEC-Q101-aligned quality assurance.
Supply support for DMT12H007SPS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.
This MOSFET belongs to Diodes' PowerMOS™ portfolio, engineered specifically for high-efficiency, high-reliability power conversion in automotive, industrial, and computing applications where thermal performance and ruggedness are critical.
FAQ
What is the maximum continuous drain current for DMT12H007SPS at 70°C case temperature?
The datasheet specifies 64 A continuous drain current at TC = +70°C with VGS = 10V. This derating reflects thermal limits of the PowerDI5060-8 package and must be validated against actual PCB copper area and ambient airflow in the target application.
Does DMT12H007SPS meet AEC-Q101 requirements for automotive use?
Yes-Diodes states this part is manufactured in IATF 16949-certified facilities and supports PPAP documentation; it is qualified per AEC-Q101 for stress testing including HTGB, HTRB, and UIS. Full qualification reports are available upon request through Diodes' automotive team.
How should the exposed drain pad be connected on the PCB?
The exposed pad must be soldered to a minimum 100 mm² copper area with ≥4 thermal vias (0.3 mm diameter) connecting to inner or back-side ground/power planes. Solder mask opening should match pad dimensions exactly to ensure full wetting and thermal transfer per Diodes' recommended land pattern.
What is the gate threshold voltage range, and how does it vary with temperature?
VGS(TH) is specified from 2.0 V to 4.0 V at TA = +25°C, with typical variation of ±0.2 V across –55°C to +150°C. Figure 8 shows VGS(TH) decreases slightly with rising temperature, supporting stable turn-on behavior in high-temperature environments.
DMT12H007SPS-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerTDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 120 V
- Current - Continuous Drain (Id) @ 25°C:
- 80A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 6V, 10V
- Rds On (Max) @ Id, Vgs:
- 8.9mOhm @ 30A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 44 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3142 pF @ 60 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.9W
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerDI5060-8
DMT12H007SPS-13 FAQ
1.How can I place an order for DMT12H007SPS-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMT12H007SPS-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMT12H007SPS-13 reliable?
The price and inventory of DMT12H007SPS-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMT12H007SPS-13 is usually 5 days.
3.What payment methods are accepted for DMT12H007SPS-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMT12H007SPS-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMT12H007SPS-13?
DMT12H007SPS-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMT12H007SPS-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMT12H007SPS-13?
For technical support, including DMT12H007SPS-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMT12H007SPS-13 requirements.
6.How does Aetrix verify that DMT12H007SPS-13 is sourced from the original manufacturer or authorized distributors?
All DMT12H007SPS-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMT12H007SPS-13 meets industry standards.
7.What is the process for return or replacement of DMT12H007SPS-13?
All DMT12H007SPS-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMT12H007SPS-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMT12H007SPS-13 part is unused and in its original packaging.
Return procedure for DMT12H007SPS-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DMT12H007SPS-13 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

