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Diodes Incorporated DMT12H065LFDF-13

Part No.:
DMT12H065LFDF-13
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
6-UDFN Exposed Pad
Datasheet:
AetrixDMT12H065LFDF-13.pdf
Description:
MOSFET N-CH 115V 4.3A 6UDFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,408

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Product details

Overview

DMT12H065LFDF-13 from Diodes Incorporated is a 115V N-channel enhancement-mode MOSFET in U-DFN2020-6 (Type F) package, with RDS(ON) = 65 mΩ @ VGS = 10 V, ID = 4.3 A at TA = +25°C, and 100% production-tested UIS robustness-designed for DC-DC primary switching and low-profile load switching in space-constrained power converters.

For engineers reviewing the DMT12H065LFDF-13 datasheet, DMT12H065LFDF-13 pinout, DMT12H065LFDF-13 application, or DMT12H065LFDF-13 equivalent, key selection criteria include its 65 mΩ on-resistance at 10 V gate drive, 124 °C/W RθJA on standard FR-4, 0.6 mm profile, and verified unclamped inductive switching performance under 0.3 mH conditions.

Technical Context

This MOSFET employs a trench-gate silicon process optimized for low RDS(ON) while preserving fast switching characteristics: tD(ON) = 2.1 ns, tF = 3.6 ns, and Qg = 5.5 nC at VDS = 50 V. Its gate threshold voltage (VGS(TH) = 0.6–2.2 V) enables compatibility with 3.3 V and 4.5 V logic-level drivers.

The device integrates a body diode with VSD = 0.8–1.3 V at IS = 2.4 A and tRR = 101 ns, supporting synchronous rectification and flyback recovery. Thermal design is enabled by RθJC = 13 °C/W and validated junction temperature range of –55°C to +150°C.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS115 V - supports input rails up to 92 V DC with 20% margin for transients
RDS(ON)65 mΩ @ VGS = 10 V - delivers ≤270 mW conduction loss at 4.3 A continuous drain current
ID (TA = 25°C)4.3 A - maximum continuous current with 1.0 W power dissipation on minimal pad layout
Qg5.5 nC - enables efficient gate driving with <10 Ω source impedance at 1 MHz switching
tF3.6 ns - limits turn-off energy loss in high-frequency DC-DC converters (>1 MHz)
EAS2.4 mJ - withstands 4 A avalanche current with 0.3 mH inductance without failure
RθJA124 °C/W - requires thermal pad or copper pour to maintain TJ < 125°C at full load

Pinout & Package

U-DFN2020-6 (Type F) is a 2.0 × 2.0 mm, 0.6 mm profile, leadless surface-mount package with exposed thermal pad (Pin 6). Molded green compound meets UL 94V-0 and RoHS 3 compliance.

Pin/TerminalCircuit RoleDesign Meaning
1, 2, 3Source (S)Common low-side return path; internally paralleled for reduced resistance and inductance
4Gate (G)Control terminal requiring ≤±12 V drive; 6.9 Ω gate resistance minimizes ringing
5Drain (D)Main power output node; connected to internal die top metallization and thermal slug
6Thermal Pad / Exposed DrainElectrically tied to drain; must be soldered to PCB copper for thermal and electrical integrity

Key Features

FeatureDesign Value
0.6 mm profileEnables use in ultra-thin portable electronics and stacked PCB assemblies where Z-height is constrained to ≤0.7 mm
100% UIS testedEach unit passes production-level unclamped inductive switching at IAS = 4 A, L = 0.3 mH-ensuring field reliability in flyback and buck-boost topologies
4 mm² footprintReduces PCB area vs. SO-8 or SOT-23 packages while maintaining comparable current handling and thermal performance
Halogen- and antimony-freeContains <900 ppm Br, <900 ppm Cl, <1000 ppm Sb-meets IPC-1752A Class 3 environmental reporting requirements

Applications

Buck Converter Primary SwitchUSB-C Load Switch

Use Scenario: 12 V input to 3.3 V/5 V output DC-DC conversion in industrial IoT edge nodes.

IC Role / Device Role / Timing Role: High-side synchronous rectifier switch operating at 500 kHz–1 MHz with 10 V gate drive.

Use Value: 65 mΩ RDS(ON) reduces conduction loss by >35% versus comparable 100 mΩ MOSFETs, improving full-load efficiency to ≥92%.

Use Scenario: Inrush-limited 5 V rail enable for USB-C peripheral ports in docking stations.

IC Role / Device Role / Timing Role: Low-side load switch controlled by microcontroller GPIO with soft-start via gate resistor.

Use Value: 0.6 mm height allows placement beneath connectors; 4.3 A rating supports dual-port 3 A USB-C PD applications.

Power Bank Battery ProtectionLED Driver High-Side Switch

Use Scenario: Overcurrent and short-circuit protection between Li-ion battery pack and boost converter in portable power banks.

IC Role / Device Role / Timing Role: Reverse-polarity and overcurrent blocking switch placed between battery anode and system ground.

Use Value: 115 V VDSS provides margin against battery stack transients; 100% UIS testing ensures survival during accidental short events.

Use Scenario: Constant-current LED string control in automotive interior lighting modules.

IC Role / Device Role / Timing Role: High-side PWM dimming switch driven by 3.3 V MCU with 100 kHz duty-cycle modulation.

Use Value: Low Qg (5.5 nC) and fast tF (3.6 ns) minimize switching loss and EMI during PWM transitions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel MOSFET switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMN10H065LFD-7Same U-DFN2020-6 package, but rated for 100 V VDSS and 6.5 mΩ RDS(ON) @ 10 V - lower on-resistance but reduced voltage marginPreferred for 5–24 V systems where <100 mΩ is critical and transient immunity ≤80 V sufficesSelect when higher efficiency at low voltage outweighs need for 115 V surge tolerance
DMT6009LSDSO-8 package, 60 V VDSS, 9.5 mΩ RDS(ON) @ 10 V - larger footprint, higher thermal resistance (RθJA = 62 °C/W), no UIS test data publishedSuitable for legacy board designs with SO-8 footprints and moderate-power 12 V loadsChoose only if board redesign for U-DFN2020-6 is impractical and 60 V rating is sufficient

Compared with DMT12H065LFDF-13, DMN10H065LFD-7 offers better conduction efficiency below 24 V but sacrifices 15 V surge headroom, while DMT6009LSD trades miniaturization and UIS assurance for ease of hand-soldering and thermal derating flexibility.

Availability

DMT12H065LFDF-13 is available at Aetrix Electronics and suitable for DC-DC primary switching, USB-C load switching, and battery protection circuits requiring stable component supply across industrial, portable, and automotive-qualified production programs.

Supply support for DMT12H065LFDF-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

This MOSFET belongs to Diodes' "PowerMOS" portfolio, engineered specifically for high-efficiency, low-profile power conversion in consumer, computing, and industrial applications where RDS(ON), switching speed, and package size are co-optimized.

FAQ

What is the maximum safe operating junction temperature for DMT12H065LFDF-13?

The absolute maximum junction temperature is +150°C per the datasheet's TJ, TSTG specification. Operation above this limit risks permanent parametric shift or catastrophic failure. Derating curves in Figure 5 and Figure 7 confirm RDS(ON) increases linearly beyond 125°C, so thermal design should target ≤125°C under worst-case ambient and power dissipation conditions.

Can DMT12H065LFDF-13 be used with 3.3 V logic-level gate drive?

Yes-its VGS(TH) range (0.6–2.2 V) and RDS(ON) = 70 mΩ @ VGS = 4.5 V and 150 mΩ @ VGS = 3.0 V allow functional switching at 3.3 V, though conduction loss rises significantly. For optimal efficiency, pair with a gate driver or level shifter to ensure ≥4.5 V drive during active periods.

Is the thermal pad (Pin 6) electrically isolated or connected to the drain?

The exposed thermal pad (Pin 6) is electrically connected to the drain terminal, as confirmed by the Equivalent Circuit diagram and mechanical drawings. It must be soldered to a PCB copper pour tied to the drain net-not left floating or grounded-to ensure both thermal performance and electrical safety.

Does DMT12H065LFDF-13 have avalanche energy rating, and how is it validated?

Yes-EAS = 2.4 mJ at IAS = 4 A and L = 0.3 mH, with 100% production UIS testing per datasheet Note 5. This validation ensures each unit survives single-pulse inductive energy events typical in DC-DC flyback and boost converters without parameter degradation or bond-wire failure.

DMT12H065LFDF-13 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
6-UDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
115 V
Current - Continuous Drain (Id) @ 25°C:
4.3A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
3V, 10V
Rds On (Max) @ Id, Vgs:
65mOhm @ 3A, 10V
Vgs(th) (Max) @ Id:
2.2V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
5.5 nC @ 10 V
Vgs (Max):
±12V
Input Capacitance (Ciss) (Max) @ Vds:
252 pF @ 50 V
FET Feature:
-
Power Dissipation (Max):
1W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
U-DFN2020-6 (Type F)

DMT12H065LFDF-13 FAQ

1.How can I place an order for DMT12H065LFDF-13 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMT12H065LFDF-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMT12H065LFDF-13 reliable?

The price and inventory of DMT12H065LFDF-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMT12H065LFDF-13 is usually 5 days.

3.What payment methods are accepted for DMT12H065LFDF-13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMT12H065LFDF-13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMT12H065LFDF-13?

DMT12H065LFDF-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMT12H065LFDF-13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMT12H065LFDF-13?

For technical support, including DMT12H065LFDF-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMT12H065LFDF-13 requirements.

6.How does Aetrix verify that DMT12H065LFDF-13 is sourced from the original manufacturer or authorized distributors?

All DMT12H065LFDF-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMT12H065LFDF-13 meets industry standards.

7.What is the process for return or replacement of DMT12H065LFDF-13?

All DMT12H065LFDF-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMT12H065LFDF-13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMT12H065LFDF-13 part is unused and in its original packaging.

Return procedure for DMT12H065LFDF-13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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