Diodes Incorporated DMT2004UFV-13
- Part No.:
- DMT2004UFV-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
DMT2004UFV-13.pdf
- Description:
- MOSFET N-CH 24V 70A POWERDI3333
- Quantity:
- Payment:

- Shipping:

Inventory:2,218
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DMT2004UFV-13 from Diodes Incorporated is an N-channel enhancement-mode MOSFET in PowerDI3333-8 (Type UX) package, rated for 24 V VDSS, 5.0 mΩ RDS(ON) @ 10 V VGS, and 70 A continuous drain current at TC = +25°C. It serves as a high-current, low-loss power switch in synchronous buck converters and LED backlight drivers.
For engineers reviewing the DMT2004UFV-13 datasheet, DMT2004UFV-13 pinout, DMT2004UFV-13 application, or DMT2004UFV-13 equivalent, key selection criteria include RDS(ON) at 4.5 V gate drive, thermal resistance RθJC = 3.5 °C/W, UIS ruggedness (26 A avalanche current), and compact 3.3 mm × 3.3 mm footprint enabling high-density DC-DC designs.
Technical Context
This MOSFET employs trench-gate silicon technology optimized for low on-resistance while maintaining fast switching performance. Its gate threshold voltage (0.55–1.45 V) supports logic-level drive compatibility with 3.3 V and 5 V controllers.
The device integrates a robust body diode with 1.0 V forward voltage at 2 A and exhibits 53.7 nC total gate charge at 10 V, balancing drive strength and switching loss in high-frequency power stages up to 1 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 24 V - Maximum blocking voltage for 24 V input rail applications |
| RDS(ON) @ 10 V | 5.0 mΩ - Enables <1 W conduction loss at 70 A in thermally optimized layouts |
| RDS(ON) @ 4.5 V | 6.5 mΩ - Ensures usable on-state performance with standard 5 V gate drivers |
| ID (continuous) | 70 A @ TC = +25°C - Supports high-current power stages without paralleling |
| RθJC | 3.5 °C/W - Allows direct thermal coupling to heatsink or PCB copper for >100 W dissipation |
| EAS | 36 mJ - Withstands repetitive inductive turn-off stress in DC-DC converter freewheeling |
| Qg @ 10 V | 53.7 nC - Determines gate driver current requirement (~5 mA avg. at 100 kHz) |
Pinout & Package
Package: PowerDI3333-8 (Type UX), surface-mount, thermally enhanced with exposed drain pad. Dimensions: 3.3 mm × 3.3 mm × 0.8 mm, 33% board area vs. SO-8.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Source | Four parallel source terminals reduce bond wire inductance and improve current sharing |
| 5, 6, 7, 8 | Drain | Eight-pin drain configuration connects directly to exposed thermal pad for low RθJC |
| G (Pin 1 top view marking) | Gate | Single gate terminal located adjacent to source for minimized gate loop inductance |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(ON) at 4.5 V | 6.5 mΩ enables efficient operation with 5 V microcontroller GPIOs without level-shifting |
| Thermally optimized package | PowerDI3333-8 delivers 3.5 °C/W RθJC, outperforming SO-8 by >50% in junction-to-case thermal resistance |
| 100% UIS tested | Each unit passes unclamped inductive switching test to 26 A/36 mJ, ensuring reliability in hard-switched topologies |
| Green, RoHS-compliant construction | Halogen- and antimony-free molding compound (<900 ppm Br+Cl, <1000 ppm Sb) meets IPC-1752A Class 3 |
Applications
| LED Backlight Driver | Synchronous Buck Converter |
|---|---|
Use Scenario: Driving 4–8 series white LEDs in automotive instrument clusters with 24 V input. IC Role / Device Role: High-side PWM switch controlling LED current in boost/buck-boost topology. Use Value: 5.0 mΩ RDS(ON) limits conduction loss to <800 mW at 40 A peak, reducing thermal load on display module PCB. | Use Scenario: Main power switch in 12 V → 1.2 V VRM for FPGA core supply. IC Role / Device Role: High-current, low-RDS(ON) synchronous rectifier in 500 kHz buck stage. Use Value: 6.5 mΩ @ 4.5 V allows direct drive from PWM controller, eliminating gate driver IC and saving 22 mm² board area. |
| USB-C PD Power Path | Industrial Motor Driver Half-Bridge |
Use Scenario: Input protection and power path selection in 20 V/5 A USB-C PD sink designs. IC Role / Device Role: Reverse-voltage and overcurrent protected high-side switch upstream of DC-DC regulator. Use Value: 24 V VDSS and 70 A rating support full 100 W PD3.0 operation with margin; 36 mJ EAS handles hot-plug transients. | Use Scenario: Low-side switch in 24 V brushed DC motor H-bridge for factory automation actuators. IC Role / Device Role: Fast-turning, avalanche-rugged switch handling 45 A stall current and inductive kickback. Use Value: 26 A IAS and 36 mJ EAS ensure single-pulse survival during motor stall recovery without external snubbers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMTH2004LPS-13 | Same die, PowerDI5060 package (5.0 mm × 6.0 mm); RθJA = 40 °C/W vs. 54 °C/W (FR-4, 2 oz Cu) | Higher power dissipation capability but 3.6× larger footprint; suited for lower-frequency, higher-PD designs | Select when thermal budget exceeds 2.3 W and board space permits larger package |
| SI2304DDS-T1-GE3 | SO-8 package; 30 V VDSS, 35 mΩ @ 4.5 V, 5.3 A ID; no UIS rating specified | Limited to ≤6 A loads; lacks avalanche ruggedness and thermal performance for high-current DC-DC | Only suitable for low-power auxiliary rails where RDS(ON) and ruggedness are secondary |
Compared with DMTH2004LPS-13 and SI2304DDS-T1-GE3, DMT2004UFV-13 uniquely balances ultra-low RDS(ON), compact size, and production-tested UIS robustness-making it optimal for space-constrained, high-efficiency 24 V power conversion where thermal density and transient immunity are critical.
Availability
DMT2004UFV-13 is available at Aetrix Electronics and suitable for LED backlighting, DC-DC converters, and USB-C PD power path management requiring stable component supply across industrial and automotive production programs.
Supply support for DMT2004UFV-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design and manufacturing operations across Asia and the Americas.
The Power MOSFET product line-including the DMT2004UFV-targets high-efficiency, high-density power conversion in consumer, computing, and industrial systems, emphasizing low RDS(ON), thermal performance, and production-grade ruggedness.
FAQ
What is the maximum safe operating temperature for DMT2004UFV-13?
The junction temperature must not exceed +150°C under any condition. At TC = +70°C, the continuous drain current derates to 55 A. Thermal design must account for RθJC = 3.5 °C/W and use the exposed drain pad for heat transfer to PCB copper or external heatsink.
Does DMT2004UFV-13 support 3.3 V gate drive?
Yes-the gate threshold voltage ranges from 0.55 V to 1.45 V, and RDS(ON) is specified down to 10.0 mΩ at VGS = 2.5 V. At 3.3 V, typical RDS(ON) is ~7.5 mΩ, enabling functional operation with 3.3 V logic, though 4.5 V or higher is recommended for full 60 A rating.
How is the PowerDI3333-8 (Type UX) package mounted for optimal thermal performance?
Mount using the recommended pad layout: 2.37 mm × 3.70 mm exposed drain pad with ≥4 thermal vias (0.3 mm diameter, spaced ≤1 mm apart) connecting to inner-layer or backside copper pour. Minimum 2 oz copper on both sides is required to achieve RθJA = 54 °C/W per datasheet Note 6.
Is DMT2004UFV-13 suitable for automotive applications?
It meets AEC-Q101 stress test requirements per Diodes Incorporated qualification reports and operates from –55°C to +150°C. However, automotive use requires system-level validation including PPAP, failure mode analysis, and compliance with ISO/TS 16949; consult Diodes' automotive product documentation for qualified part numbers.
DMT2004UFV-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 24 V
- Current - Continuous Drain (Id) @ 25°C:
- 70A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 2.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 5mOhm @ 12A, 10V
- Vgs(th) (Max) @ Id:
- 1.45V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 53.7 nC @ 10 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1683 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.2W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerDI3333-8 (Type UX)
DMT2004UFV-13 FAQ
1.How can I place an order for DMT2004UFV-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMT2004UFV-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMT2004UFV-13 reliable?
The price and inventory of DMT2004UFV-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMT2004UFV-13 is usually 5 days.
3.What payment methods are accepted for DMT2004UFV-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMT2004UFV-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMT2004UFV-13?
DMT2004UFV-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMT2004UFV-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMT2004UFV-13?
For technical support, including DMT2004UFV-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMT2004UFV-13 requirements.
6.How does Aetrix verify that DMT2004UFV-13 is sourced from the original manufacturer or authorized distributors?
All DMT2004UFV-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMT2004UFV-13 meets industry standards.
7.What is the process for return or replacement of DMT2004UFV-13?
All DMT2004UFV-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMT2004UFV-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMT2004UFV-13 part is unused and in its original packaging.
Return procedure for DMT2004UFV-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DMT2004UFV-13 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

