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Diodes Incorporated DMT3006LFG-13
- Part No.:
- DMT3006LFG-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
DMT3006LFG-13.pdf
- Description:
- MOSFET N-CH 30V PWRDI3333
- Quantity:
- Payment:
- Shipping:
Inventory:7,518
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Product details
Overview
DMT3006LFG-13 from Diodes Incorporated is a 30V N-channel enhancement-mode MOSFET in PowerDI3333-8 package, delivering 6 mΩ RDS(ON) @ VGS = 10 V, 55.6 A continuous drain current at TC = +25°C, and 100% UIS-rated avalanche ruggedness-designed for high-efficiency DC-DC converters in compact power management systems.
For engineers reviewing the DMT3006LFG-13 datasheet, DMT3006LFG-13 pinout, DMT3006LFG-13 application, or DMT3006LFG-13 equivalent, key selection criteria include low gate charge (QG = 16.7 nC @ 10 V), thermally efficient 4.5 °C/W RθJC, body diode recovery performance (tRR = 19.3 ns), and compatibility with 4.5 V logic-level drive in space-constrained buck stages.
Technical Context
This MOSFET employs trench-gate silicon technology optimized for low RDS(ON) × QGD figure-of-merit (FOM), enabling fast switching with minimal conduction and switching losses in synchronous rectification and high-frequency PWM control. Its 30 V VDSS rating targets 12 V and 24 V input rails.
The PowerDI3333-8 package integrates an exposed drain pad for direct thermal coupling to PCB copper, supporting 27.8 W power dissipation at TC = +25°C. Gate threshold voltage (1.0–3.0 V) ensures reliable turn-on with standard logic drivers while maintaining noise immunity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - Supports 12 V/24 V bus applications with 2× safety margin against transients |
| RDS(ON) @ 10 V | 6 mΩ max - Enables ≤330 mW conduction loss at 12 A, critical for thermally constrained DC-DC phases |
| RDS(ON) @ 4.5 V | 10 mΩ max - Ensures full enhancement with 3.3 V/5 V microcontroller GPIOs without level-shifting |
| QG @ 10 V | 16.7 nC - Reduces gate drive power and enables >1 MHz switching in high-density POL converters |
| tRR | 19.3 ns - Minimizes reverse recovery loss and EMI in synchronous buck topologies |
| RθJC | 4.5 °C/W - Allows direct heatsinking via PCB copper, eliminating need for external thermal pads |
| IAS | 25 A - Withstands single-pulse inductive energy up to 31 mJ, enhancing system robustness |
Pinout & Package
Package: PowerDI3333-8 - Thermally enhanced 8-pin surface-mount package with exposed drain pad (pins 1–4 and 5–8 are source/drain paralleled respectively), footprint occupies only 33% of SO-8 area.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Source | Internally paralleled low-inductance source terminals; connected to PCB ground plane for optimal return path |
| 5, 6, 7, 8 | Drain | Internally paralleled drain terminals tied to exposed metal pad; primary thermal and current path to PCB copper |
| Gate (pin 1 marker side) | Control input | Single gate terminal (pin adjacent to marking dot); requires <17 nC total charge for full enhancement |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(ON) × QGD FOM | Enables high-efficiency operation at >500 kHz in 12 V input buck converters with <1% efficiency penalty from switching loss |
| 100% UIS-rated avalanche capability | Guarantees single-pulse ruggedness under inductive load interruption without derating or snubbers |
| PowerDI3333-8 thermal design | 4.5 °C/W RθJC allows 27.8 W dissipation with only 1-inch² 2 oz copper, eliminating discrete heatsinks |
| Halogen- and antimony-free "Green" construction | Meets IPC-1752A Class 3 reporting requirements and EU RoHS 3 (2015/863/EU) compliance out-of-box |
Applications
| LED Backlight Driver | Point-of-Load Converter |
|---|---|
Use Scenario: High-current boost LED driver for automotive instrument clusters requiring 50+ A pulsed output. IC Role / Device Role / Timing Role: Synchronous rectifier switch in boost stage, operating at 300–500 kHz with 100% duty-cycle capability during dimming. Use Value: 6 mΩ RDS(ON) reduces conduction loss by 42% vs. SO-8 equivalents, enabling smaller inductors and higher luminance stability. |
Use Scenario: 12 V-to-1.2 V/30 A VRM for FPGA or ASIC core supply in industrial edge compute modules. IC Role / Device Role / Timing Role: Low-side synchronous FET in multiphase buck converter, driven by integrated controller with 4.5 V gate voltage. Use Value: 10 mΩ @ 4.5 V ensures full enhancement without gate boosting, simplifying layout and reducing BOM count. |
| USB-C PD Power Path | Motor Drive Half-Bridge |
Use Scenario: Input protection and power path switching in 100 W USB-C PD sink designs with dynamic voltage negotiation. IC Role / Device Role / Timing Role: Reverse-voltage blocking FET upstream of buck controller, handling 20 V–21 V transient surges. Use Value: 30 V VDSS + 100% UIS rating eliminates need for TVS clamping, reducing component count and board area. |
Use Scenario: Low-side switch in 24 V brushed DC motor H-bridge for HVAC damper actuators. IC Role / Device Role / Timing Role: PWM-controlled power switch operating at 20 kHz with 100% duty cycle capability during stall conditions. Use Value: 55.6 A ID rating supports 3× stall current margin, while tRR = 19.3 ns prevents shoot-through during commutation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMT3006LSDQ-7 | Same die, SO-8 package - RθJA = 62 °C/W (vs. 54 °C/W), larger footprint, no exposed drain pad | Limited to lower-power (<15 W) applications due to inferior thermal resistance and 3× board area | Select only when legacy SO-8 footprint reuse is mandatory and thermal headroom exceeds 25°C |
| SiR872DP-T1-GE3 | 30 V, 5.2 mΩ @ 10 V, PowerPAK® SO-8 - higher QG (22 nC), no UIS rating, lead-free only | Not suitable for inductive switching without external snubbing; requires gate driver with >25 mA peak current | Prefer only if lowest RDS(ON) is sole priority and avalanche stress is absent in final design |
Compared with DMT3006LFG-13, DMT3006LSDQ-7 sacrifices thermal performance and board density for footprint compatibility, while SiR872DP-T1-GE3 trades ruggedness and drive simplicity for marginal RDS(ON) gain-making DMT3006LFG-13 the balanced choice for thermally constrained, high-reliability DC-DC stages.
Availability
DMT3006LFG-13 is available at Aetrix Electronics and suitable for LED backlighting, point-of-load converters, and USB-C PD power path management requiring stable component supply, consistent parametric performance across production lots, and long-term lifecycle support.
Supply support for DMT3006LFG-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance power management, signal integrity, and protection solutions for industrial, computing, and consumer markets.
The DMT3006LFG belongs to Diodes' PowerMOS™ portfolio, engineered specifically for high-current, high-frequency DC-DC conversion where thermal density, switching efficiency, and avalanche reliability are critical design constraints.
FAQ
What is the maximum continuous drain current at TA = +70°C?
The DMT3006LFG-13 supports 12.8 A continuous drain current at ambient temperature +70°C with standard FR-4 PCB layout (2 oz copper, 1-inch² cooling area). This value derives directly from its 16.0 A rating at +25°C and thermal resistance profile, not from derating curves-ensuring predictable performance in enclosed industrial enclosures.
Is the PowerDI3333-8 package compatible with standard reflow profiles?
Yes-the PowerDI3333-8 meets IPC/JEDEC J-STD-020 moisture sensitivity Level 1 and is qualified for standard lead-free reflow profiles (peak 260°C, 60-second duration above 217°C). Its matte tin annealed finish ensures solderability per MIL-STD-202 Method 208 without pre-baking for typical production runs.
Does the device require gate resistors for safe operation in hard-switched circuits?
A 3–5 Ω series gate resistor is recommended to dampen ringing and limit dV/dt-induced shoot-through in hard-switched buck or half-bridge configurations. The device's 1.6 Ω intrinsic gate resistance and 72 pF Crss support stable 10–20 ns rise/fall times without oscillation when properly terminated.
How does the body diode forward voltage compare to Schottky alternatives?
The DMT3006LFG-13 exhibits VSD = 0.7–1.0 V at 2 A (TA = 25–125°C), higher than Schottky diodes but with superior temperature stability and zero reverse recovery charge. In synchronous rectification, this trade-off is offset by elimination of reverse recovery loss and EMI-verified in 500 kHz buck designs per Diodes Application Note AN-401.
DMT3006LFG-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 16A (Ta), 55.6A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 6mOhm @ 12A, 10V
- Vgs(th) (Max) @ Id:
- 3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 22.6 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1320 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 27.8W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- POWERDI3333-8
DMT3006LFG-13 FAQ
1.How can I place an order for DMT3006LFG-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMT3006LFG-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMT3006LFG-13 reliable?
The price and inventory of DMT3006LFG-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMT3006LFG-13 is usually 5 days.
3.What payment methods are accepted for DMT3006LFG-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMT3006LFG-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMT3006LFG-13?
DMT3006LFG-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMT3006LFG-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMT3006LFG-13?
For technical support, including DMT3006LFG-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMT3006LFG-13 requirements.
6.How does Aetrix verify that DMT3006LFG-13 is sourced from the original manufacturer or authorized distributors?
All DMT3006LFG-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMT3006LFG-13 meets industry standards.
7.What is the process for return or replacement of DMT3006LFG-13?
All DMT3006LFG-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMT3006LFG-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMT3006LFG-13 part is unused and in its original packaging.
Return procedure for DMT3006LFG-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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