My Inquiry
My Account
Diodes Incorporated DMT3020LDV-7
- Part No.:
- DMT3020LDV-7
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 8-PowerVDFN
- Datasheet:
-
DMT3020LDV-7.pdf
- Description:
- MOSFET 2N-CH 30V 32A PWRDI3333
- Quantity:
- Payment:
- Shipping:
Inventory:708
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DMT3020LDV-7 from Diodes Incorporated is a dual N-channel enhancement-mode MOSFET in PowerDI3333-8 (Type UXC) package, rated for 30V VDSS, 20mΩ RDS(ON) @ 10V VGS, and 32A continuous drain current at TC = +25°C. It delivers low on-resistance and fast switching for high-efficiency power management in compact DC-DC converters and load-switching circuits.
For engineers reviewing the DMT3020LDV-7 datasheet, DMT3020LDV-7 pinout, DMT3020LDV-7 application, or DMT3020LDV-7 equivalent, key selection criteria include dual-channel RDS(ON) matching at 4.5V/10V drive, thermal resistance of 4.8°C/W (Junction-to-Case), and body diode recovery time of 10ns - critical for synchronous rectification and bidirectional power path design.
Technical Context
This dual MOSFET integrates two matched N-channel devices sharing a common source configuration per channel (D1/S1/G1 and D2/S2/G2), enabling independent control of two power paths with minimal layout area. Its low gate charge (Qg = 7.0nC @ 10V) and fast switching (tF = 2.4ns) support high-frequency operation up to 1MHz in buck converters and OR-ing controllers.
The device features enhanced thermal performance via an exposed drain pad, achieving RθJC = 4.8°C/W and RθJA = 67°C/W on 1-inch² copper. Its gate threshold voltage (VGS(TH) = 1.0–2.5V) ensures robust turn-on with standard 3.3V/5V logic-level drivers while maintaining low leakage (IDSS ≤ 1.0μA @ 24V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30V - Maximum drain-source blocking voltage for 12V/24V bus protection and point-of-load regulation. |
| RDS(ON) @ 10V | 14–20mΩ - Enables <1W conduction loss at 32A, suitable for high-current load switches. |
| RDS(ON) @ 4.5V | 22–32mΩ - Ensures reliable turn-on with 3.3V microcontroller GPIOs without level-shifting. |
| Qg @ 10V | 7.0nC - Reduces gate-drive power and enables efficient 500kHz–1MHz PWM operation. |
| tRR | 10ns - Supports synchronous rectification with minimal reverse-recovery loss in buck topologies. |
| RθJC | 4.8°C/W - Allows direct thermal coupling to heatsink or PCB copper for sustained 25A operation. |
| ID (TC=70°C) | 25A - Specifies usable current derating under typical industrial ambient conditions. |
Pinout & Package
Package: PowerDI3333-8 (Type UXC), surface-mount, thermally enhanced with exposed drain pad. Molded plastic case rated UL 94V-0; matte tin annealed terminals solderable per MIL-STD-202.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (D1) | Drain 1 | Main current path for Channel 1; electrically connected to exposed drain pad for thermal conduction. |
| Pin 2 (S1) | Source 1 | Reference node for Channel 1; used for current sensing and gate drive return. |
| Pin 3 (G1) | Gate 1 | Control input for Channel 1; requires <2.5V threshold margin for logic-level compatibility. |
| Pin 4 (D2) | Drain 2 | Main current path for Channel 2; isolated from D1 but shares thermal pad for parallel thermal management. |
| Pin 5 (S2) | Source 2 | Reference node for Channel 2; supports independent ground referencing in dual-path designs. |
| Pin 6 (G2) | Gate 2 | Control input for Channel 2; fully decoupled from G1 for asynchronous switching control. |
| Pins 7–8 (Exposed Pad) | Common Drain / Thermal Slug | Internally tied to both D1 and D2; must be soldered to large copper pour for thermal dissipation and EMI reduction. |
Key Features
| Feature | Design Value |
|---|---|
| Dual matched N-channel topology | Enables space-constrained dual-load switching or half-bridge configurations without discrete pairing. |
| Low RDS(ON) at 4.5V | 32mΩ max ensures <0.5W loss at 12.5A, supporting USB PD and battery protection with 3.3V controllers. |
| Fast body diode recovery | 10ns tRR minimizes shoot-through risk and conduction loss in synchronous rectifiers. |
| Green, halogen-free construction | <900ppm Br+Cl total and <1000ppm Sb meets automotive and industrial RoHS 3 compliance requirements. |
| Thermally optimized package | RθJC = 4.8°C/W allows >20W power handling with minimal external heatsinking in 10mm² footprint. |
Applications
| USB Type-C Power Delivery | Industrial PLC I/O Modules |
|---|---|
|
Use Scenario: Dual-path power routing for reversible CC pin detection and VCONN supply switching in USB-C receptacles. IC Role / Device Role: Dual N-channel load switch controlling 5V/20V power rails with independent enable signals. Use Value: 20mΩ RDS(ON) limits voltage drop to <600mV at 3A, preserving tight ±5% VBUS tolerance during hot-plug events. |
Use Scenario: Isolated 24V DC output switching for digital output cards in programmable logic controllers. IC Role / Device Role: High-side load switch driving solenoids and indicator LEDs with overcurrent protection. Use Value: Matched dual channels allow redundant or parallel outputs; 32A rating supports 2×10A loads with 3× safety margin. |
| Automotive Body Control Units | Server VRM Phase Doubler |
|
Use Scenario: Window lift motor direction control and seat heater power distribution in 12V vehicle architectures. IC Role / Device Role: Bidirectional H-bridge half-bridge element with integrated body diodes for regenerative braking. Use Value: 10ns tRR and 50A pulsed rating enable clean commutation at 20kHz PWM, reducing audible noise and EMI. |
Use Scenario: Doubling phase count in multiphase buck converters for AI accelerator GPUs requiring >400A core supply. IC Role / Device Role: Secondary synchronous rectifier in interleaved phase-leg, paralleled with primary FETs. Use Value: 7.0nC Qg and 2.4ns tF reduce gate drive losses by 35% vs. legacy 30V MOSFETs at 1MHz switching. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual N-channel power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3020LSD-13 | Same die, SO-8 package; RθJA = 90°C/W (vs. 67°C/W); no exposed thermal pad. | Limited to <15A continuous due to higher thermal resistance; unsuitable for >1W dissipation. | Select when board space permits SO-8 and thermal budget allows 40% lower current rating. |
| SI6926ADQ-T1-GE3 | 30V dual N-ch, but RDS(ON) = 28mΩ @ 4.5V; Qg = 10.5nC; PowerPAK® SO-8. | Higher gate charge increases driver loss; less suitable for >500kHz operation. | Choose only if existing SO-8 footprint reuse is mandatory and efficiency loss <2% is acceptable. |
Compared with DMT3020LDV-7, DMN3020LSD-13 trades thermal performance for legacy package compatibility, while SI6926ADQ-T1-GE3 sacrifices switching speed and RDS(ON) for vendor consolidation - making DMT3020LDV-7 optimal for thermally constrained, high-frequency dual-switching applications.
Availability
DMT3020LDV-7 is available at Aetrix Electronics and suitable for USB-C power delivery systems, industrial PLC output stages, and automotive body control units requiring stable component supply across multi-year production cycles.
Supply support for DMT3020LDV-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance power management and signal integrity solutions for industrial, computing, and automotive markets.
The DMT3020LDV belongs to Diodes' Power MOSFET product line, engineered specifically for high-density, high-efficiency power switching in space-constrained applications where thermal performance and logic-level drive capability are critical.
FAQ
What is the maximum continuous drain current for each channel at TC = +70°C?
The DMT3020LDV-7 supports 25A continuous drain current per channel at case temperature +70°C, as specified in the Absolute Maximum Ratings table. This derating accounts for junction-to-case thermal resistance (4.8°C/W) and safe operating area limits under steady-state conduction, assuming proper PCB copper area and airflow.
Can DMT3020LDV-7 be used in a synchronous buck converter as a high-side switch?
No - DMT3020LDV-7 is a dual N-channel MOSFET with source terminals referenced to ground per channel; it lacks integrated bootstrap circuitry or level-shifting capability required for high-side N-ch operation. It is designed for low-side switching, load switching, or half-bridge configurations with external gate drivers.
Is the exposed thermal pad electrically connected to any pins?
Yes - the exposed drain pad is internally connected to both Drain 1 (Pin 1) and Drain 2 (Pin 4). It must be soldered to a common PCB copper pour tied to system ground or the respective power rail, and cannot be left floating or insulated without violating thermal and electrical specifications.
What is the gate threshold voltage range, and how does it vary with temperature?
VGS(TH) is specified from 1.0V to 2.5V at 25°C, with typical variation of ±0.3V across –55°C to +150°C (Figure 8). At 150°C, VGS(TH) drops to ~0.7V minimum, ensuring turn-on remains functional even under extreme thermal stress without false turn-off.
DMT3020LDV-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 N-Channel (Dual)
- FET Feature:
- -
- Drain to Source Voltage (Vdss):
- 30V
- Current - Continuous Drain (Id) @ 25°C:
- 32A (Tc)
- Rds On (Max) @ Id, Vgs:
- 20mOhm @ 9A, 10V
- Vgs(th) (Max) @ Id:
- 2.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 7nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 393pF @ 15V
- Power - Max:
- 900mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerDI3333-8 (Type UXC)
DMT3020LDV-7 FAQ
1.How can I place an order for DMT3020LDV-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMT3020LDV-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMT3020LDV-7 reliable?
The price and inventory of DMT3020LDV-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMT3020LDV-7 is usually 5 days.
3.What payment methods are accepted for DMT3020LDV-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMT3020LDV-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMT3020LDV-7?
DMT3020LDV-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMT3020LDV-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMT3020LDV-7?
For technical support, including DMT3020LDV-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMT3020LDV-7 requirements.
6.How does Aetrix verify that DMT3020LDV-7 is sourced from the original manufacturer or authorized distributors?
All DMT3020LDV-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMT3020LDV-7 meets industry standards.
7.What is the process for return or replacement of DMT3020LDV-7?
All DMT3020LDV-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMT3020LDV-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMT3020LDV-7 part is unused and in its original packaging.
Return procedure for DMT3020LDV-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DMT3020LDV-7 Tags
-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage
-
2N7002DW-7-F
Diodes Incorporated
-
SSM6L56FE,LM
Toshiba Semiconductor and Storage
-
SSM6N37FU,LF
Toshiba Semiconductor and Storage
-
2N7002DWH6327XTSA1
Infineon Technologies
-
2N7002BKS,115
Nexperia USA Inc.
-
DMG1016UDW-7
Diodes Incorporated
-
UM6K33NTN
Rohm Semiconductor
-
DMG6602SVT-7
Diodes Incorporated
-
EM6K34T2CR
Rohm Semiconductor
-
UM6K34NTCN
Rohm Semiconductor
-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
