Diodes Incorporated DMT3022UEV-13
- Part No.:
- DMT3022UEV-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 8-PowerVDFN
- Datasheet:
-
DMT3022UEV-13.pdf
- Description:
- MOSFET 2N-CH 30V 17A PWRDI3333
- Quantity:
- Payment:

- Shipping:

Inventory:3,404
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DMT3022UEV-13 from Diodes Incorporated is a dual N-channel enhancement-mode MOSFET in PowerDI®3333-8 (UXD) package, rated for 30V VDSS, 22 mΩ RDS(on) @ VGS = 10V, 17A continuous drain current at TC = +25°C, and featuring integrated ESD protection. It serves as a high-efficiency power switch in compact DC-DC converters and load-switching circuits.
For engineers reviewing the DMT3022UEV-13 datasheet, DMT3022UEV-13 pinout, DMT3022UEV-13 application, or DMT3022UEV-13 equivalent, key selection criteria include its ultra-low gate threshold (0.5–1.8 V), low input capacitance (903 pF), fast switching (tD(ON) = 3.8 ns), dual-channel layout, and thermal resistance of 12 °C/W junction-to-case - critical for thermally constrained PCB layouts.
Technical Context
This device integrates two identical N-channel MOSFETs with shared source terminals (S1/S2) and independent gates (G1, G2) and drains (D1, D2), enabling synchronous rectification or dual-load control in space-constrained topologies. Its gate threshold voltage range (0.5–1.8 V) supports direct drive from 3.3 V and 5 V logic without level-shifting.
The PowerDI3333-8 package provides low thermal resistance (RθJC = 12 °C/W) and high power density, with a 0.072 g mass and UL 94V-0 molding compound. The internal ESD protection diodes on both gates eliminate need for external TVS components in moderate-noise environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - Maximum blocking voltage before avalanche; suitable for 24 V rail switching and USB PD input stages. |
| RDS(on) @ 10 V | 12.2–22 mΩ - Low conduction loss at full gate drive; enables <1.5 W dissipation at 10 A continuous. |
| RDS(on) @ 4.5 V | 17.6–28 mΩ - Maintains usable on-resistance with 3.3 V microcontroller drive; supports logic-level control. |
| QG @ 10 V | 13.9 nC - Low total gate charge reduces driver power and switching losses in high-frequency (>1 MHz) SMPS. |
| Ciss | 903 pF - Minimizes Miller effect during turn-on; improves stability in gate-driven half-bridge configurations. |
| tRR | 17 ns - Fast body diode recovery enables efficient synchronous rectification without external Schottky. |
| TJ Range | −55 to +150 °C - Qualified for industrial and automotive under-hood ambient conditions. |
Pinout & Package
Package: PowerDI®3333-8 (Type UXD), surface-mount, thermally enhanced plastic case with exposed drain pads. Dimensions: 3.30 × 3.30 × 0.80 mm, weight 0.072 g, UL 94V-0 rated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D1, D2 | Drain terminals (independent) | High-side or low-side switching nodes; each connected to separate power path; not internally tied. |
| G1, G2 | Gate terminals (independent) | Enable individual channel control; each includes integrated gate protection diode to ±12 V. |
| S1/S2 | Common source terminal | Shared source node simplifies PCB routing in dual-N half-bridge or parallel-load configurations. |
| NA | No-connect (thermal pad only) | Exposed copper pad beneath package bottom - must be soldered to thermal plane for RθJC = 12 °C/W performance. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low VGS(th) | 0.5–1.8 V - Enables direct interface with 3.3 V I/O without gate drivers; reduces system component count. |
| Low Ciss/Coss ratio | 903 pF / 386 pF - Improves hard-switching efficiency and reduces voltage overshoot during turn-off. |
| ESD-protected gates | HBM > 2 kV (per JESD22-A114) - Eliminates need for external gate protection in non-hostile ESD environments. |
| Green packaging | Halogen- and antimony-free, RoHS 3 compliant - Meets IPC-1752A reporting requirements for sustainability compliance. |
| Thermal pad integration | Exposed drain pad design - Requires minimum 1-inch² copper pour for 1.8 W power dissipation at TA = +25°C. |
Applications
| USB-C Power Delivery Switch | Industrial PLC Output Module |
|---|---|
Use Scenario: Bidirectional 20 V/5 A power path control in USB-C DRP ports with automatic role swap. IC Role / Device Role / Timing Role: Dual N-MOSFET load switch managing VBUS sourcing/sinking; S1/S2 common source enables single-shunt current sensing. Use Value: 22 mΩ RDS(on) limits voltage drop to ≤110 mV at 5 A, preserving PD 3.0 voltage negotiation margin. | Use Scenario: Solid-state replacement for electromechanical relays driving 24 V solenoids and indicator lamps in DIN-rail controllers. IC Role / Device Role / Timing Role: High-side switch with independent gate control per channel; supports staggered turn-on to limit inrush current. Use Value: 17 A rating and 150 °C TJ(max) allow sustained 12 A operation in sealed enclosures up to +70 °C ambient. |
| Automotive Body Control Unit | Server VRM High-Side Driver |
Use Scenario: LED headlight dimming and mirror heater control in 12 V vehicle electrical systems. IC Role / Device Role / Timing Role: Low-side PWM switch with fast tF = 1.7 ns; body diode handles inductive kickback from heater coils. Use Value: 17 ns tRR prevents cross-conduction in multi-phase LED drivers; eliminates need for external flyback diodes. | Use Scenario: High-side switch in multiphase buck converter controlling CPU core voltage (0.8–1.2 V @ 100+ A). IC Role / Device Role / Timing Role: Synchronous rectifier in phase-leg configuration; dual channels support interleaved gate drive timing. Use Value: 12.2 mΩ typical RDS(on) at 10 V reduces conduction loss by 35% vs. comparable 30 V single-die MOSFETs in same footprint. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3022LSD-13 | Same die, SO-8 package; RθJA = 62 °C/W (vs. 70 °C/W for PowerDI); no exposed thermal pad. | Higher board-level thermal resistance limits max current to 12 A continuous in same layout. | Select when legacy SO-8 footprint compatibility is required over thermal performance. |
| SI6926ADQ-T1-GE3 | 30 V, 20 mΩ @ 10 V, but QG = 22 nC (58% higher); no integrated ESD diodes. | Requires external gate protection and larger gate driver; unsuitable for direct MCU drive in noisy environments. | Select only when higher peak current (20 A) justifies added BOM cost and layout complexity. |
Compared with DMN3022LSD-13 and SI6926ADQ-T1-GE3, DMT3022UEV-13 delivers superior thermal performance per mm², lowest gate charge among 30 V dual-N MOSFETs in PowerDI3333-8, and built-in ESD robustness - making it optimal for space- and noise-sensitive embedded power switches.
Availability
DMT3022UEV-13 is available at Aetrix Electronics and suitable for USB-C power delivery modules, industrial PLC output stages, and automotive body control units requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for DMT3022UEV-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Malaysia, and Taiwan.
This part belongs to Diodes' PowerMOS™ family, engineered specifically for high-efficiency, high-density DC-DC conversion and load switching in consumer, industrial, and automotive applications where thermal performance and gate-drive simplicity are critical.
FAQ
What is the maximum continuous drain current for DMT3022UEV-13 at 70°C case temperature?
The datasheet specifies 14 A continuous drain current at TC = +70°C with VGS = 10 V. This derating reflects thermal limits of the PowerDI3333-8 package under realistic board-level cooling conditions, not silicon capability alone.
Can DMT3022UEV-13 be used in a synchronous buck converter as both high-side and low-side switches?
No - DMT3022UEV-13 contains two N-channel MOSFETs with a common source (S1/S2), making it unsuitable as a high-side switch without external level-shifting. It is optimized for low-side or dual low-side configurations, such as dual-output converters or parallel load switching.
Is the exposed thermal pad electrically connected to any internal node?
Yes - the exposed pad is internally connected to the drain terminals (D1 and D2). It must be soldered to a PCB copper pour tied to the drain net to achieve specified RθJC = 12 °C/W and avoid thermal runaway under sustained load.
Does DMT3022UEV-13 require external gate resistors for EMI control in 500 kHz switching applications?
Yes - although its low QG (13.9 nC) enables fast switching, a 5–10 Ω series gate resistor is recommended to damp ringing caused by trace inductance and minimize radiated emissions in 500 kHz–1 MHz SMPS designs, per Diodes' application note AN-7001.
DMT3022UEV-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 N-Channel (Dual)
- FET Feature:
- -
- Drain to Source Voltage (Vdss):
- 30V
- Current - Continuous Drain (Id) @ 25°C:
- 17A (Tc)
- Rds On (Max) @ Id, Vgs:
- 22mOhm @ 11A, 10V
- Vgs(th) (Max) @ Id:
- 1.8V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 13.9nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 903pF @ 15V
- Power - Max:
- 900mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerDI3333-8 (Type UXD)
DMT3022UEV-13 FAQ
1.How can I place an order for DMT3022UEV-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMT3022UEV-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMT3022UEV-13 reliable?
The price and inventory of DMT3022UEV-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMT3022UEV-13 is usually 5 days.
3.What payment methods are accepted for DMT3022UEV-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMT3022UEV-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMT3022UEV-13?
DMT3022UEV-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMT3022UEV-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMT3022UEV-13?
For technical support, including DMT3022UEV-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMT3022UEV-13 requirements.
6.How does Aetrix verify that DMT3022UEV-13 is sourced from the original manufacturer or authorized distributors?
All DMT3022UEV-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMT3022UEV-13 meets industry standards.
7.What is the process for return or replacement of DMT3022UEV-13?
All DMT3022UEV-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMT3022UEV-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMT3022UEV-13 part is unused and in its original packaging.
Return procedure for DMT3022UEV-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DMT3022UEV-13 Tags

-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage

-
2N7002DW-7-F
Diodes Incorporated

-
SSM6L56FE,LM
Toshiba Semiconductor and Storage

-
SSM6N37FU,LF
Toshiba Semiconductor and Storage

-
2N7002DWH6327XTSA1
Infineon Technologies

-
2N7002BKS,115
Nexperia USA Inc.

-
DMG1016UDW-7
Diodes Incorporated

-
UM6K33NTN
Rohm Semiconductor

-
DMG6602SVT-7
Diodes Incorporated

-
EM6K34T2CR
Rohm Semiconductor

-
UM6K34NTCN
Rohm Semiconductor

-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

