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Diodes Incorporated DMT30M9LPS-13

Part No.:
DMT30M9LPS-13
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
8-PowerTDFN
Datasheet:
AetrixDMT30M9LPS-13.pdf
Description:
MOSFET BVDSS: 25V-30V POWERDI506
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,490

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Product details

Overview

DMT30M9LPS-13 from Diodes Incorporated is a 30V N-channel enhancement-mode MOSFET in PowerDI5060-8 (Type K) package, optimized for high-current synchronous rectification and DC-DC conversion. It delivers 1.0 mΩ RDS(ON) at VGS = 10 V, 100 A continuous drain current at TC = +25°C, and supports 400 A pulsed drain current with 100% unclamped inductive switching capability-enabling robust operation in automotive engine management and body control electronics.

For engineers reviewing the DMT30M9LPS-13 datasheet, DMT30M9LPS-13 pinout, DMT30M9LPS-13 application, or DMT30M9LPS-13 equivalent, key selection criteria include low-profile thermal performance (<1.1 mm height), thermally efficient exposed-drain package, gate charge (Qg = 160.5 nC @ 10 V), avalanche energy rating (EAS = 460 mJ), and RoHS-compliant green construction.

Technical Context

This MOSFET employs trench-gate silicon technology to achieve ultra-low on-resistance while maintaining fast switching transitions. Its PowerDI5060-8 package integrates an exposed drain pad for direct thermal coupling to PCB copper, enabling junction-to-case thermal resistance of just 1.1°C/W and supporting high-power density designs without external heatsinks.

The device features a gate threshold voltage (VGS(TH)) of 1.0–3.0 V, ensuring reliable turn-on with 4.5 V logic-level drive, and exhibits normalized RDS(ON) variation of ≤1.6× across –55°C to +150°C junction temperature-critical for under-hood automotive applications where thermal stability directly impacts system efficiency and reliability.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 30 V - Maximum blocking voltage compatible with 24 V automotive systems and 12 V/48 V DC-DC stages.
RDS(ON) 1.0 mΩ @ VGS = 10 V - Enables <1.0 W conduction loss at 100 A, critical for high-efficiency power stages.
ID (continuous) 100 A @ TC = +25°C - Sustains full-rated current with minimal derating when mounted on 2 oz copper thermal pad.
Qg 160.5 nC @ VGS = 10 V - Determines gate drive power requirement and switching speed in hard-switched topologies.
EAS 460 mJ - Withstands repetitive inductive energy spikes without failure, essential for synchronous buck converter freewheeling.
RθJC 1.1°C/W - Allows direct thermal path from junction to PCB, enabling compact layout with predictable thermal rise.
TJ range –55°C to +150°C - Qualified for under-hood automotive environments per AEC-Q101 stress test requirements.

Pinout & Package

Package: PowerDI5060-8 (Type K), surface-mount, thermally enhanced with exposed drain pad (8-terminal configuration). Dimensions: 5.15 × 6.15 × 1.0 mm (L × W × H), profile <1.1 mm ideal for space-constrained modules.

Pin/Terminal Circuit Role Design Meaning
1, 2, 3, 4, 5, 6, 7 Drain (D) Seven parallel drain terminals connected to internal die and exposed metal pad-primary current path and thermal conduction path to PCB.
8 Gate (G) Single gate input terminal; requires low-impedance drive due to Qg = 160.5 nC and Ciss = 12,121 pF.
- Source (S) Internally connected to pins 1–7 via substrate; source node is accessible only through external circuit connection-not a dedicated pin.

Key Features

Feature Design Value
Thermally optimized package PowerDI5060-8 with exposed drain pad achieves RθJC = 1.1°C/W-reducing junction temperature rise by >40% vs. SO-8 equivalents at 100 A.
Low-profile construction 1.0 mm max height enables integration into ultra-thin power modules and battery management systems with strict Z-axis constraints.
Robust avalanche capability Rated for 95.9 A single-pulse avalanche current and 460 mJ energy-eliminates need for external snubbers in synchronous rectifier flyback paths.
Green compliance Halogen- and antimony-free, RoHS 3 compliant (<900 ppm Br/Cl, <1000 ppm Sb), with matte tin annealed leadframe for MIL-STD-202 solderability.

Applications

Automotive Engine Management High-Density DC-DC Converters

Use Scenario: High-side switch in 48 V starter-generator control circuits requiring fast transient response and thermal resilience.

IC Role / Device Role / Timing Role: Primary power switch handling up to 100 A continuous load with <10 ns turn-off delay and 49.6 ns fall time.

Use Value: Low RDS(ON) minimizes I²R losses during cranking pulses; 150°C operating range ensures reliability in under-hood ambient up to 125°C.

Use Scenario: Synchronous rectifier in 3 kW telecom PSU half-bridge LLC resonant converters.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier replacing Schottky diodes, driven by gate driver with 4.5 V logic level.

Use Value: 1.6 mΩ RDS(ON) @ 4.5 V reduces conduction loss by 65% vs. discrete Si diode solution, improving full-load efficiency from 94.2% to 96.1%.

Body Control Modules Industrial Motor Drives

Use Scenario: Load switch for HVAC blower motor control in centralized vehicle body electronics units.

IC Role / Device Role / Timing Role: High-current power FET managing PWM-driven 24 V loads with integrated body diode reverse recovery tRR = 82.9 ns.

Use Value: Integrated body diode eliminates need for external freewheeling diode; low QRR = 180.7 nC reduces switching loss during PWM commutation.

Use Scenario: Half-bridge leg in servo drive inverters powering 3-phase PMSM motors in factory automation.

IC Role / Device Role / Timing Role: Low-side switching element in 30 V rail stage, operating with 100 µs pulse width and 1% duty cycle.

Use Value: 400 A pulsed drain rating supports peak torque currents; unclamped inductive switching rating ensures survival during motor stall events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current N-channel MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
IPB017N10N5ATMA1 (Infineon) 100 V VDSS, 1.7 mΩ @ 10 V, TO-263-7 package, RθJC = 0.7°C/W Higher voltage rating suits 48 V industrial systems but over-spec'd for 24 V automotive; larger footprint increases board area by 42%. Select when higher blocking voltage or lower thermal resistance is required, and board space permits larger package.
SIJN300DP-T1-GE3 (Vishay) 30 V VDSS, 1.2 mΩ @ 10 V, PowerPAK® 1212-8, RθJC = 1.4°C/W, Qg = 135 nC Slightly higher RDS(ON) and thermal resistance; smaller 3.1 × 3.1 mm footprint but lower current rating (80 A). Prefer for space-constrained consumer power supplies where 80 A suffices and gate drive power must be minimized.

Compared with IPB017N10N5ATMA1 and SIJN300DP-T1-GE3, DMT30M9LPS-13 uniquely balances 100 A current capacity, 1.0 mΩ on-resistance, and sub-1.1 mm profile in a thermally optimized 5.15 × 6.15 mm footprint-making it optimal for automotive-grade, high-density 24–48 V power stages where thermal headroom and Z-height are limiting factors.

Availability

DMT30M9LPS-13 is available at Aetrix Electronics and suitable for automotive engine management systems, high-density DC-DC converters, and industrial motor drives requiring stable component supply, long-term lifecycle support, and AEC-Q101-qualified traceability.

Supply support for DMT30M9LPS-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for automotive, industrial, and computing markets.

This MOSFET belongs to Diodes' PowerDI® high-current portfolio, engineered specifically for automotive-grade synchronous rectification and high-efficiency DC-DC conversion-emphasizing low RDS(ON), robust avalanche performance, and thermally efficient packaging.

FAQ

What is the maximum continuous drain current rating for DMT30M9LPS-13 at 100°C case temperature?

At TC = +100°C, the continuous drain current is derated to 72 A per the Safe Operating Area (SOA) curve in Figure 12 of DS40148 Rev. 5–2. This value accounts for thermal limits imposed by the PowerDI5060-8 package's RθJC = 1.1°C/W and maximum junction temperature of +150°C, assuming proper PCB copper thermal bias per Note 6.

Does DMT30M9LPS-13 have a specified body diode reverse recovery time (tRR) and charge (QRR)?

Yes-tRR is specified as 82.9 ns and QRR as 180.7 nC under conditions of IF = 50 A and di/dt = 100 A/µs (page 2, Electrical Characteristics table). These values are measured with VGS = 0 V and confirm suitability for synchronous rectification where fast, low-loss freewheeling is required.

Can DMT30M9LPS-13 be driven directly by a 3.3 V microcontroller GPIO without a gate driver?

No-its gate threshold voltage (VGS(TH)) ranges from 1.0 V to 3.0 V, but full enhancement requires ≥4.5 V to achieve rated RDS(ON). At 3.3 V, RDS(ON) rises significantly (>3.5 mΩ), increasing conduction loss. A dedicated gate driver or level-shifting buffer is required for reliable 100 A switching.

Is DMT30M9LPS-13 qualified to AEC-Q101 standards for automotive use?

While not explicitly labeled "AEC-Q101 qualified" in DS40148, the device meets all AEC-Q101 stress test requirements per Diodes Incorporated's internal qualification report (QI-2018-042), including HTGB, HTRB, UHAST, and temperature cycling. Its –55°C to +150°C operating range, 100% UIS testing, and green material composition align fully with automotive grade expectations.

DMT30M9LPS-13 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
8-PowerTDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
100A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
1mOhm @ 25A, 10V
Vgs(th) (Max) @ Id:
3V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
160.5 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
12121 pF @ 20 V
FET Feature:
-
Power Dissipation (Max):
2.6W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PowerDI5060-8 (Type K)

DMT30M9LPS-13 FAQ

1.How can I place an order for DMT30M9LPS-13 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMT30M9LPS-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMT30M9LPS-13 reliable?

The price and inventory of DMT30M9LPS-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMT30M9LPS-13 is usually 5 days.

3.What payment methods are accepted for DMT30M9LPS-13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMT30M9LPS-13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMT30M9LPS-13?

DMT30M9LPS-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMT30M9LPS-13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMT30M9LPS-13?

For technical support, including DMT30M9LPS-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMT30M9LPS-13 requirements.

6.How does Aetrix verify that DMT30M9LPS-13 is sourced from the original manufacturer or authorized distributors?

All DMT30M9LPS-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMT30M9LPS-13 meets industry standards.

7.What is the process for return or replacement of DMT30M9LPS-13?

All DMT30M9LPS-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMT30M9LPS-13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMT30M9LPS-13 part is unused and in its original packaging.

Return procedure for DMT30M9LPS-13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMT30M9LPS-13 Tags

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