Diodes Incorporated DMT32M4LFG-13
- Part No.:
- DMT32M4LFG-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
DMT32M4LFG-13.pdf
- Description:
- MOSFET BVDSS: 25V~30V POWERDI333
- Quantity:
- Payment:

- Shipping:

Inventory:8,873
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Product details
Overview
DMT32M4LFG-13 from Diodes Incorporated is a 30V N-channel enhancement-mode MOSFET in PowerDI3333-8 package, delivering 1.7mΩ RDS(ON) @ VGS = 10V, 100A continuous drain current at TC = +25°C, and 100% UIS avalanche rated. It serves as a high-current synchronous rectifier or main switch in DC-DC converters for notebook adapters and industrial power supplies.
For engineers reviewing the DMT32M4LFG-13 datasheet, DMT32M4LFG-13 pinout, DMT32M4LFG-13 application, or DMT32M4LFG-13 equivalent, key selection criteria include low RDS(ON) at 4.5V gate drive, thermal resistance (RθJC = 3.9°C/W), Qgd × RDS(ON) figure-of-merit, and PowerDI3333-8 board-area efficiency versus SO-8.
Technical Context
This MOSFET employs trench-gate silicon technology optimized for low conduction loss and fast switching in high-frequency synchronous buck converters. Its gate threshold voltage (VGS(TH) = 1–3V) enables robust turn-on with standard 5V or 3.3V logic-level drivers.
The device integrates an intrinsic body diode with VSD = 0.7–1.0V @ IS = 2A and supports unclamped inductive switching up to IAS = 58A and EAS = 172mJ, enabling reliable operation in hard-switched topologies without external snubbers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30V - Maximum blocking voltage before avalanche onset; suitable for 24V input rails with margin. |
| RDS(ON) @ VGS = 10V | 1.7mΩ max - Enables ≤1.7W conduction loss at 100A; critical for high-efficiency 12V→1V VRMs. |
| RDS(ON) @ VGS = 4.5V | 2.8mΩ max - Ensures low-loss operation with 5V gate drivers in cost-sensitive industrial DC-DC designs. |
| Qg @ VGS = 10V | 67nC - Determines gate drive power and switching loss; paired with low RDS(ON), yields high FOM. |
| RθJC | 3.9°C/W - Thermal path from junction to exposed drain pad; enables direct heatsinking in compact layouts. |
| ID Continuous @ TC = 25°C | 100A - Sustained current capability when mounted on thermally enhanced PCBs with copper thermal pads. |
| EAS | 172mJ - Energy-handling capacity during unclamped inductive switching; eliminates need for external clamping. |
Pinout & Package
Package: PowerDI3333-8 - thermally enhanced 8-pin surface-mount package with exposed drain pad; occupies 33% board area of SO-8; UL 94V-0 molded plastic; matte tin annealed terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 (S) | Source | Common source connection for parallel internal dies; low-inductance return path for high di/dt currents. |
| 5, 6, 7, 8 (D) | Drain | Exposed copper drain pad (pins 5–8) - primary thermal interface and high-current output node. |
| Pin 1 (G) | Gate | Single gate input; optimized for low Rg (0.86Ω) to minimize Miller-induced oscillation risk. |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(ON) @ 4.5V | 2.8mΩ max ensures <1.3W conduction loss at 65A - enables 5V gate drive in telecom POL modules. |
| Qgd × RDS(ON) FOM | 12.9nC × 1.7mΩ = 21.9 - benchmark figure-of-merit for high-frequency switching efficiency in 500kHz+ converters. |
| 100% UIS rated | Validated avalanche energy of 172mJ - guarantees reliability in flyback and LLC resonant converter primary switches. |
| PowerDI3333-8 footprint | 3.3mm × 3.3mm outline with 0.65mm pitch - enables >2× power density vs. SO-8 in space-constrained USB-C PD designs. |
Applications
| Laptop AC-DC Adapters | Industrial 24V DC-DC Converters |
|---|---|
Use Scenario: Primary-side synchronous rectification in 65W–100W GaN-based adapters with 24V–30V input. IC Role / Device Role / Timing Role: High-side synchronous rectifier replacing Schottky diodes; commutates at 200–500kHz. Use Value: Reduces conduction loss by 65% vs. 30V/100A Schottky, lowering case temperature by 18°C at full load. |
Use Scenario: Main switch in isolated 24V-to-12V/5V dual-output forward converters for PLC I/O modules. IC Role / Device Role / Timing Role: Primary-side PWM switch operating at 250kHz with 50% duty cycle. Use Value: Enables 95.2% peak efficiency at 20A output due to 1.7mΩ RDS(ON) and low Qg. |
| LED Backlight Drivers | Automotive Body Control Modules |
Use Scenario: High-current LED string switch in automotive instrument cluster backlighting (12V input, 3A–5A per channel). IC Role / Device Role / Timing Role: Low-side PWM dimming switch controlling 4–6 parallel LED strings. Use Value: Delivers <0.02V dropout at 5A, eliminating thermal derating and enabling single-layer PCB layout. |
Use Scenario: Load switch for 12V accessory circuits (e.g., HVAC actuators, window lift motors) in BCMs. IC Role / Device Role / Timing Role: Protected high-side power switch with integrated avalanche ruggedness. Use Value: Withstands 58A inductive kickback from motor windings without external TVS, reducing BOM count by one component. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMT32M4LFG-7 | Same die and package; differs only in tape-and-reel quantity (2,000 vs. 3,000 units). | No functional difference; identical electrical, thermal, and mechanical specs. | Select based on production volume and reel change frequency - -13 reduces line stops in high-mix SMT lines. |
| DMTH3016LPS-13 | 30V, 1.6mΩ @ 10V, but in PowerDI5060 package (larger footprint, higher RθJA = 62°C/W). | Better RDS(ON) but requires 50% more board area and has lower thermal performance in confined spaces. | Prefer DMT32M4LFG-13 where board area is constrained and thermal pad access is limited. |
Compared with DMT32M4LFG-7, the -13 variant offers identical performance with optimized reel logistics; versus DMTH3016LPS-13, it trades marginal RDS(ON) reduction for 33% smaller footprint and 21% lower RθJC, making it superior for ultra-dense power stages.
Availability
DMT32M4LFG-13 is available at Aetrix Electronics and suitable for laptop power adapters, industrial DC-DC converters, and LED backlighting systems requiring stable component supply and long-term manufacturing continuity.
Supply support for DMT32M4LFG-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.
This MOSFET belongs to Diodes' PowerMOS™ portfolio, engineered specifically for high-efficiency, high-density power conversion in consumer, industrial, and automotive applications - emphasizing low RDS(ON), fast switching, and rugged avalanche performance.
FAQ
What is the maximum allowable junction temperature for DMT32M4LFG-13?
The absolute maximum junction temperature is +150°C, validated across all operating conditions. Derating begins at TJ > 125°C per Figure 5 and Figure 6, where RDS(ON) increases by ~25% from 25°C to 150°C at VGS = 10V. Thermal design must maintain TJ ≤ 135°C for 10-year reliability in continuous operation.
Does DMT32M4LFG-13 require a gate resistor for stability?
Yes - a 3Ω to 10Ω series gate resistor is recommended to dampen ringing caused by parasitic inductance and the device's low Rg (0.86Ω). This is confirmed by the tD(ON)/tR test condition in the datasheet using RG = 3Ω, and prevents shoot-through in half-bridge configurations.
Can DMT32M4LFG-13 be used in automotive applications?
DMT32M4LFG-13 is not AEC-Q101 qualified; Diodes states that automotive-grade versions require explicit qualification and PPAP documentation. For non-safety-critical 12V body electronics (e.g., interior lighting), it may be used subject to customer validation - but not for ADAS, powertrain, or safety systems.
How does the PowerDI3333-8 package improve thermal performance over SO-8?
PowerDI3333-8 reduces RθJC to 3.9°C/W (vs. ~6–8°C/W for SO-8) via a large exposed drain pad soldered directly to PCB copper. Its 3.3mm × 3.3mm footprint also allows tighter thermal vias under the pad, achieving up to 40% lower junction-to-ambient rise at 100A compared to SO-8 with identical board layout.
DMT32M4LFG-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 30A (Ta), 100A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 1.7mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 67 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 4366 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.1W
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- POWERDI3333-8
DMT32M4LFG-13 FAQ
1.How can I place an order for DMT32M4LFG-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMT32M4LFG-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMT32M4LFG-13 reliable?
The price and inventory of DMT32M4LFG-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMT32M4LFG-13 is usually 5 days.
3.What payment methods are accepted for DMT32M4LFG-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMT32M4LFG-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMT32M4LFG-13?
DMT32M4LFG-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMT32M4LFG-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMT32M4LFG-13?
For technical support, including DMT32M4LFG-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMT32M4LFG-13 requirements.
6.How does Aetrix verify that DMT32M4LFG-13 is sourced from the original manufacturer or authorized distributors?
All DMT32M4LFG-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMT32M4LFG-13 meets industry standards.
7.What is the process for return or replacement of DMT32M4LFG-13?
All DMT32M4LFG-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMT32M4LFG-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMT32M4LFG-13 part is unused and in its original packaging.
Return procedure for DMT32M4LFG-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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