Diodes Incorporated DMT35M4LFDF-13
- Part No.:
- DMT35M4LFDF-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 6-UDFN Exposed Pad
- Datasheet:
-
DMT35M4LFDF-13.pdf
- Description:
- MOSFET BVDSS: 25V~30V U-DFN2020-
- Quantity:
- Payment:

- Shipping:

Inventory:5,133
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Product details
Overview
DMT35M4LFDF-13 from Diodes Incorporated is a 30V N-channel enhancement-mode MOSFET in U-DFN2020-6 (Type F) package, featuring 6 mΩ RDS(ON) at VGS = 10 V and 10.5 mΩ at VGS = 4.5 V, rated for 13 A continuous drain current at TA = +25°C. It serves as a low-profile power switch in DC-DC converters, load switches, and battery protection circuits.
For engineers reviewing the DMT35M4LFDF-13 datasheet, DMT35M4LFDF-13 pinout, DMT35M4LFDF-13 application, or DMT35M4LFDF-13 equivalent, key selection criteria include its 0.6 mm profile, 4 mm² PCB footprint, low gate threshold voltage (1.15–2.5 V), and thermal resistance of 73 °C/W under enhanced layout conditions.
Technical Context
This MOSFET employs a trench-gate silicon process optimized for simultaneous low on-resistance and fast switching performance. Its RDS(ON) remains stable across junction temperatures from –55°C to +150°C, with typical values of 4.9 mΩ at VGS = 10 V and ID = 20 A.
The device integrates a body diode with 0.7 V forward voltage at IS = 1 A and exhibits 50 pF reverse transfer capacitance (Crss) at VDS = 15 V, enabling efficient synchronous rectification and high-frequency PWM control in compact power stages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - Maximum blocking voltage before avalanche conduction; suitable for 24 V rail systems with margin. |
| RDS(ON) @ 10 V | 6 mΩ - Enables <100 mW conduction loss at 10 A, critical for thermally constrained layouts. |
| RDS(ON) @ 4.5 V | 10.5 mΩ - Ensures robust turn-on with standard logic-level drivers (e.g., 3.3 V/5 V microcontrollers). |
| Qg @ 10 V | 14.9 nC - Low gate charge reduces driver power demand and switching losses in high-frequency operation. |
| TJ Range | –55°C to +150°C - Supports automotive under-hood and industrial ambient environments without derating. |
| PD (enhanced layout) | 1.7 W - Achievable with 2 oz copper and thermal bias pad; enables >1 A sustained current in space-constrained designs. |
Pinout & Package
Package: U-DFN2020-6 (Type F), 2.0 mm × 2.0 mm × 0.6 mm, exposed drain pad for thermal dissipation. Molded green compound, NiPdAu-plated terminals, moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Source | Four parallel source terminals reduce bond wire inductance and improve current sharing in high-di/dt switching. |
| 5, 6 | Drain (exposed pad) | Thermally coupled to PCB copper; primary heat path-requires soldered thermal pad for RθJA = 73 °C/W rating. |
| Gate | Control input | Single terminal (Pin 1 side); low 2 Ω gate resistance minimizes ringing and simplifies driver design. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low profile | 0.6 mm height enables use in ultra-thin portable electronics and stacked PCB assemblies. |
| Minimal PCB footprint | 4 mm² area reduces board real estate cost and improves layout density in multi-MOSFET power stages. |
| Low gate threshold | VGS(TH) = 1.15–2.5 V ensures reliable turn-on with 3.3 V logic and supports partial-gate-drive fault tolerance. |
| Green compliance | Halogen- and antimony-free, RoHS 3 compliant (<900 ppm Br/Cl, <1000 ppm Sb), meeting strict environmental mandates. |
Applications
| Battery Protection Circuit | USB Power Delivery Switch |
|---|---|
Use Scenario: Bidirectional overcurrent and short-circuit protection in single-cell Li-ion battery packs. IC Role / Device Role / Timing Role: High-side load switch controlling battery discharge path; body diode enables reverse-current blocking during charging. Use Value: 10.5 mΩ RDS(ON) at 4.5 V gate drive minimizes voltage drop and self-heating during 5–8 A load currents. | Use Scenario: Hot-swap and fault-isolation switching in USB-C PD 3.0 power paths up to 20 V/5 A. IC Role / Device Role / Timing Role: Low-inductance, low-RDS(ON) pass transistor enabling fast enable/disable with <10 ns propagation delay. Use Value: 14.9 nC total gate charge allows full turn-on within 1 μs using standard 15 Ω gate drivers. |
| DC-DC Synchronous Rectifier | Industrial Load Switch |
Use Scenario: Secondary-side rectification in 12 V input buck converters powering FPGA or ASIC core rails. IC Role / Device Role / Timing Role: Synchronous rectifier replacing Schottky diode; driven by controller's complementary PWM signal. Use Value: 50 pF Crss and 925 pF Coss minimize shoot-through risk and improve light-load efficiency above 92%. | Use Scenario: Controlled power sequencing for I/O peripherals in programmable logic controllers (PLCs). IC Role / Device Role / Timing Role: Low-thermal-resistance (73 °C/W) high-side switch enabling 10 A steady-state loads without heatsink. Use Value: 1.7 W power dissipation rating supports continuous operation at 70°C ambient with minimal derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel MOSFET switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3020LFG-7 | RDS(ON) = 7.5 mΩ @ 4.5 V; same U-DFN2020-6 package; higher Qg (17.5 nC) | Slightly lower efficiency at 5–8 A due to higher conduction loss; less sensitive to gate drive strength variation | Select when tighter VGS(TH) distribution (1.0–2.2 V) is required for marginal gate drive margins. |
| SI2302DS-T1-BE3 | RDS(ON) = 12 mΩ @ 4.5 V; SOT-23 package; RθJA = 200 °C/W | Higher thermal resistance limits continuous current to ~3.5 A; unsuitable for >1 W power dissipation | Choose only for low-power, cost-sensitive applications where board space permits larger thermal pads or forced air cooling. |
Compared with DMN3020LFG-7 and SI2302DS-T1-BE3, DMT35M4LFDF-13 delivers superior thermal performance (73 vs. ≥140 °C/W), lowest RDS(ON) at logic-level drive, and smallest footprint-making it optimal for high-density, high-efficiency 24 V system power switches.
Availability
DMT35M4LFDF-13 is available at Aetrix Electronics and suitable for battery management systems, USB-C power delivery modules, and industrial PLC load switching requiring stable component supply and long-term lifecycle support.
Supply support for DMT35M4LFDF-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.
This MOSFET belongs to Diodes' PowerMOS™ portfolio, engineered specifically for high-efficiency, space-constrained power conversion and load switching in consumer, computing, and industrial applications.
FAQ
What is the maximum safe operating temperature for DMT35M4LFDF-13?
The device has a specified junction temperature range of –55°C to +150°C. Under recommended PCB layout (2 oz copper, thermal pad), its thermal resistance is 73 °C/W, allowing operation up to +70°C ambient while maintaining TJ ≤ 150°C at 10 A continuous drain current. Exceeding this requires derating per Figure 7 in the datasheet.
Does DMT35M4LFDF-13 support gate drive from a 3.3 V microcontroller?
Yes. With a gate threshold voltage range of 1.15–2.5 V and RDS(ON) = 10.5 mΩ at VGS = 4.5 V, the MOSFET fully enhances using standard 3.3 V GPIO outputs. For guaranteed low-loss operation, ensure gate drive rise time <100 ns and use a series resistor ≤10 Ω to dampen ringing.
How is thermal performance affected if the exposed drain pad is not soldered?
Without soldering the exposed drain pad, thermal resistance degrades from 73 °C/W to 147 °C/W (per Note 5). This halves allowable continuous current-e.g., from 10 A to ~5 A at +70°C ambient-and increases risk of thermal runaway during pulsed loads. Full thermal pad connection is mandatory for rated performance.
Is DMT35M4LFDF-13 qualified for automotive applications?
No. While the device meets RoHS 3 and halogen-free requirements, it is not AEC-Q101 qualified. Diodes offers automotive-grade variants (e.g., DMT35M4LFDFQ-13) with PPAP documentation, IATF 16949 manufacturing, and extended reliability testing-contact Diodes directly for qualified alternatives.
DMT35M4LFDF-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 6-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 13A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 6mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 2.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 14.9 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1009 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 860mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-DFN2020-6 (Type F)
DMT35M4LFDF-13 FAQ
1.How can I place an order for DMT35M4LFDF-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMT35M4LFDF-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMT35M4LFDF-13 reliable?
The price and inventory of DMT35M4LFDF-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMT35M4LFDF-13 is usually 5 days.
3.What payment methods are accepted for DMT35M4LFDF-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMT35M4LFDF-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMT35M4LFDF-13?
DMT35M4LFDF-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMT35M4LFDF-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMT35M4LFDF-13?
For technical support, including DMT35M4LFDF-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMT35M4LFDF-13 requirements.
6.How does Aetrix verify that DMT35M4LFDF-13 is sourced from the original manufacturer or authorized distributors?
All DMT35M4LFDF-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMT35M4LFDF-13 meets industry standards.
7.What is the process for return or replacement of DMT35M4LFDF-13?
All DMT35M4LFDF-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMT35M4LFDF-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMT35M4LFDF-13 part is unused and in its original packaging.
Return procedure for DMT35M4LFDF-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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