Diodes Incorporated DMT6010LPS-13
- Part No.:
- DMT6010LPS-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerTDFN
- Datasheet:
-
DMT6010LPS-13.pdf
- Description:
- MOSFET N-CH 60V 13.5A PWRDI5060
- Quantity:
- Payment:

- Shipping:

Inventory:3,135
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DMT6010LPS-13 from Diodes Incorporated is a 60V N-channel enhancement-mode power MOSFET in PowerDI5060-8 package, delivering 8 mΩ RDS(ON) at VGS = 10 V and 80 A continuous drain current at TC = +25°C. It features low gate charge (41.3 nC at VGS = 10 V), fast switching (tD(OFF) = 23.4 ns), and thermally efficient thermal resistance (RθJC = 1.1 °C/W), making it suitable for high-efficiency notebook battery power management and load-switch applications.
For engineers reviewing the DMT6010LPS-13 datasheet, DMT6010LPS-13 pinout, DMT6010LPS-13 application, or DMT6010LPS-13 equivalent, key selection criteria include RDS(ON) at 4.5 V (12 mΩ), body diode recovery charge (QRR = 38.2 nC), safe operating area (SOA) limits up to 125 A pulsed, junction-to-case thermal performance, and PowerDI5060-8 footprint compatibility with thin-profile PCB designs.
Technical Context
This MOSFET employs a trench-gate silicon process optimized for low conduction loss and controlled switching behavior. Its gate threshold voltage (VGS(TH) = 1–3 V) enables reliable turn-on with standard logic-level drivers, while its low Ciss (2090 pF) and Crss (38.5 pF) support high-frequency DC-DC converter operation without excessive gate drive loss.
The device integrates an intrinsic body diode with VSD = 0.9–1.2 V at 20 A and tRR = 35.4 ns, enabling synchronous rectification and bidirectional current handling in load-switch configurations. Its RDS(ON) exhibits <15% variation across –55°C to +150°C, ensuring stable on-resistance in wide-temperature industrial and computing environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 60 V - Withstands up to 60 V drain-source blocking voltage before avalanche onset |
| RDS(ON) | 8 mΩ @ VGS = 10 V - Enables ≤0.32 W conduction loss at 20 A, critical for high-current load switches |
| ID (TC = 25°C) | 80 A - Supports high-current battery path switching without external heatsink under case-cooled conditions |
| Qg | 41.3 nC @ VGS = 10 V - Determines gate driver power requirement and switching speed in hard-switched topologies |
| RθJC | 1.1 °C/W - Allows direct thermal coupling to PCB copper or heatsink for >100 W power dissipation capability |
| tRR | 35.4 ns - Limits reverse-recovery energy loss during commutation in synchronous buck converters |
| PD (TC = 25°C) | 113 W - Maximum steady-state power dissipation when mounted on thermally optimized copper pad |
Pinout & Package
Package: PowerDI5060-8 - Thermally enhanced 8-pin surface-mount package with exposed drain pad for low RθJC; height <1.1 mm for ultra-thin notebook and portable electronics integration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 5, 6, 7, 8 | Drain (D) | Seven parallel drain terminals connected to internal die and exposed thermal pad - primary current path and thermal conduction path to PCB |
| 4 | Gate (G) | Single gate input controlling channel conduction - requires <41.3 nC charge for full turn-on at 10 V |
| - (exposed pad) | Source (S) | Common source connection formed by soldered bottom-side metal - provides low-inductance return path and mechanical anchoring |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(ON) at 4.5 V | 12 mΩ - Enables direct interfacing with 3.3 V/5 V microcontrollers without level-shifting |
| Thermally optimized package | RθJC = 1.1 °C/W - Reduces junction temperature rise by >50% vs. SO-8 equivalents under same power dissipation |
| Fast body diode recovery | tRR = 35.4 ns - Minimizes shoot-through risk and EMI in synchronous rectifier designs |
| Thin profile | Max height = 1.1 mm - Fits within 1.2 mm Z-height constraints of ultrabook and tablet mainboards |
| Green compliance | Halogen- and antimony-free, RoHS 3 compliant - Meets IPC-1752A material declaration requirements |
Applications
| Notebook Battery Protection | High-Current Load Switch |
|---|---|
Use Scenario: Bidirectional battery protection circuit in Windows-based ultrabooks, managing charge/discharge paths between battery pack and system rail. IC Role / Device Role / Timing Role: Primary high-side switch controlling battery isolation during overvoltage, overcurrent, or thermal fault events. Use Value: 8 mΩ RDS(ON) limits voltage drop to <160 mV at 20 A, preserving battery runtime and reducing thermal stress on protection ICs. | Use Scenario: System-level power rail enable/disable for GPU or SSD modules in mobile workstations. IC Role / Device Role / Timing Role: Low-loss, fast-turning load switch activated by PMIC GPIO to sequence power domains. Use Value: 23.4 ns turn-off delay ensures clean power-down timing alignment with SoC reset signals, preventing latch-up. |
| DC-DC Synchronous Rectifier | USB-C Power Delivery Switch |
Use Scenario: Secondary-side synchronous rectification in 48 V–12 V buck converters for server VRMs and AI accelerators. IC Role / Device Role / Timing Role: Low-VDS rectifying switch replacing Schottky diodes to improve efficiency above 10 A. Use Value: 38.2 nC QRR and 35.4 ns tRR reduce reverse-recovery losses by >65% vs. comparable 60 V MOSFETs, boosting light-load efficiency. | Use Scenario: 20 V/5 A USB-C PD 3.1 power path switch in docking stations and portable monitors. IC Role / Device Role / Timing Role: High-reliability, low-RDS(ON) switch enabling programmable voltage/current negotiation and fault isolation. Use Value: 125 A pulsed rating and SOA-rated operation up to 10 ms pulses ensure robustness against hot-plug inrush and short-circuit transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMT6006LPS-13 | Lower RDS(ON) (6 mΩ @ 10 V), higher Qg (52.5 nC), same package | Better conduction loss but slower switching; suited for lower-frequency, higher-current rails | Select when thermal budget dominates over switching loss, e.g., battery discharge path with <500 kHz PWM |
| SiR626DP-T1-GE3 | 60 V, 5.8 mΩ @ 10 V, PowerPAK® SO-8, RθJC = 1.4 °C/W | Larger footprint, higher thermal resistance, no exposed drain pad | Choose only if legacy SO-8 layout reuse is mandatory and thermal margin ≥15°C is available |
Compared with DMT6010LPS-13, DMT6006LPS-13 trades gate drive energy for lower conduction loss, while SiR626DP-T1-GE3 sacrifices thermal performance and thinness for board-level compatibility - making DMT6010LPS-13 optimal for space-constrained, thermally aggressive notebook and PD applications.
Availability
DMT6010LPS-13 is available at Aetrix Electronics and suitable for notebook battery management, high-current load switching, and USB-C power delivery systems requiring stable component supply, JEDEC-qualified reliability, and RoHS 3 compliance.
Supply support for DMT6010LPS-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance, high-reliability components for computing, industrial, and consumer markets.
The PowerDI5060-8 MOSFET product line targets thin-profile, high-current power management in portable electronics - designed to replace SO-8 and TO-252 devices where thermal density and Z-height are critical constraints.
FAQ
What is the maximum continuous drain current at TA = +70°C?
The DMT6010LPS-13 supports 11 A continuous drain current at ambient temperature +70°C with standard FR-4 mounting (2 oz copper, 1-inch² thermal pad). This rating reflects derating due to reduced thermal dissipation in still-air conditions and must be validated against actual board layout and airflow.
Does this MOSFET require a gate resistor for stability in load-switch applications?
A gate resistor (typically 10–47 Ω) is recommended to dampen ringing caused by gate loop inductance and Miller capacitance interaction. The device's 0.59 Ω intrinsic gate resistance and 38.5 pF Crss make it susceptible to oscillation without proper gate drive impedance control, especially at high dV/dt edges.
Can DMT6010LPS-13 be used in automotive-grade designs?
No - DMT6010LPS-13 is not AEC-Q101 qualified. Diodes offers automotive-grade variants (e.g., DMT6010LPSQ-13) with PPAP documentation, IATF 16949 manufacturing, and extended temperature validation. Use only the Q-suffix version for automotive applications per the manufacturer's automotive product portal.
How does the PowerDI5060-8 package improve thermal performance over SO-8?
The PowerDI5060-8 exposes the drain pad directly to the PCB, achieving RθJC = 1.1 °C/W - over 3× better than typical SO-8 (RθJC ≈ 3.5 °C/W). This allows >100 W power handling with minimal external heatsinking, whereas SO-8 would require thermal vias and large copper areas to achieve comparable junction temperatures.
DMT6010LPS-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerTDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 13.5A (Ta), 80A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 8mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 41.3 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2090 pF @ 30 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.2W (Ta), 113W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerDI5060-8
DMT6010LPS-13 FAQ
1.How can I place an order for DMT6010LPS-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMT6010LPS-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMT6010LPS-13 reliable?
The price and inventory of DMT6010LPS-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMT6010LPS-13 is usually 5 days.
3.What payment methods are accepted for DMT6010LPS-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMT6010LPS-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMT6010LPS-13?
DMT6010LPS-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMT6010LPS-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMT6010LPS-13?
For technical support, including DMT6010LPS-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMT6010LPS-13 requirements.
6.How does Aetrix verify that DMT6010LPS-13 is sourced from the original manufacturer or authorized distributors?
All DMT6010LPS-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMT6010LPS-13 meets industry standards.
7.What is the process for return or replacement of DMT6010LPS-13?
All DMT6010LPS-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMT6010LPS-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMT6010LPS-13 part is unused and in its original packaging.
Return procedure for DMT6010LPS-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DMT6010LPS-13 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

