Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Diodes Incorporated DMT6012LFV-7

Part No.:
DMT6012LFV-7
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
8-PowerVDFN
Datasheet:
AetrixDMT6012LFV-7.pdf
Description:
MOSFET N-CH 60V 43.3A PWRDI3333
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,329

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

DMT6012LFV-7 from Diodes Incorporated is a 60V N-channel enhancement-mode MOSFET in PowerDI3333-8 package, delivering 12 mΩ RDS(ON) at VGS = 10 V and 43.3 A continuous drain current at TC = +25°C. It features ESD-protected gate, 100% production-tested UIS robustness, and thermally efficient small-form-factor packaging-optimized for high-density DC-DC converters and LED backlighting power stages.

For engineers reviewing the DMT6012LFV-7 datasheet, DMT6012LFV-7 pinout, DMT6012LFV-7 application, or DMT6012LFV-7 equivalent, key selection criteria include its 12 mΩ/15 mΩ dual-drive RDS(ON), 170 A pulsed drain capability, integrated body diode with 25.8 ns reverse recovery time, and thermal resistance of 3.7°C/W (junction-to-case), critical for compact power stage thermal design.

Technical Context

This MOSFET employs trench-gate silicon process to achieve low on-resistance while maintaining fast switching performance: tD(ON) = 4.4 ns, tR = 6.7 ns, and Qg = 22.2 nC at VGS = 10 V. Its internal gate protection diode and ±20 V VGSS rating support reliable gate drive in noisy environments.

The device operates across –55°C to +150°C junction temperature range and is characterized for stable RDS(ON) behavior up to 150°C (1.6× nominal at TJ = 150°C, VGS = 10 V). Its PowerDI3333-8 package provides exposed drain pad for low-impedance thermal path and 33% board area reduction versus SO-8.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 60 V - supports 48 V bus systems with 20 % margin against transients
RDS(ON) max 12 mΩ @ VGS = 10 V - enables <1.2 W conduction loss at 10 A, critical for high-efficiency buck stages
ID cont. 43.3 A @ TC = +25°C - defines maximum steady-state current under heatsink-cooled conditions
Qg 22.2 nC @ VGS = 10 V - determines gate driver power requirement and switching loss trade-off
tRR 25.8 ns - limits reverse recovery losses and EMI in synchronous rectification
RθJC 3.7°C/W - enables direct thermal coupling to PCB copper or heatsink for >30 W power dissipation
EAS 28.1 mJ - quantifies single-pulse avalanche energy handling without failure, essential for inductive load switching

Pinout & Package

Package: PowerDI3333-8 (Type UX), surface-mount, thermally enhanced with exposed drain pad. Dimensions: 3.30 mm × 3.30 mm × 0.80 mm (L × W × H); weight ≈ 0.030 g; moisture sensitivity level 1.

Pin/Terminal Circuit Role Design Meaning
1, 2, 3, 4, 5, 6, 7, 8 (Drain) Power Drain / Exposed Pad All pins 1–8 connect internally to drain; exposed bottom pad is primary thermal and electrical drain node
Pin 1 (Top View) Source Leftmost top-side terminal; referenced as source return path for gate drive and load current
Pin 2 (Top View) Gate Second top-side terminal; requires ≤±20 V drive; protected by integrated Zener clamp
Pin 3 (Top View) Source Third top-side terminal; paralleled with Pin 1 to reduce source inductance in high-di/dt switching

Key Features

Feature Design Value
100% production UIS tested Guarantees minimum 23.7 A avalanche current and 28.1 mJ energy survival-no derating needed for inductive turn-off stress
Thermally optimized footprint 33% smaller board area than SO-8; 3.7°C/W RθJC enables >2× power density in space-constrained DC-DC modules
Low-voltage gate drive compatibility 15 mΩ RDS(ON) @ VGS = 4.5 V supports direct interfacing with 5 V or 3.3 V microcontroller GPIOs
ESD-protected gate ±10 µA IGSS leakage at ±20 V ensures robustness against handling and system-level ESD events per IEC 61000-4-2
Green, lead-free construction Halogen- and antimony-free (<900 ppm Br/Cl, <1000 ppm Sb); RoHS 3 compliant; UL 94V-0 molding compound

Applications

LED Backlighting Power Stage Point-of-Load DC-DC Converter High-Side Switch

Use Scenario: Driving white LED strings in LCD TV and monitor backlight units with PWM dimming at 200 kHz switching frequency.

IC Role / Device Role: High-efficiency synchronous rectifier and current regulation switch in boost or SEPIC topology.

Use Value: 12 mΩ RDS(ON) minimizes conduction loss in 3–5 A LED current paths; 25.8 ns tRR suppresses voltage overshoot during fast PWM transitions.

Use Scenario: High-side switch in 12 V input → 1.2 V/30 A output multiphase buck converter for FPGA or ASIC core supplies.

IC Role / Device Role: Main power switch handling 30 A peak current with <1.5 VDS drop at full load.

Use Value: 43.3 A ID rating and 3.7°C/W RθJC allow operation at 92% efficiency without external heatsink under 50°C ambient.

USB-C PD Fast Charging Power Path Industrial Motor Driver Half-Bridge Low-Side

Use Scenario: Input power path switch enabling bidirectional 100 W USB-C PD negotiation and fault isolation in portable power banks.

IC Role / Device Role: Load switch controlling 20 V/5 A input rail with overcurrent and thermal shutdown coordination.

Use Value: 60 V VDSS withstands 20 V PD transients; 170 A IDM handles short-circuit current limiting without avalanche degradation.

Use Scenario: Low-side switch in 24 V brushed DC motor driver for factory automation actuators with 10 A RMS load current.

IC Role / Device Role: PWM-controlled current sink in half-bridge configuration with freewheeling via internal body diode.

Use Value: 40 A IS body diode rating and 25.8 ns tRR ensure clean commutation at 20 kHz PWM; 100% UIS test prevents failure during motor stall events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMT6004LPS-13 Lower RDS(ON) (4.5 mΩ @ 10 V) but higher Qg (42 nC); same 60 V rating and PowerDI3333-8 package Better conduction loss at high current; higher gate drive loss and slower switching than DMT6012LFV-7 Select when thermal budget allows larger gate driver; avoid in >1 MHz switching due to Qg penalty
SI2302DS-T1-GE3 Smaller SOT-23 package; higher RDS(ON) (55 mΩ @ 4.5 V); lower ID (3 A) Limited to sub-5 W loads; no exposed drain pad; unsuitable for >10 A applications Only for ultra-low-cost, low-power logic-level switching where board area is secondary to cost

Compared with DMT6012LFV-7, DMT6004LPS-13 trades higher gate charge for lower conduction loss-ideal for high-current, low-frequency operation-while SI2302DS-T1-GE3 serves only low-power signal-switching roles, lacking thermal capacity and current rating for power conversion use.

Availability

DMT6012LFV-7 is available at Aetrix Electronics and suitable for LED backlighting, point-of-load DC-DC converters, and USB-C PD power path management requiring stable component supply, consistent parametric performance, and long-term industrial lifecycle support.

Supply support for DMT6012LFV-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.

The DMT6012LFV belongs to Diodes' PowerMOS™ portfolio, engineered specifically for high-efficiency, high-density power conversion in consumer, computing, and industrial applications where thermal performance and board-area savings are critical.

FAQ

What is the maximum safe operating temperature for DMT6012LFV-7?

The absolute maximum junction temperature is +150°C, and the device is rated for continuous operation across –55°C to +150°C. Thermal design must ensure TJ remains below this limit under worst-case power dissipation and ambient conditions, using RθJC = 3.7°C/W and proper PCB copper thermal vias to the internal drain pad.

Does DMT6012LFV-7 require an external gate resistor?

Yes-a gate resistor (typically 2–10 Ω) is recommended to control dV/dt and prevent ringing during switching. With Qg = 22.2 nC and typical gate driver output impedance, a 4.7 Ω resistor limits peak gate current to ~2 A and reduces EMI while preserving tR/tF within datasheet specifications.

Can DMT6012LFV-7 be used in synchronous rectification?

Yes-the device's 25.8 ns reverse recovery time (tRR) and 15.1 nC QRR make it suitable for synchronous rectification in DC-DC converters up to 500 kHz. Its low RDS(ON) and integrated body diode enable efficient replacement of Schottky diodes in buck and flyback topologies.

Is the PowerDI3333-8 package compatible with standard reflow profiles?

Yes-PowerDI3333-8 is qualified for IPC/JEDEC J-STD-020 Level 1 moisture sensitivity and supports standard lead-free reflow profiles (peak 260°C, 20–40 sec above 217°C). The matte tin finish on copper leadframe ensures reliable solderability per MIL-STD-202, Method 208.

DMT6012LFV-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
8-PowerVDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
60 V
Current - Continuous Drain (Id) @ 25°C:
43.3A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
12mOhm @ 20A, 10V
Vgs(th) (Max) @ Id:
2.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
22.2 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1522 pF @ 30 V
FET Feature:
-
Power Dissipation (Max):
1.95W (Ta), 33.78W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PowerDI3333-8 (Type UX)

DMT6012LFV-7 FAQ

1.How can I place an order for DMT6012LFV-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMT6012LFV-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMT6012LFV-7 reliable?

The price and inventory of DMT6012LFV-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMT6012LFV-7 is usually 5 days.

3.What payment methods are accepted for DMT6012LFV-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMT6012LFV-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMT6012LFV-7?

DMT6012LFV-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMT6012LFV-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMT6012LFV-7?

For technical support, including DMT6012LFV-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMT6012LFV-7 requirements.

6.How does Aetrix verify that DMT6012LFV-7 is sourced from the original manufacturer or authorized distributors?

All DMT6012LFV-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMT6012LFV-7 meets industry standards.

7.What is the process for return or replacement of DMT6012LFV-7?

All DMT6012LFV-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMT6012LFV-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMT6012LFV-7 part is unused and in its original packaging.

Return procedure for DMT6012LFV-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMT6012LFV-7 Tags

  • DMT6012LFV-7
  • DMT6012LFV-7 PDF
  • DMT6012LFV-7 Datasheet
  • DMT6012LFV-7 Specifications
  • DMT6012LFV-7 Images
  • Diodes Incorporated
  • Diodes Incorporated DMT6012LFV-7
  • Buy DMT6012LFV-7
  • DMT6012LFV-7 Price
  • DMT6012LFV-7 Distributor
  • DMT6012LFV-7 Supplier
  • DMT6012LFV-7 Wholesale
Related Products
BSZ180P03NS3EGATMA1
BSZ180P03NS3EGATMA1

Infineon Technologies

SIRA14DP-T1-GE3
SIRA14DP-T1-GE3

Vishay Siliconix

AO4419
AO4419

Alpha & Omega Semiconductor Inc.

SISA14BDN-T1-GE3
SISA14BDN-T1-GE3

Vishay Siliconix

PSMN9R5-30YLC,115
PSMN9R5-30YLC,115

Nexperia USA Inc.

BUK9Y21-40E,115
BUK9Y21-40E,115

Nexperia USA Inc.

RTQ035N03HZGTR
RTQ035N03HZGTR

Rohm Semiconductor

FDMS7680
FDMS7680

onsemi

RQ3E180BNTB
RQ3E180BNTB

Rohm Semiconductor

STL6N2VH5
STL6N2VH5

STMicroelectronics

DMPH4029LFGQ-7
DMPH4029LFGQ-7

Diodes Incorporated

DMT6015LSS-13
DMT6015LSS-13

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER