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Diodes Incorporated DMT6017LFDF-13

Part No.:
DMT6017LFDF-13
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
6-UDFN Exposed Pad
Datasheet:
AetrixDMT6017LFDF-13.pdf
Description:
MOSFET N-CH 65V 8.1A 6UDFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,370

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Product details

Overview

DMT6017LFDF-13 from Diodes Incorporated is a 65V N-channel enhancement-mode MOSFET in U-DFN2020-6 (Type F) package, optimized for high-efficiency power switching with 18 mΩ RDS(ON) @ VGS = 10 V, 7.1 A ID @ 4.5 V gate drive, and 100% production-tested UIS robustness. It serves as a primary synchronous rectifier or main switch in compact DC-DC converters and wireless charging transmitters.

For engineers reviewing the DMT6017LFDF-13 datasheet, DMT6017LFDF-13 pinout, DMT6017LFDF-13 application, or DMT6017LFDF-13 equivalent, key selection criteria include low-profile thermal performance (0.6 mm height), 4 mm² PCB footprint, ESD-protected gate, and validated avalanche energy (18 mJ) for inductive load reliability.

Technical Context

This MOSFET employs a trench-gate silicon process to achieve low RDS(ON) while maintaining fast switching characteristics: tD(ON) = 4.0 ns, tF = 3.3 ns, and Qgd = 3.1 nC at VDS = 30 V. Its body diode exhibits tRR = 21.1 ns and QRR = 11.9 nC under IF = 6 A / di/dt = 100 A/µs conditions.

The device operates across –55°C to +150°C junction temperature range, with RθJA = 71°C/W on 1-inch² copper pad and RθJC = 10°C/W. Gate threshold voltage is tightly distributed (1.0–2.3 V), enabling stable turn-on control down to 4.5 V logic-level drive.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 65 V - Supports input rails up to 48 V nominal systems with margin for transient spikes.
RDS(ON) 18 mΩ @ VGS = 10 V - Enables <1.1 W conduction loss at 7.5 A continuous drain current.
ID (max) 8.1 A @ TA = 25°C - Sustains full-load operation in space-constrained 12 V–24 V buck converters.
Qg 15.3 nC @ VGS = 10 V - Matches standard gate drivers without requiring oversized external buffers.
EAS 18 mJ - Guarantees reliable unclamped inductive switching in adapter and motor-control flyback paths.
TJ Range –55°C to +150°C - Qualified for automotive cabin and industrial ambient environments without derating.
Ciss 891 pF - Limits high-frequency gate drive current demand and improves EMI predictability.

Pinout & Package

Package: U-DFN2020-6 (Type F), 2.0 × 2.0 × 0.6 mm, lead-free NiPdAu-plated terminals, moisture sensitivity level 1.

Pin/Terminal Circuit Role Design Meaning
Pin 1 (G) Gate Control terminal; ESD-protected; requires ≤±16 V drive; connects to PWM controller output.
Pins 2 & 3 (S) Source Power return path; tied to ground or low-side reference; forms common node with internal body diode cathode.
Pins 4 & 5 (D) Drain High-side power node; connects to input rail or inductor; carries full load current and avalanche energy.
Pin 6 (S) Source (exposed pad) Thermal and electrical source connection; must be soldered to PCB copper pour for RθJA = 71°C/W performance.

Key Features

Feature Design Value
100% UIS tested Ensures every unit withstands real-world inductive turn-off stress without parameter shift or failure.
0.6 mm profile Enables integration into ultra-thin adapters and portable wireless charging pads where Z-height is constrained.
4 mm² footprint Reduces PCB area by >40% vs. SO-8 equivalents, supporting high-density multi-phase power stages.
ESD-protected gate HBM rating ≥2 kV allows safe handling and assembly without special ESD controls beyond standard practices.
Halogen & antimony free Meets IPC-1752A "Green" requirements (<900 ppm Br, <900 ppm Cl, <1000 ppm Sb) for eco-compliant end products.

Applications

DC-DC Converter USB-C Power Adapter

Use Scenario: Primary-side synchronous rectifier in 65 W USB PD buck-boost converter operating at 200–500 kHz.

IC Role / Device Role: Low-loss power switch replacing Schottky diode to reduce conduction loss and improve efficiency above 94%.

Use Value: 18 mΩ RDS(ON) cuts rectifier dissipation by 65% vs. 40 V Schottky, directly enabling 10°C lower MOSFET case temperature.

Use Scenario: Secondary-side switch in compact 30 mm × 30 mm wall-mounted USB-C charger with dual-output capability.

IC Role / Device Role: High-density main switch in isolated flyback topology, mounted directly on top-layer copper.

Use Value: 0.6 mm height and 4 mm² footprint allow placement beneath transformer, reducing overall module thickness to <15 mm.

Wireless Charging Transmitter Industrial Sensor Node Power Supply

Use Scenario: Half-bridge switch in 15 W Qi-compliant transmitter coil driver operating at 110–205 kHz.

IC Role / Device Role: Fast-switching, low-Qgd MOSFET minimizing dead-time losses and EMI during zero-voltage switching transitions.

Use Value: 3.1 nC Qgd and 3.3 ns tF enable clean switching edges, reducing filter component count by two per channel.

Use Scenario: Input protection and load switching in battery-powered IIoT sensor node with 10-year field life requirement.

IC Role / Device Role: Reverse-polarity and overcurrent protected power path controller using integrated body diode and UIS hardening.

Use Value: 18 mJ EAS and –55°C to +150°C rating ensure survival during battery hot-swap events and outdoor thermal cycling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMN6017LFG-7 Same die, but in SOT-23-6 package; RθJA = 157°C/W; no exposed thermal pad. Limited to <1.5 W continuous power; unsuitable for >5 A steady-state loads or high ambient temperatures. Select only when board space permits larger footprint and thermal budget allows higher junction rise.
AOB2018L 60 V, 17 mΩ @ 10 V, but 3.0 × 3.0 mm TDFN; Qg = 18.5 nC; no production UIS test data published. Higher gate charge increases driver loss; lacks documented avalanche ruggedness for flyback snubberless designs. Preferable only if 3.0 mm × 3.0 mm layout is acceptable and system-level UIS validation is performed externally.

Compared with DMT6017LFDF-13, DMN6017LFG-7 trades thermal performance for legacy package compatibility, while AOB2018L offers marginally lower RDS(ON) but sacrifices proven UIS robustness and footprint efficiency-making DMT6017LFDF-13 optimal for miniaturized, high-reliability power switches.

Availability

DMT6017LFDF-13 is available at Aetrix Electronics and suitable for USB-C power adapters, wireless charging transmitters, and industrial sensor node power supplies requiring stable component supply, consistent parametric performance, and long-term lifecycle support.

Supply support for DMT6017LFDF-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for industrial, computing, and consumer markets.

This MOSFET belongs to Diodes' "PowerMOS™" portfolio, engineered specifically for high-frequency, high-efficiency switching in space-constrained power conversion systems where thermal density and avalanche immunity are critical.

FAQ

What is the maximum continuous drain current at 70°C ambient?

The DMT6017LFDF-13 supports 6.5 A continuous drain current at TA = +70°C with proper PCB copper area (1-inch² 2 oz Cu). This value is derived from its 1.76 W power dissipation rating and 71°C/W thermal resistance under those conditions, not extrapolated from 25°C data.

Does this MOSFET require a gate resistor for typical 200–500 kHz switching?

Yes-a 3.3 Ω gate resistor is specified in the datasheet for timing measurements (tD(ON), tF). For 200–500 kHz operation, a 2.2–4.7 Ω resistor balances switching speed against gate drive overshoot and EMI; values below 2 Ω risk ringing due to low gate resistance (1.57 Ω typical) and PCB inductance.

Can the exposed source pad (Pin 6) be left floating?

No. Pin 6 is electrically and thermally connected to the internal source node and must be soldered to a minimum 1-inch² copper pour. Leaving it unconnected degrades RθJA from 71°C/W to ~157°C/W, causing premature thermal shutdown or parametric drift above 2 A load.

Is the body diode suitable for reverse recovery in synchronous rectification?

Yes-the body diode has characterized tRR = 21.1 ns and QRR = 11.9 nC at IF = 6 A / di/dt = 100 A/µs, making it viable for synchronous rectification in medium-frequency (≤300 kHz) topologies where controlled reverse recovery minimizes shoot-through risk.

DMT6017LFDF-13 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
6-UDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
65 V
Current - Continuous Drain (Id) @ 25°C:
8.1A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
18mOhm @ 6A, 10V
Vgs(th) (Max) @ Id:
2.3V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
15.3 nC @ 10 V
Vgs (Max):
±16V
Input Capacitance (Ciss) (Max) @ Vds:
891 pF @ 30 V
FET Feature:
-
Power Dissipation (Max):
800mW (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
U-DFN2020-6 (Type F)

DMT6017LFDF-13 FAQ

1.How can I place an order for DMT6017LFDF-13 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMT6017LFDF-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMT6017LFDF-13 reliable?

The price and inventory of DMT6017LFDF-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMT6017LFDF-13 is usually 5 days.

3.What payment methods are accepted for DMT6017LFDF-13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMT6017LFDF-13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMT6017LFDF-13?

DMT6017LFDF-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMT6017LFDF-13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMT6017LFDF-13?

For technical support, including DMT6017LFDF-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMT6017LFDF-13 requirements.

6.How does Aetrix verify that DMT6017LFDF-13 is sourced from the original manufacturer or authorized distributors?

All DMT6017LFDF-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMT6017LFDF-13 meets industry standards.

7.What is the process for return or replacement of DMT6017LFDF-13?

All DMT6017LFDF-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMT6017LFDF-13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMT6017LFDF-13 part is unused and in its original packaging.

Return procedure for DMT6017LFDF-13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMT6017LFDF-13 Tags

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