Diodes Incorporated DMT64M1LCG-7
- Part No.:
- DMT64M1LCG-7
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
DMT64M1LCG-7.pdf
- Description:
- MOSFET BVDSS: 61V~100V V-DFN3333
- Quantity:
- Payment:

- Shipping:

Inventory:7,218
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Product details
Overview
DMT64M1LCG-7 from Diodes Incorporated is a 65V N-channel enhancement-mode MOSFET in a V-DFN3333-8 (Type B) package, optimized for high-efficiency load switching and synchronous rectification in notebook battery power management. It delivers RDS(ON) = 5.4 mΩ @ VGS = 10 V, 67.8 A continuous drain current at TC = +25°C, and features 100% production-tested UIS robustness.
For engineers reviewing the DMT64M1LCG-7 datasheet, DMT64M1LCG-7 pinout, DMT64M1LCG-7 application, or DMT64M1LCG-7 equivalent, key selection criteria include low RDS(ON) at 4.5 V gate drive, fast switching (tF = 19.9 ns), thermal resistance RθJC = 3.0°C/W, and compliance with AEC-Q101 requirements for automotive-grade reliability.
Technical Context
This MOSFET employs a trench-gate silicon process to achieve ultra-low on-resistance while maintaining controlled gate charge (Qg = 51.4 nC @ 10 V) and minimized reverse transfer capacitance (Crss = 91 pF). Its V-DFN3333-8 package integrates an exposed drain pad for direct thermal path to PCB copper, enabling high-current operation with low junction-to-case thermal resistance.
The device supports both 10 V and 4.5 V logic-level gate drive, with VGS(TH) ranging from 1.3 V to 2.5 V and stable RDS(ON) performance across -55°C to +150°C. Its body diode exhibits low forward voltage (VSD = 0.7–1.2 V @ IS = 1 A) and fast reverse recovery (tRR = 44.8 ns), making it suitable for high-frequency DC-DC converter topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 65 V - Withstands up to 65 V drain-source voltage, supporting 48 V bus and 60 V transient applications. |
| RDS(ON) | 5.4 mΩ @ VGS = 10 V - Enables <1 W conduction loss at 40 A, critical for high-current load switches. |
| ID (continuous) | 67.8 A @ TC = +25°C - Supports high-power notebook battery discharge paths without external heatsinking. |
| Qg | 51.4 nC @ VGS = 10 V - Low gate charge reduces driver power and enables efficient 500 kHz+ switching in buck converters. |
| RθJC | 3.0°C/W - Allows rapid heat transfer from junction to PCB via exposed drain pad, improving thermal headroom. |
| tF | 19.9 ns - Fast fall time minimizes switching losses during high-side or synchronous rectifier turn-off. |
| EAS | 206 mJ - Confirmed avalanche energy rating ensures ruggedness against inductive switching stress in DC-DC stages. |
Pinout & Package
Package: V-DFN3333-8 (Type B), 3.3 mm × 3.3 mm × 0.8 mm profile with exposed drain pad (Pin 8) for thermal and electrical connection to PCB ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7 | Source | Internally paralleled source terminals; low-inductance connection to system ground or return path. |
| 8 | Drain | Exposed copper pad - primary thermal path and high-current output node; must be soldered to ≥1 in² 2 oz copper pour. |
| Gate | Control input | Single terminal (Pin 1 side, see top view marking); requires ≤10 V drive for full enhancement; gate threshold 1.3–2.5 V. |
Key Features
| Feature | Design Value |
|---|---|
| 100% UIS tested | Guarantees minimum 20.3 A/206 mJ avalanche capability per unit, eliminating field failure risk in unclamped inductive loads. |
| Low RDS(ON) @ 4.5 V | 7.3 mΩ enables direct compatibility with 3.3 V/5 V microcontroller GPIOs without level-shifting in portable power switches. |
| Green packaging | Halogen- and antimony-free, RoHS 3 compliant (Br+Cl <1500 ppm, Sb <1000 ppm), meeting strict environmental mandates for consumer electronics. |
| Fast body diode | tRR = 44.8 ns and QRR = 54.0 nC reduce dead-time losses and EMI in synchronous buck and OR-ing configurations. |
| Thermal optimization | RθJC = 3.0°C/W allows >50 W power dissipation with minimal ΔT when mounted on 1 in² thermal pad, simplifying thermal design. |
Applications
| Notebook Battery Protection Circuit | High-Efficiency DC-DC Buck Converter |
|---|---|
|
Use Scenario: Isolating main battery from system rail during fault conditions or deep sleep states in ultrabooks and 2-in-1 laptops. IC Role / Device Role / Timing Role: High-side load switch controlling 20–40 A battery discharge path; activated/deactivated by EC or PMIC GPIO. Use Value: 5.4 mΩ RDS(ON) limits voltage drop to <210 mV at 40 A, preserving battery runtime and reducing thermal load on compact PCBs. |
Use Scenario: Synchronous rectification in 12 V → 1.2 V/60 A CPU core VRMs for modern mobile processors. IC Role / Device Role / Timing Role: Low-side switch in buck topology; commutates with high-side FET at 500–1000 kHz. Use Value: 19.9 ns tF and 91 pF Crss minimize shoot-through risk and switching loss, improving efficiency by ≥1.2% over legacy 8 mΩ devices. |
| USB-C Power Delivery Load Switch | Automotive Body Control Module (BCM) Power Distribution |
|
Use Scenario: Enabling/disabling 20 V/5 A USB-C PD power path in docking stations and portable monitors. IC Role / Device Role / Timing Role: Bidirectional load switch managing power flow between source and sink; body diode supports reverse current. Use Value: VSD = 0.7–1.2 V and tRR = 44.8 ns ensure low-loss reverse conduction and fast polarity transition during PD contract renegotiation. |
Use Scenario: Controlling 12 V accessory loads (e.g., LED lighting, HVAC actuators) in AEC-Q101-qualified BCMs. IC Role / Device Role / Timing Role: High-reliability power switch rated for automotive transients (ISO 7637-2 Pulse 5a); driven by CAN-linked MCU. Use Value: 65 V VDSS and 206 mJ EAS withstand 120 V load-dump spikes; PPAP-capable manufacturing ensures supply continuity for Tier-1 programs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMT64M1LPS-7 | Same die, but in PSOF-8 package with gull-wing leads; RθJA = 62°C/W (vs. 49°C/W for DMT64M1LCG-7). | Preferred for through-hole prototyping or legacy wave-solder assembly; less suitable for space-constrained mobile designs. | Select when manual rework or mixed-technology boards require leaded packages; avoid for high-density portable PCBs. |
| DMTH6016LPS-13 | 60 V rating, 1.6 mΩ RDS(ON) @ 10 V, higher Qg (105 nC); larger PSOF-8 footprint. | Better for <60 V industrial SMPS where ultra-low RDS(ON) outweighs size and cost; not rated for 65 V transients. | Choose only if system max VDS ≤ 60 V and thermal budget permits higher gate drive power; not drop-in compatible. |
Compared with DMT64M1LPS-7 and DMTH6016LPS-13, DMT64M1LCG-7 uniquely balances 65 V rating, 5.4 mΩ on-resistance, 3.0°C/W thermal resistance, and 3.3 mm × 3.3 mm footprint-making it optimal for thermally constrained, high-current portable power switches where board area and transient margin are critical.
Availability
DMT64M1LCG-7 is available at Aetrix Electronics and suitable for notebook battery protection circuits, high-efficiency DC-DC buck converters, and USB-C power delivery load switches requiring stable component supply and consistent parametric performance across production lots.
Supply support for DMT64M1LCG-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.
This MOSFET belongs to Diodes' PowerMOS™ portfolio, engineered specifically for high-efficiency power conversion and load switching in portable computing, consumer power adapters, and automotive body electronics.
FAQ
What is the maximum safe operating temperature for DMT64M1LCG-7?
The device is rated for junction temperatures from –55°C to +150°C. For reliable long-term operation, keep TJ ≤ 135°C under steady-state conditions. With RθJC = 3.0°C/W and a well-designed 1 in² thermal pad, it sustains 67.8 A at TC = +25°C; derate linearly above that ambient.
Does DMT64M1LCG-7 support 3.3 V logic-level gate drive?
Yes-it has a gate threshold voltage range of 1.3 V to 2.5 V and delivers RDS(ON) = 7.3 mΩ at VGS = 4.5 V. While fully enhanced at 10 V, it conducts usable current (ID > 10 A) with 3.3 V drive, though RDS(ON) rises to ~12 mΩ-verify thermal margin in your layout.
Is DMT64M1LCG-7 qualified for automotive applications?
It meets AEC-Q101 stress test requirements and is manufactured in IATF 16949-certified facilities. Diodes offers PPAP documentation and change control for automotive programs; contact their automotive team to obtain qualification reports and part-specific PPAP packages.
How should the exposed drain pad be connected on the PCB?
The exposed drain pad (Pin 8) must be soldered to a dedicated, unbroken copper pour of ≥1 in² using 2 oz copper. Use ≥9 thermal vias (0.3 mm diameter, spaced ≤1 mm apart) connecting to inner-layer ground planes. Avoid splitting the pad or routing traces underneath it to preserve thermal and electrical integrity.
DMT64M1LCG-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 65 V
- Current - Continuous Drain (Id) @ 25°C:
- 16.7A (Ta), 67.8A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 5.4mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 2.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 51.4 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2626 pF @ 30 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.2W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- V-DFN3333-8 (Type B)
DMT64M1LCG-7 FAQ
1.How can I place an order for DMT64M1LCG-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMT64M1LCG-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMT64M1LCG-7 reliable?
The price and inventory of DMT64M1LCG-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMT64M1LCG-7 is usually 5 days.
3.What payment methods are accepted for DMT64M1LCG-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMT64M1LCG-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMT64M1LCG-7?
DMT64M1LCG-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMT64M1LCG-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMT64M1LCG-7?
For technical support, including DMT64M1LCG-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMT64M1LCG-7 requirements.
6.How does Aetrix verify that DMT64M1LCG-7 is sourced from the original manufacturer or authorized distributors?
All DMT64M1LCG-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMT64M1LCG-7 meets industry standards.
7.What is the process for return or replacement of DMT64M1LCG-7?
All DMT64M1LCG-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMT64M1LCG-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMT64M1LCG-7 part is unused and in its original packaging.
Return procedure for DMT64M1LCG-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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