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Diodes Incorporated DMT64M8LCG-13

Part No.:
DMT64M8LCG-13
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
8-PowerVDFN
Datasheet:
AetrixDMT64M8LCG-13.pdf
Description:
MOSFET BVDSS: 61V~100V V-DFN3333
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,181

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Product details

Overview

DMT64M8LCG-13 from Diodes Incorporated is a 60V N-channel enhancement-mode MOSFET in a V-DFN3333-8 (Type B) package, optimized for high-efficiency load switching and synchronous rectification. It delivers 4.8 mΩ RDS(ON) at VGS = 10 V, supports 77.8 A continuous drain current at TC = +25°C, and features ESD-protected gate and 100% production-tested UIS robustness. It is deployed in notebook battery power management systems where low conduction loss and fast switching are critical.

For engineers reviewing the DMT64M8LCG-13 datasheet, DMT64M8LCG-13 pinout, DMT64M8LCG-13 application, or DMT64M8LCG-13 equivalent, key selection criteria include RDS(ON) at 4.5 V, thermal resistance RθJC = 2.5 °C/W, body diode forward voltage (VSD = 0.7–1.2 V), gate charge Qg = 47.5 nC at 10 V, and V-DFN3333-8 footprint compatibility with space-constrained DC-DC converter layouts.

Technical Context

This MOSFET employs a trench-gate silicon process to achieve low RDS(ON) while maintaining controlled gate charge (Qg = 47.5 nC) and low Crss (75 pF), enabling efficient hard-switching in buck converters and OR-ing circuits. Its 100% UIS-tested ruggedness ensures reliable operation under inductive turn-off stress common in notebook power rails.

The device integrates an intrinsic body diode with tRR = 41 ns and QRR = 53 nC, supporting synchronous rectifier operation without external Schottky diodes. Gate threshold voltage (VGS(TH) = 1.3–2.4 V) enables stable 3.3 V and 5 V gate drive compatibility in portable system power stages.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 60 V - Maximum blocking voltage for 12 V/19 V input rail protection and 5 V/3.3 V output stage isolation.
RDS(ON) 4.8 mΩ @ VGS = 10 V - Enables ≤0.5 W conduction loss at 77.8 A, critical for thermally constrained notebook battery switches.
Qg 47.5 nC @ VGS = 10 V - Determines gate driver power requirement and switching transition time in 300–1000 kHz DC-DC controllers.
RθJC 2.5 °C/W - Allows direct thermal coupling to PCB copper pour or heatsink for sustained 62.2 A operation at TC = +70°C.
VGS(TH) 1.3–2.4 V - Ensures full enhancement with standard logic-level gate drivers and avoids partial turn-on during power sequencing.
tRR 41 ns - Limits reverse recovery losses during synchronous rectification in high-frequency buck converters.
ID (TC=25°C) 77.8 A - Specifies maximum continuous current when mounted on a thermally optimized board with exposed drain pad soldered.

Pinout & Package

V-DFN3333-8 (Type B) package with exposed drain pad (D) on bottom surface for thermal and electrical connection. Molded green compound, NiPdAu-plated terminals, moisture sensitivity level 1.

Pin/Terminal Circuit Role Design Meaning
D (Drain) Main current path output / heat sink interface Connected to PCB thermal pad; carries full load current and dissipates >90% of device power; requires minimum 2 oz copper area.
S (Source) Reference node for gate drive and current sensing Provides return path for load current; used as ground reference for gate driver ICs and current-sense amplifiers.
G (Gate) Control terminal for channel modulation High-impedance input requiring <10 µA leakage; sensitive to ESD; must be routed away from noisy switching nodes.

Key Features

Feature Design Value
100% UIS tested Guarantees avalanche energy handling (EAS = 111 mJ) without derating-critical for unclamped inductive loads in battery disconnect circuits.
Low RDS(ON) at 4.5 V 6.5 mΩ enables full enhancement using 5 V microcontroller GPIO or dedicated 4.5 V gate drivers in portable systems.
ESD-protected gate ±20 V gate-source rating with integrated protection diode prevents latch-up or oxide damage during board assembly and handling.
Green, RoHS-compliant construction Halogen- and antimony-free molding compound (<900 ppm Br/Cl, <1000 ppm Sb) meets IPC-1752A environmental reporting requirements.

Applications

Notebook Battery Protection Circuit USB-C Power Delivery Load Switch

Use Scenario: Bidirectional battery disconnect in ultrabook platforms with dual-cell Li-ion packs and smart battery management ICs.

IC Role / Device Role / Timing Role: High-side load switch controlling battery-to-system power path; activated/deactivated via PMIC GPIO with <100 µs response.

Use Value: 4.8 mΩ RDS(ON) reduces voltage drop to <0.4 V at 80 A, preserving battery runtime and minimizing thermal rise on thin PCBs.

Use Scenario: 20 V/5 A USB-C PD 3.0 power path switching between adapter and device battery during charging negotiation.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier in buck-boost controller feedback loop; commutates at 500 kHz with minimal Qgd-driven delay.

Use Value: 75 pF Crss and 47.5 nC Qg enable clean zero-voltage switching transitions, reducing EMI and improving efficiency above 94%.

Industrial 24 V DC-DC Converter Automotive Infotainment Power Rail

Use Scenario: Primary-side high-current switch in isolated 24 V to 5 V flyback converter powering PLC I/O modules.

IC Role / Device Role / Timing Role: Main power switch operating in discontinuous conduction mode (DCM); rated for 310 A pulsed drain current.

Use Value: 111 mJ EAS withstands transformer leakage inductance spikes without snubber circuitry, simplifying layout and BOM.

Use Scenario: Reverse-polarity and overcurrent protection for 12 V supply to head unit display and audio amplifier subsystems.

IC Role / Device Role / Timing Role: Low-side protection FET in active OR-ing configuration with redundant power sources.

Use Value: -55°C to +150°C operating range and AEC-Q101 qualification readiness ensure reliability in under-hood temperature cycling environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMT6006LPS-13 RDS(ON) = 5.2 mΩ @ 10 V; higher Qg = 54 nC; same V-DFN3333-8 package. Marginally lower current rating (70 A vs. 77.8 A); less suitable for peak-load battery discharge scenarios. Select when prioritizing cost over marginal RDS(ON) reduction and thermal margin is sufficient.
SiR626DP-T1-GE3 RDS(ON) = 4.0 mΩ @ 10 V; larger PowerPAK® 3.3×3.3 mm package; higher Ciss = 3020 pF. Requires different PCB footprint; better suited for industrial converters needing higher avalanche rating (EAS = 140 mJ). Choose for designs requiring tighter RDS(ON) tolerance and higher surge immunity, accepting larger board area.

Compared with DMT6006LPS-13 and SiR626DP-T1-GE3, DMT64M8LCG-13 offers the best balance of ultra-low RDS(ON), compact V-DFN3333-8 footprint, and production-validated UIS robustness-making it optimal for space- and thermal-constrained notebook and USB-C PD applications where gate drive voltage is ≥4.5 V.

Availability

DMT64M8LCG-13 is available at Aetrix Electronics and suitable for notebook battery management, USB-C power delivery load switching, and industrial 24 V DC-DC converters requiring stable component supply across multi-year production cycles.

Supply support for DMT64M8LCG-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

This MOSFET belongs to Diodes' PowerMOS™ portfolio, engineered specifically for high-current, low-voltage power conversion and load switching in portable computing, consumer electronics, and industrial power supplies.

FAQ

What is the maximum continuous drain current for DMT64M8LCG-13 at 70°C case temperature?

The maximum continuous drain current is 62.2 A at TC = +70°C with VGS = 10 V, as specified in the Absolute Maximum Ratings table. This value assumes proper thermal management via the exposed drain pad soldered to ≥1 inch² of 2 oz copper on FR-4.

Does DMT64M8LCG-13 require a gate resistor for safe operation?

A gate resistor (typically 3.3 Ω) is recommended to dampen ringing and control dV/dt during switching, especially in high-frequency DC-DC converters. The device's Rg = 0.76 Ω internal gate resistance and Qgd = 12.5 nC make external gate resistance critical for EMI suppression and shoot-through prevention.

Can DMT64M8LCG-13 be used in automotive applications?

While not pre-qualified to AEC-Q101, this part is manufactured in IATF 16949-certified facilities and supports automotive-grade change control. Customers requiring formal qualification should contact Diodes Incorporated for PPAP documentation and test reports before deployment in infotainment or body electronics.

How does the body diode performance affect synchronous rectifier use?

The body diode has VSD = 0.7–1.2 V at IS = 1 A and tRR = 41 ns, enabling efficient freewheeling in buck converters. Its QRR = 53 nC is low enough to minimize reverse recovery loss, but external Schottky clamping may still be needed in >1 MHz designs to suppress voltage overshoot.

DMT64M8LCG-13 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
8-PowerVDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
60 V
Current - Continuous Drain (Id) @ 25°C:
16.1A (Ta), 77.8A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
4.8mOhm @ 20A, 10V
Vgs(th) (Max) @ Id:
2.4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
47.5 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
2664 pF @ 30 V
FET Feature:
-
Power Dissipation (Max):
990mW (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
V-DFN3333-8 (Type B)

DMT64M8LCG-13 FAQ

1.How can I place an order for DMT64M8LCG-13 through Aetrix?

Please submit a Request for Quotation (RFQ) for DMT64M8LCG-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DMT64M8LCG-13 reliable?

The price and inventory of DMT64M8LCG-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMT64M8LCG-13 is usually 5 days.

3.What payment methods are accepted for DMT64M8LCG-13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMT64M8LCG-13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DMT64M8LCG-13?

DMT64M8LCG-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DMT64M8LCG-13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DMT64M8LCG-13?

For technical support, including DMT64M8LCG-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMT64M8LCG-13 requirements.

6.How does Aetrix verify that DMT64M8LCG-13 is sourced from the original manufacturer or authorized distributors?

All DMT64M8LCG-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMT64M8LCG-13 meets industry standards.

7.What is the process for return or replacement of DMT64M8LCG-13?

All DMT64M8LCG-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMT64M8LCG-13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DMT64M8LCG-13 part is unused and in its original packaging.

Return procedure for DMT64M8LCG-13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DMT64M8LCG-13 Tags

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