Diodes Incorporated DMT8008LFG-7
- Part No.:
- DMT8008LFG-7
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
DMT8008LFG-7.pdf
- Description:
- MOSFET N-CH 80V 16A PWRDI3333
- Quantity:
- Payment:

- Shipping:

Inventory:980
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DMT8008LFG-7 from Diodes Incorporated is an 80V N-channel enhancement-mode MOSFET in PowerDI®3333-8 package, delivering 6.9 mΩ RDS(ON) @ VGS = 10 V and 48 A continuous drain current at TC = +25°C. It serves as a high-efficiency synchronous rectifier or main switch in DC-DC converters for industrial power supplies and LED backlighting systems.
For engineers reviewing the DMT8008LFG-7 datasheet, DMT8008LFG-7 pinout, DMT8008LFG-7 application, or DMT8008LFG-7 equivalent, key selection criteria include its low Qgd × RDS(ON) figure-of-merit (FOM), 100% production-tested UIS robustness, thermally optimized PowerDI3333-8 footprint, and verified performance at VGS = 4.5 V for 3.3 V/5 V gate drive compatibility.
Technical Context
This MOSFET employs trench-gate silicon technology to achieve low on-resistance while maintaining fast switching speed and low gate charge (Qg = 37.7 nC @ VGS = 10 V). Its body diode exhibits tRR = 42 ns and QRR = 53 nC under 14 A, 100 A/μs conditions - critical for synchronous buck converter efficiency and EMI control.
The device is characterized for operation across –55°C to +150°C junction temperature range, with RDS(ON) normalized to 2.4× at TJ = 150°C (VGS = 10 V), and features a 5.3 °C/W RθJC enabling direct thermal coupling to PCB copper planes via its exposed drain pad.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 80 V - Withstands up to 80 V drain-source blocking voltage, suitable for 48 V input bus and 60 V transient clamping in industrial DC-DC stages. |
| RDS(ON) | 6.9 mΩ @ VGS = 10 V - Enables <1.5 W conduction loss at 48 A, reducing thermal load in high-current POL converters. |
| ID (continuous) | 48 A @ TC = +25°C - Supports high-current output rails when mounted on thermally enhanced PCB with ≥1 in² 2 oz copper. |
| Qgd | 7.8 nC - Low gate-drain charge minimizes Miller-induced switching delay and improves hard-switching efficiency above 500 kHz. |
| EAS | 162 mJ - Confirmed avalanche energy rating ensures reliable operation during inductive turn-off transients without derating. |
| tRR | 42 ns - Fast body diode recovery reduces cross-conduction losses and voltage overshoot in synchronous rectification. |
Pinout & Package
Package: PowerDI®3333-8 - thermally enhanced surface-mount package with exposed drain pad, 3.3 mm × 3.3 mm footprint, 0.8 mm height, and UL 94V-0 molding compound. Occupies only 33% board area of SO-8.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Source (S) | Four parallel source terminals reduce source inductance and improve current sharing in high-frequency switching. |
| 5, 6, 7, 8 | Drain (D) | Four parallel drain terminals connected to exposed thermal pad - primary heat path to PCB copper plane. |
| 3 (center top) | Gate (G) | Single gate terminal located between source pins - optimized layout minimizes gate loop inductance for stable high-speed switching. |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(ON) × Qgd FOM | 51.3 mΩ·nC - Directly correlates to reduced switching + conduction loss trade-off in high-frequency DC-DC designs. |
| 100% UIS tested | 18 A avalanche current, 162 mJ energy - eliminates need for external snubbers in inductive load switching applications. |
| Thermal resistance RθJC | 5.3 °C/W - Enables >20 W power dissipation with minimal ΔT from junction to PCB copper, supporting compact thermal design. |
| Lead-free & Green | <900 ppm Br, <900 ppm Cl, <1000 ppm Sb - compliant with RoHS 3 and halogen-free requirements for automotive and industrial end equipment. |
Applications
| LED Backlighting | Industrial DC-DC Converters |
|---|---|
|
Use Scenario: High-brightness LCD panel backlight driver using boost or SEPIC topology with PWM dimming. IC Role / Device Role: Main switching FET handling up to 38 A pulsed current at 100–500 kHz switching frequency. Use Value: Low RDS(ON) @ 4.5 V enables direct microcontroller GPIO drive, eliminating level-shifter ICs and reducing BOM count. |
Use Scenario: 48 V-to-12 V isolated or non-isolated buck converter in programmable logic controller (PLC) power modules. IC Role / Device Role: Primary-side high-side switch operating continuously at 40 A, 200 kHz with forced-air cooling. Use Value: 5.3 °C/W RθJC allows full 48 A rating with <30°C junction rise over ambient, avoiding thermal throttling in enclosed enclosures. |
| USB-C PD Power Delivery | Motor Drive Half-Bridge |
|
Use Scenario: 20 V/5 A USB-C PD sink-side buck converter with dynamic voltage scaling and tight thermal constraints. IC Role / Device Role: Synchronous rectifier FET in secondary-side synchronous rectification stage. Use Value: 42 ns body diode tRR and low QRR minimize reverse recovery loss and enable zero-voltage switching (ZVS) assist. |
Use Scenario: 24 V brushed DC motor H-bridge driver in automated factory actuators requiring bidirectional torque and regenerative braking. IC Role / Device Role: Low-side switch in half-bridge configuration, conducting 30 A continuous with 100% duty cycle capability. Use Value: 100% UIS qualification ensures survival during motor stall events and inductive kickback without external TVS clamping. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMT8008LK3-13 | Same die, identical RDS(ON), Qg, and thermal specs; packaged in PowerDI5060-8 with larger 5.0 mm × 6.0 mm footprint and higher PD rating (35 W). | Suitable where board space permits larger package and higher thermal margin is required (e.g., fanless industrial enclosures). | Select when thermal budget exceeds 23.5 W and PCB layout allows 5×6 mm footprint; not drop-in compatible due to different pad layout and pinout. |
| DMTH8008LPS-13 | Same RDS(ON) and voltage rating but in PowerSO-8 package with 1.25 mm height and 0.95 °C/W RθJC; requires solder paste stencil optimization for exposed pad. | Better suited for ultra-low-profile applications (<1.3 mm total height) and automated optical inspection (AOI)-friendly layouts. | Choose for space-constrained consumer electronics where 1.25 mm max height is mandatory; verify thermal interface to heatsink per JEDEC JESD51-14. |
Compared with DMT8008LFG-7, DMT8008LK3-13 offers superior thermal dissipation at the cost of board area, while DMTH8008LPS-13 trades package height for tighter thermal resistance - both require layout revision and are not pin-compatible replacements.
Availability
DMT8008LFG-7 is available at Aetrix Electronics and suitable for LED backlighting, industrial DC-DC converters, and USB-C PD power delivery systems requiring stable component supply, long-term lifecycle support, and RoHS 3-compliant sourcing.
Supply support for DMT8008LFG-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.
The DMT8008LFG belongs to Diodes' PowerMOS™ portfolio, engineered specifically for high-efficiency, high-density power conversion in industrial, computing, and lighting applications where thermal performance and gate-drive simplicity are critical.
FAQ
What is the maximum safe operating temperature for DMT8008LFG-7?
The DMT8008LFG-7 has a specified junction temperature range of –55°C to +150°C. Its absolute maximum rating is TJ = +150°C, and thermal shutdown is not integrated - system-level thermal design must ensure TJ remains ≤150°C under worst-case ambient, power dissipation, and airflow conditions. Derating curves in Figure 12 confirm 48 A is valid only at TC = +25°C.
Can DMT8008LFG-7 be driven directly by a 3.3 V microcontroller GPIO?
No - the gate threshold voltage VGS(TH) ranges from 1.2 V to 2.5 V, but RDS(ON) is not guaranteed below VGS = 4.5 V. At 3.3 V, RDS(ON) rises significantly (>20 mΩ), increasing conduction loss. A dedicated gate driver or level shifter is required for reliable 3.3 V logic compatibility.
Is the PowerDI3333-8 package lead-free and RoHS 3 compliant?
Yes - DMT8008LFG-7 uses matte tin annealed over copper leadframe and green molding compound meeting EU Directive 2015/863/EU (RoHS 3), with bromine and chlorine each <900 ppm and antimony <1000 ppm. Compliance is certified per Diodes Incorporated's published quality documentation.
Does DMT8008LFG-7 include integrated ESD protection?
No - the device does not integrate ESD protection circuitry. Per datasheet Note 9, gate oxide is rated for ±20 V VGSS, but human-body-model (HBM) ESD rating is not specified. External TVS diodes or layout best practices (short gate traces, ground shielding) are recommended for handling-sensitive assembly environments.
DMT8008LFG-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 80 V
- Current - Continuous Drain (Id) @ 25°C:
- 16A (Ta), 48A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 6.9mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 2.5V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 37.7 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2254 pF @ 40 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1W (Ta), 23.5W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- POWERDI3333-8
DMT8008LFG-7 FAQ
1.How can I place an order for DMT8008LFG-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMT8008LFG-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMT8008LFG-7 reliable?
The price and inventory of DMT8008LFG-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMT8008LFG-7 is usually 5 days.
3.What payment methods are accepted for DMT8008LFG-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMT8008LFG-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DMT8008LFG-7?
DMT8008LFG-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMT8008LFG-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMT8008LFG-7?
For technical support, including DMT8008LFG-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMT8008LFG-7 requirements.
6.How does Aetrix verify that DMT8008LFG-7 is sourced from the original manufacturer or authorized distributors?
All DMT8008LFG-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMT8008LFG-7 meets industry standards.
7.What is the process for return or replacement of DMT8008LFG-7?
All DMT8008LFG-7 units undergo pre-shipment inspection (PSI). If there is an issue with DMT8008LFG-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMT8008LFG-7 part is unused and in its original packaging.
Return procedure for DMT8008LFG-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DMT8008LFG-7 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
