Diodes Incorporated DMTH12H007SPSW-13
- Part No.:
- DMTH12H007SPSW-13
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerTDFN
- Datasheet:
-
DMTH12H007SPSW-13.pdf
- Description:
- MOSFET BVDSS: 101V~250V PowerDI5
- Quantity:
- Payment:

- Shipping:

Inventory:7,725
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Product details
Overview
DMTH12H007SPSW from Diodes Incorporated is a 120V, 84A N-channel enhancement-mode MOSFET in PowerDI5060-8 package, rated for continuous operation at +175°C junction temperature, with RDS(ON) = 7.5 mΩ (typ) at VGS = 10 V and 30 A, optimized for high-efficiency DC-DC converters in automotive and industrial power supplies.
For engineers reviewing the DMTH12H007SPSW datasheet, DMTH12H007SPSW pinout, DMTH12H007SPSW application, or DMTH12H007SPSW equivalent, key selection criteria include its 1.2 °C/W RθJC, 100% production-tested UIS robustness, low-profile 1.1 mm height, and thermally efficient exposed-drain PowerDI5060-8 (SWP) package for high-power density board layouts.
Technical Context
This MOSFET employs trench-gate silicon process technology to achieve ultra-low RDS(ON) while maintaining fast switching performance: tD(ON) = 12.5 ns, tR = 13.7 ns, Qg = 44 nC at VDS = 60 V and ID = 25 A. Its gate threshold voltage VGS(TH) ranges 2–4 V, enabling reliable turn-on with standard 5 V or 10 V logic-level drivers.
The device integrates a co-packaged body diode with VSD = 0.8–1.2 V at IS = 30 A and tRR = 55 ns, supporting synchronous rectification and hard-switched topologies. Thermal design is enabled by RθJC = 1.2 °C/W and RθJA = 43 °C/W on FR-4 with 2 oz copper and 1-inch² thermal pad.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 120 V - Supports 48 V input bus systems with ≥2× voltage margin against transients |
| RDS(ON) max @ 10 V | 8.9 mΩ - Enables <1.5 W conduction loss at 84 A, critical for high-current POL converters |
| ID @ 25°C | 84 A - Package-limited continuous current rating under ideal heatsinking conditions |
| TJ max | +175°C - Qualified for under-hood automotive and high-ambient industrial environments |
| Qg | 44 nC - Determines gate drive power requirement and switching loss trade-off at 100–500 kHz |
| EAS | 360.4 mJ - Confirmed avalanche energy rating ensures reliability in inductive load switching |
| RθJC | 1.2 °C/W - Enables direct thermal coupling to heatsink or PCB copper, reducing junction-to-case delta-T |
Pinout & Package
Package: PowerDI5060-8 (SWP), surface-mount, thermally enhanced with exposed drain pad (8-terminal, dual-side cooling capable). Dimensions: 5.15 × 6.40 × 1.10 mm (L × W × H), 0.097 g weight, RoHS-compliant matte tin finish over copper leadframe.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7, 8 (Drain pads) | Power Drain / Heat Sink | All eight terminals are internally connected to the drain; serve as primary current path and thermal conduction path to PCB |
| Gate (G) | Control Input | Single gate terminal (pin 3 per top view schematic); requires ≤±20 V drive; low Ciss = 3142 pF minimizes driver loading |
| Source (S) | Reference Node | Two source terminals (pins 1 & 8); provide Kelvin sensing capability and reduce source inductance in high-di/dt applications |
Key Features
| Feature | Design Value |
|---|---|
| 100% UIS tested in production | Guarantees minimum 15.5 A avalanche current and 360.4 mJ single-pulse energy handling without degradation |
| Thermally efficient PowerDI5060-8 | Exposed drain pad delivers 1.2 °C/W junction-to-case resistance, enabling >125 W power dissipation with external heatsinking |
| Low-profile 1.1 mm height | Enables use in space-constrained modules such as telecom bricks, server VRMs, and automotive ECU power stages |
| High-reliability qualification | Meets JEDEC standards referenced in AEC-Q101; supports PPAP-capable automotive-grade variants (Q-suffix) |
| Green, halogen-free construction | UL 94V-0 molded compound with <900 ppm Br/Cl and <1000 ppm Sb; compliant with RoHS 3 (2015/863/EU) |
Applications
| Automotive DC-DC Converters | Industrial Motor Drives |
|---|---|
Use Scenario: 12 V to 5 V/3.3 V buck converter in engine control unit (ECU) with ambient up to +125°C. IC Role / Device Role / Timing Role: Primary high-side switch operating at 250 kHz with synchronous rectification. Use Value: 8.9 mΩ RDS(ON) reduces conduction loss by >35% vs. legacy TO-252 devices, lowering thermal stress in sealed enclosures. |
Use Scenario: Half-bridge leg in 24 V BLDC motor controller for factory automation actuators. IC Role / Device Role / Timing Role: Low-side switching element with fast 13.7 ns rise time and 55 ns body diode recovery. Use Value: 1.2 °C/W RθJC enables stable 70 A pulsed operation without active cooling, simplifying mechanical design. |
| Telecom Power Supplies | Server Point-of-Load (POL) |
Use Scenario: Isolated forward converter secondary-side synchronous rectifier in 48 V telecom rectifier module. IC Role / Device Role / Timing Role: Synchronous rectifier with body diode conducting during dead-time; VSD = 0.8 V minimizes forward loss. Use Value: 336 A pulsed drain current rating supports peak loads during burst-mode operation without derating. |
Use Scenario: 48 V to 0.8 V step-down converter delivering >100 A to CPU/GPU in AI accelerator servers. IC Role / Device Role / Timing Role: High-current, low-RDS(ON) power stage switch with parallel configuration support. Use Value: Dual-source terminals enable Kelvin source connection, improving current sensing accuracy and loop stability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMTH12H007LPSW-13 | Same die, identical RDS(ON) and ratings, but in PowerDI5060-8 (LPSW) variant with different leadframe plating | No functional difference; LPSW uses electroplated tin instead of matte tin annealed finish | Select when alternate plating specification required for solder joint reliability or reflow profile compatibility |
| IXTP110N10T | 100 V, 110 A, TO-220 package; RDS(ON) = 9.5 mΩ @ 10 V; RθJC = 0.45 °C/W but larger footprint and height | Requires heatsink mounting; unsuitable for ultra-thin or high-density layouts | Choose only if higher pulse current (IDM = 440 A) and lower thermal resistance outweigh PCB area and height constraints |
Compared with DMTH12H007SPSW, DMTH12H007LPSW-13 offers identical electrical performance with minor plating variation, while IXTP110N10T trades compactness and thermal interface simplicity for higher pulse current and discrete heatsink flexibility-making the PowerDI5060-8 version optimal for space- and thermal-constrained high-frequency power stages.
Availability
DMTH12H007SPSW is available at Aetrix Electronics and suitable for automotive DC-DC converters, industrial motor drives, and telecom power supplies requiring stable component supply, long-term lifecycle assurance, and AEC-Q101-aligned manufacturing traceability.
Supply support for DMTH12H007SPSW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal ICs, with design, manufacturing, and test facilities across Asia and the Americas.
This MOSFET belongs to Diodes' Power Solutions product line, engineered specifically for high-efficiency, high-reliability power conversion in automotive, industrial, and communications infrastructure where thermal performance and ruggedness are critical.
FAQ
What is the maximum continuous drain current at +100°C case temperature?
The DMTH12H007SPSW is rated for 60 A continuous drain current at TC = +100°C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limits of the PowerDI5060-8 package and must be validated with actual board-level thermal design using the provided RθJC = 1.2 °C/W and transient thermal resistance curves.
Does this MOSFET require a gate resistor for safe operation in hard-switched circuits?
Yes-a gate resistor is required to control dV/dt and di/dt during switching transitions. With Qg = 44 nC and typical gate drive voltage of 10 V, a 2.7 Ω resistor (as used in the datasheet's timing test condition) yields ~10 ns rise/fall times. Lower values increase switching speed but risk ringing; higher values reduce EMI but raise switching losses.
Can the body diode be used for reverse polarity protection in 48 V systems?
No-the body diode is not rated for continuous reverse-battery protection. Its VSD = 0.8–1.2 V at 30 A and limited surge capability (ISM = 336 A, 10 µs) make it suitable only for synchronous rectification or freewheeling. For reverse polarity protection, a dedicated low-VF Schottky or ideal diode controller is required.
Is the PowerDI5060-8 package compatible with standard reflow profiles for lead-free assembly?
Yes-the device is qualified for lead-free reflow per J-STD-020, with Moisture Sensitivity Level 1 (MSL-1), meaning unlimited floor life at ≤30°C/60% RH. The matte tin annealed finish ensures reliable solderability using standard SAC305 profiles with peak temperatures up to 260°C and 60–90 seconds above 217°C.
DMTH12H007SPSW-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerTDFN
- Packaging:
- Bulk
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 120 V
- Current - Continuous Drain (Id) @ 25°C:
- 84A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 6V, 10V
- Rds On (Max) @ Id, Vgs:
- 8.9mOhm @ 30A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 44 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3142 pF @ 60 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3.5W
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- PowerDI5060-8 (Type UX)
DMTH12H007SPSW-13 FAQ
1.How can I place an order for DMTH12H007SPSW-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for DMTH12H007SPSW-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DMTH12H007SPSW-13 reliable?
The price and inventory of DMTH12H007SPSW-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DMTH12H007SPSW-13 is usually 5 days.
3.What payment methods are accepted for DMTH12H007SPSW-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DMTH12H007SPSW-13 transactions.
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4.How is shipping managed for DMTH12H007SPSW-13?
DMTH12H007SPSW-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DMTH12H007SPSW-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DMTH12H007SPSW-13?
For technical support, including DMTH12H007SPSW-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DMTH12H007SPSW-13 requirements.
6.How does Aetrix verify that DMTH12H007SPSW-13 is sourced from the original manufacturer or authorized distributors?
All DMTH12H007SPSW-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DMTH12H007SPSW-13 meets industry standards.
7.What is the process for return or replacement of DMTH12H007SPSW-13?
All DMTH12H007SPSW-13 units undergo pre-shipment inspection (PSI). If there is an issue with DMTH12H007SPSW-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DMTH12H007SPSW-13 part is unused and in its original packaging.
Return procedure for DMTH12H007SPSW-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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