Infineon Technologies FF08MR12W1MA1B11ABPSA1

Overview

FF08MR12W1MA1B11ABPSA1 from Infineon is an Automotive CoolSiC™ EasyPACK™ 1B half-bridge power module integrating two 1200 V, 150 A silicon carbide MOSFETs with integrated NTC thermistor and PressFIT signal terminals. It delivers low R_DS,on (7.33–12.10 mΩ), ultra-low switching losses (E_on = 4.26–5.29 mJ, E_off = 2.67–2.76 mJ at 150 A), and operates up to T_vj,op = 150 °C - enabling compact, high-efficiency DC/DC converters and auxiliary inverters in (H)EV powertrains.

For engineers reviewing the FF08MR12W1MA1B11ABPSA1 datasheet, FF08MR12W1MA1B11ABPSA1 pinout, FF08MR12W1MA1B11ABPSA1 application, or FF08MR12W1MA1B11ABPSA1 equivalent, key selection criteria include its 1200 V blocking capability, 5.0 nH stray inductance, 0.46–0.55 K/W junction-to-heatsink thermal resistance, integrated NTC (R₂₅ = 5 kΩ, B_25/100 = 3433 K), and AQG 324 qualification for automotive use.

Technical Context

This module implements Infineon's CoolSiC™ Automotive MOSFET Gen1 in a half-bridge topology with co-packaged body diodes and an embedded NTC thermistor. Its design targets high-voltage traction auxiliary systems requiring fast switching (t_d,on = 46–53 ns, t_d,off = 146–149 ns), low gate charge (Q_G = 0.49 µC), and minimal Crss (0.06 nF) to reduce Miller-induced turn-on risk.

Mechanically, it uses PressFIT signal pins and clamping-based mounting to eliminate soldering, while its Al₂O₃-based isolation achieves 5.1 kV DC withstand voltage with 11.5 mm creepage to heatsink. The 24 g module supports flexible cooler integration and meets RoHS compliance and AQG 324 Rev. 02.1/2019 requirements.

Key Specifications

Pinout & Package

FF08MR12W1MA1B11ABPSA1 is housed in the EasyPACK™ 1B package: 48.5 × 43.5 × 8.5 mm, aluminum nitride (AlN) baseplate, press-fit signal pins, and screw-mount power terminals. Weight: 24 g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage SiC half-bridge module applications.

Compared with FS800R08A6P2B11A and FF600R12ME4_B11, FF08MR12W1MA1B11ABPSA1 uniquely combines 1200 V blocking, 150 A rating, integrated NTC, and AQG 324 qualification - making it the only drop-in-ready solution for next-gen 800 V auxiliary inverters demanding zero external sensing and extended thermal margin.

Availability

FF08MR12W1MA1B11ABPSA1 is available at Aetrix Electronics and suitable for automotive auxiliary inverters, on-board DC/DC converters, and electric power steering systems requiring stable component supply, long-lifecycle assurance, and AQG 324-compliant sourcing.

Supply support for FF08MR12W1MA1B11ABPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensors for automotive, industrial, and renewable energy markets.

This part belongs to the Automotive CoolSiC™ EasyPACK™ 1B product line, engineered specifically for high-reliability, high-power-density auxiliary power conversion in battery electric and fuel cell vehicles.

FAQ

What is the maximum recommended gate resistor value for reliable switching?

The datasheet specifies optimal performance with R_G,on = R_G,off = 5.1 Ω. Using >10 Ω increases switching times and energy loss (E_on rises ~15 % at R_G = 15 Ω), while <3.3 Ω risks gate oscillation due to low Crss and high di/dt. A 5.1 Ω non-inductive resistor is mandatory for AQG 324-compliant operation.

Does the integrated NTC meet automotive temperature accuracy requirements?

Yes. The NTC has R₂₅ = 5 kΩ ±5 %, B_25/100 = 3433 K ±1 %, and is calibrated across −40 to +150 °C. When used with a 1 % precision reference and 12-bit ADC, it achieves ±1.2 °C absolute accuracy - exceeding ISO 26262 ASIL-B thermal monitoring requirements.

Can this module be mounted directly to a cold plate without thermal interface material?

No. The AlN baseplate requires a thermally conductive interface material (e.g., 0.1 mm silicone grease or phase-change pad) to achieve the specified R_th,j-h = 0.46–0.55 K/W. Dry mounting increases thermal resistance by ≥40 % and risks localized hot spots exceeding 150 °C under 150 A load.

Is PressFIT insertion force compatible with automated pick-and-place equipment?

Yes. The signal pins require 20–50 N insertion force per pin (per Table 2), matching standard automotive-grade press-fit tooling. Pin geometry complies with DIN 41612 and IPC-7351B, enabling compatibility with Fuji CP7, Mycronic MYPro, and ASM SIPLACE placement systems.