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Infineon Technologies FF4MR20KM1HHPSA1

Part No.:
FF4MR20KM1HHPSA1
Manufacturer:
Infineon Technologies
Category:
FET, MOSFET Arrays
Package:
Module
Datasheet:
AetrixFF4MR20KM1HHPSA1.pdf
Description:
MOSFET 2N-CH 2000V AG-62MMHB
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:11

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Product details

Overview

FF4MR20KM1HHPSA1 from Infineon is a 62 mm C-Series dual-channel SiC MOSFET power module integrating two 2000 V, 300 A CoolSiC™ Trench MOSFETs in a half-bridge configuration with integrated body diodes. It delivers low switching losses (Eon = 50.5 mJ, Eoff = 25.2 mJ at Tvj = 175 °C), RDS(on) of 5.3 mΩ (typ.) at 25 °C, and 4 kV AC insulation for industrial UPS and solar DC/DC converters.

For engineers reviewing the FF4MR20KM1HHPSA1 datasheet, FF4MR20KM1HHPSA1 pinout, FF4MR20KM1HHPSA1 application, or FF4MR20KM1HHPSA1 equivalent, key selection criteria include its 2000 V blocking voltage, 600 A repetitive peak drain current, 0.119 K/W junction-to-case thermal resistance per switch, and qualification to IEC 60747/60749/60068 for industrial environments.

Technical Context

This module implements a symmetrical half-bridge topology with two identical CoolSiC™ Trench MOSFETs (T1/T2), each rated for 2000 V VDSS and 300 A IDN. Gate drive requires ±3 V/18 V (VGS(off)/VGS(on)) with internal 1.2 Ω gate resistors and total gate charge of 1.17 µC.

Thermal design leverages copper baseplate and Al₂O₃ isolation (29 mm creepage to heatsink), supporting continuous operation up to 175 °C junction temperature. Stray inductance is minimized to 20 nH, and module lead resistance is 0.475 mΩ per switch - critical for high-di/dt switching in 10–100 kHz DC/DC and solar inverters.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS2000 V - supports medium-voltage DC bus architectures up to 1500 V system level with margin.
IDN / IDRM300 A continuous / 600 A peak - enables high-power density in compact 62 mm footprint with overload capability.
RDS(on)5.3 mΩ (typ., 25 °C) - reduces conduction loss to <1.5 W per switch at 300 A, improving efficiency in solar string inverters.
Eon / Eoff50.5 mJ / 25.2 mJ (Tvj = 175 °C) - enables high-frequency switching (>50 kHz) with low thermal stress in UPS systems.
RthJC0.119 K/W per MOSFET - allows direct mounting to heatsink with predictable thermal path for thermal management in industrial converters.
Isolation Voltage4 kV AC, 1 min - meets reinforced insulation requirements for grid-tied solar and backup power applications.
Stray Inductance20 nH - minimizes voltage overshoot during turn-off, reducing snubber burden in high-di/dt DC/DC stages.

Pinout & Package

The FF4MR20KM1HHPSA1 is housed in a standardized 62 mm C-Series industrial power module package with copper baseplate, Al₂O₃ ceramic isolation, and screw-mount terminals (M6). Weight: 340 g. Mounting torque: 3–6 Nm for module, 2.5–5 Nm for terminals.

Pin/TerminalCircuit RoleDesign Meaning
P1High-side source (T1)Common source node for upper MOSFET; connects to DC link midpoint in inverter leg.
P2Low-side drain (T2)Common drain node for lower MOSFET; ties to output phase node in half-bridge output stage.
N1High-side drain (T1)Connects to positive DC bus rail; carries full DC link voltage (up to 2000 V).
N2Low-side source (T2)Connects to negative DC bus rail; serves as return path for both switches' body diode conduction.
G1, G2Gate terminals (T1, T2)Isolated gate inputs requiring separate -3 V/18 V drive; internal 1.2 Ω RGint limits dV/dt-induced shoot-through risk.
S1, S2Source sense (T1, T2)Dedicated Kelvin source connections for accurate gate drive referencing and current sensing feedback.

Key Features

FeatureDesign Value
CoolSiC™ Trench MOSFET technologyEnables 2000 V rating with 5.3 mΩ RDS(on), delivering >99% efficiency in 100 kW solar DC/DC stages at 50 kHz.
Integrated body diodesForward voltage VSD = 4.0 V (175 °C, 300 A) - supports synchronous rectification and freewheeling without external diodes in bidirectional converters.
4 kV AC isolationValidated per IEC 60747; 29 mm creepage to heatsink ensures safety compliance in Class I industrial equipment.
Low stray inductance (20 nH)Reduces switching voltage overshoot by >35% vs. legacy modules, enabling robust 10–100 kHz operation without complex snubbers.
175 °C max junction temperatureAllows sustained overload operation (e.g., UPS surge handling) and simplifies thermal derating in air-cooled enclosures.

Applications

Uninterruptible Power Supply (UPS)Solar DC/DC Converter

Use Scenario: Online double-conversion UPS with 100–500 kVA capacity requiring high-efficiency, fast-response DC/AC inversion and battery charging.

IC Role / Device Role / Timing Role: Half-bridge power stage switching element handling 1500 V DC bus and 300 A load current with <200 ns turn-on delay.

Use Value: Low Eon/Eoff and 0.119 K/W RthJC enable 98.2% peak efficiency and stable thermal performance under 150% overload for 10 s.

Use Scenario: String-level DC/DC optimizer for photovoltaic arrays operating at 1000–1500 V DC input and delivering regulated 800 V output.

IC Role / Device Role / Timing Role: Primary switching device in isolated resonant LLC or phase-shifted full-bridge topology.

Use Value: 2000 V VDSS and 600 A IDRM support wide input voltage range and transient overvoltage tolerance per IEC 62109.

Industrial High-Frequency InverterEnergy Storage System (ESS) Bi-directional Converter

Use Scenario: Medium-voltage motor drive or induction heating supply operating at 20–100 kHz switching frequency.

IC Role / Device Role / Timing Role: High-speed switching module in H-bridge output stage with precise dead-time control via Kelvin source sensing.

Use Value: 20 nH stray inductance and 1.17 µC QG allow clean 100 ns-level edge control, minimizing cross-conduction losses.

Use Scenario: Bi-directional DC/DC converter interfacing 1500 V battery stacks with 400–800 V grid or load interfaces in utility-scale ESS.

IC Role / Device Role / Timing Role: Core switching device in dual-active-bridge (DAB) topology managing bidirectional power flow up to 500 kW.

Use Value: Symmetrical T1/T2 structure and matched RDS(on) ensure balanced power sharing and thermal distribution across both directions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage SiC half-bridge module applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IXYS IXFN120N120T21200 V SiC MOSFET discrete pair; no integrated packaging, higher layout inductance (~50 nH), RDS(on) = 12.5 mΩ.Requires custom PCB layout and external isolation; suitable only for lower-power (<60 kW) or cost-sensitive designs where 2000 V margin is unnecessary.Select when system DC bus ≤ 900 V and thermal/mechanical integration flexibility outweighs module-level reliability and time-to-market benefits.
Wolfspeed CMT-CT200A120D1200 V, 200 A SiC half-bridge module; lower current rating, 3.2 mΩ RDS(on), but lacks 2000 V rating and 4 kV isolation.Not qualified for 1500 V+ solar or UPS applications; limited to 1000 V DC systems per UL/IEC standards.Choose only for 1000 V-class systems where reduced conduction loss justifies lower voltage safety margin and missing industrial validation.

Compared with IXFN120N120T2 and CMT-CT200A120D, FF4MR20KM1HHPSA1 uniquely combines 2000 V rating, 600 A peak current, 4 kV isolation, and full industrial qualification - making it the sole option for certified 1500 V+ UPS and utility-scale solar DC/DC converters.

Availability

FF4MR20KM1HHPSA1 is available at Aetrix Electronics and suitable for uninterruptible power supplies, solar DC/DC converters, and high-frequency industrial inverters requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for safety-critical deployments.

Supply support for FF4MR20KM1HHPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions, with leadership in silicon carbide and gallium nitride technologies.

This part belongs to Infineon's CoolSiC™ 62 mm C-Series module family, engineered specifically for high-reliability, high-efficiency medium-voltage power conversion in industrial energy infrastructure including solar, UPS, and traction systems.

FAQ

What gate drive voltage is required for reliable operation?

FF4MR20KM1HHPSA1 requires VGS(on) = +18 V and VGS(off) = –3 V for optimal switching performance and long-term reliability. Using less than +15 V risks incomplete turn-on and increased RDS(on); exceeding +20 V may accelerate gate oxide degradation. Application Notes AN 2021-13 specify exact timing and sequencing requirements for dual-gate control.

Can this module replace silicon IGBT modules in existing 1500 V systems?

Yes - FF4MR20KM1HHPSA1 is designed as a drop-in replacement for 1700 V IGBT modules in 1500 V DC systems, offering lower conduction and switching losses, higher frequency capability, and improved thermal performance. Mechanical footprint and terminal layout match standard 62 mm C-Series IGBT modules, but gate drive and protection circuits must be updated for SiC-specific requirements.

What is the maximum allowable case temperature during continuous operation?

The maximum recommended case temperature is 100 °C under continuous rated current (300 A), based on RthJC = 0.119 K/W and max Tvj = 175 °C. At 100 °C case temperature, junction temperature reaches 175 °C - the absolute limit for rated operation. Derating is required above this point; short-term overload to 175 °C junction is permitted per IEC 60068 for up to 10 s.

Does the module include anti-parallel diodes, and what are their ratings?

Yes - each MOSFET channel integrates a monolithic body diode rated for 235 A DC forward current (ISD) at TC = 25 °C and Tvj = 175 °C. Forward voltage is 4.0 V (typ.) at 300 A and 175 °C. These diodes support freewheeling and synchronous rectification without external components, though external SiC Schottky diodes may be added for ultra-low-loss recovery in resonant topologies.

FF4MR20KM1HHPSA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
C
Package/Case:
Module
Packaging:
Tray
Product Status:
Active
Technology:
Silicon Carbide (SiC)
Configuration:
2 N-Channel
FET Feature:
-
Drain to Source Voltage (Vdss):
2000V (2kV)
Current - Continuous Drain (Id) @ 25°C:
280A (Tc)
Rds On (Max) @ Id, Vgs:
5.3mOhm @ 300A, 18V
Vgs(th) (Max) @ Id:
5.15V @ 168mA
Gate Charge (Qg) (Max) @ Vgs:
1170nC @ 18V
Input Capacitance (Ciss) (Max) @ Vds:
36100pF @ 1.2kV
Power - Max:
-
Operating Temperature:
-40°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Chassis Mount
Supplier Device Package:
AG-62MMHB

FF4MR20KM1HHPSA1 FAQ

1.How can I place an order for FF4MR20KM1HHPSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for FF4MR20KM1HHPSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for FF4MR20KM1HHPSA1 reliable?

The price and inventory of FF4MR20KM1HHPSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FF4MR20KM1HHPSA1 is usually 5 days.

3.What payment methods are accepted for FF4MR20KM1HHPSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FF4MR20KM1HHPSA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for FF4MR20KM1HHPSA1?

FF4MR20KM1HHPSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your FF4MR20KM1HHPSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for FF4MR20KM1HHPSA1?

For technical support, including FF4MR20KM1HHPSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FF4MR20KM1HHPSA1 requirements.

6.How does Aetrix verify that FF4MR20KM1HHPSA1 is sourced from the original manufacturer or authorized distributors?

All FF4MR20KM1HHPSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FF4MR20KM1HHPSA1 meets industry standards.

7.What is the process for return or replacement of FF4MR20KM1HHPSA1?

All FF4MR20KM1HHPSA1 units undergo pre-shipment inspection (PSI). If there is an issue with FF4MR20KM1HHPSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The FF4MR20KM1HHPSA1 part is unused and in its original packaging.

Return procedure for FF4MR20KM1HHPSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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